紡織織物增強(qiáng)形狀記憶聚合物復(fù)合材料熱—力學(xué)行為研究
[Abstract]:Shape memory polymer can return from temporary morphology to initial form under external excitation. It is a new functional material with shape memory effect. The main disadvantages of shape memory polymer are low strength, low stiffness, weak recovery force and so on, which seriously affect its practical application. By using the method of textile fabric reinforcement, these shortcomings can be obviously improved, and the in-plane properties and out-of-plane properties of composite materials can be effectively uniform. At present, there is little research on thermal-mechanical behavior of textile fabric reinforced shape memory polymer composites (textile SMPCs). The main work of this paper is as follows: firstly, the multi-scale mechanical model of textile SMPCs is established. According to the meso-structure of three-dimensional woven composites, a new modeling method is proposed. The three-dimensional woven SMPCs parametric meso-structure model is established with yarn density and yarn filling factor as the main parameters. Secondly, the shape memory properties of planar woven SMPCs were studied, and the effects of tensile modulus and bending modulus of fabric reinforced layer on its thermal cycle were analyzed. The plane woven SMPCs is divided into five layers in the thickness direction, and the effect of paving position on its thermal-mechanical behavior is studied. The results show that the shape memory performance of plane woven SMPCs is only related to the bending modulus in pure bending state, and the shape fixation rate and recovery force of the fabric are improved by being on the tensile side. Thirdly, based on the multi-scale model, through the Viscoelastic parameters of the matrix and the elastic constant of the fiber, the three-dimensional thermal Viscoelastic Constitutive relation of the yarn is derived, and the method of compiling the subprogram of the orthotropic Viscoelastic material Abaqus is given. The effects of external load and meso-structure on the equivalent thermal Viscoelastic properties of three-dimensional woven SMPCs meso-unit cells were studied. Finally, based on the study of thermal Viscoelastic properties, the shape memory behavior of 3D woven SMPCs is analyzed, two kinds of thermal cycles, free recovery and constrained recovery, are simulated, and the effects of external load and weaving parameters on their memory performance are studied.
【學(xué)位授予單位】:南京航空航天大學(xué)
【學(xué)位級別】:碩士
【學(xué)位授予年份】:2017
【分類號】:TB332
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