【摘要】：本文通過實驗的方法,研究了將雙連續(xù)相形態(tài)高聚物作為基體時,此種導熱材料的形成條件和制備工藝。與此同時,研究了組分比和導熱微粒添加量等因素對共混高聚物相態(tài)結構、各項性能的影響。通過實驗研究來對比分析的方法,然后,對具有特殊雙連續(xù)相結構的多層疊加復合導熱高聚物進行實驗探究。對比分析組分比和導熱微粒添加量等因素對復合高聚物各項性能的影響程度。最后,通過三維建模模擬仿真和實驗探究的方法,研究了利用導熱高聚物材料作為加工原料,制備全塑CPU散熱器的可行性,探究了翅片上帶有的微結構和原材料的導熱系數(shù)等因素對翅片散熱能力的影響。結果表明：1、PP/HIPS共混高聚物的雙連續(xù)相形態(tài)存在于HIPS質(zhì)量分數(shù)在40-60wt%之間。復合材料中兩種高聚物的組分含量,對共混高聚物的相態(tài)形式的影響是非常顯著的。通過分析溶劑萃取實驗得到的連續(xù)相系數(shù)變化圖,同樣說明HIPS含量在40%-60%的范圍內(nèi),體系中的兩相形成相互貫穿的雙連續(xù)相形態(tài)即海-海形結構。2、高聚物的力學性能可以用來判斷高聚物的相態(tài)形式。通過分析拉伸強度與HIPS含量的關系曲線,發(fā)現(xiàn)共混材料在HIPS含量在30%-60%附近形成雙連續(xù)相結構。然后,繼續(xù)分析彎曲強度、沖擊強度兩種力學性能與HIPS含量關系曲線,發(fā)現(xiàn)HIPS含量在30%一70%范圍內(nèi)時,共混材料在此范圍內(nèi)形成了雙連續(xù)相結構。共混高聚物的熔體流動速率與HIPS含量有很大的關系,當HIPS含量逐漸增多時,熔體流動速率首先是逐漸變大的,到達一定程度后,又變?yōu)橹饾u減小。兩種材料進行共混,特別是HIPS的含量在30%-60%的范圍內(nèi),有利于材料的成型加工。3、共混材料里AlN填料是填充在PP中的,并通過EDS驗證了A1N分布在PP中。通過對PP-AIN/HIPS復合材料的電鏡照片進行分析,發(fā)現(xiàn)雙連續(xù)相結構存在于HIPS質(zhì)量分數(shù)在40-55wt%之間。在復合高聚物中添加A1N導熱微粒后,雙連續(xù)相形式的實現(xiàn)范圍變小。通過分析溶劑萃取實驗得到的連續(xù)相系數(shù)曲線,其結果同樣證明在復合材料中加入A1N導熱填料后,形成雙連續(xù)相結構的范圍變小。連續(xù)性較好的雙連續(xù)相形態(tài)存在于HIPS的質(zhì)量含量為40%-55%范圍內(nèi)。4、兩種高聚物多層疊加形式的材料拉伸性能優(yōu)于同組分的共混材料。實驗發(fā)現(xiàn)隨著層數(shù)的增多,多層疊加形式高聚物的拉伸性能會不斷變好。當多層疊加形式與普通共混高聚物的組分比均是PP-石墨/HIPS=3/7時,多層疊加高聚物層數(shù)對其導熱能力的影響很小。多層疊加高聚物的導熱能力優(yōu)于普通共混高聚物,且發(fā)現(xiàn)其導熱系數(shù)基本滿足于其計算公式所得到的結果。多層疊加高聚物的拉伸性能優(yōu)于普通共混高聚物,多層復合材料在特定方向上導熱性能優(yōu)異,而共混材料則在三維方向上導熱性能基本是各向同性的。5、帶有結構的CPU散熱器翅片,散熱能力顯著優(yōu)于沒有結構的平板翅片。各種微結構翅片的散熱能力大小依次是矩形微結構翅片最優(yōu),其次是半圓微結構翅片,然后是三角形微結構翅片。當矩形結構高度是0.4mm,寬度是0.5mm時,微結構之間的距離為0.5mm時,翅片的散熱能力較好。高聚物的導熱系數(shù)小于8 W·(m·K)-1時,隨著高聚物導熱系數(shù)的增大,CPU的最高溫度降低迅速；當高聚物的導熱系數(shù)超過8 W·(m·K)-1后,隨著高聚物導熱系數(shù)的不斷變大,CPU最高溫度減小并不明顯。加工散熱器翅片的導熱高聚物材料的導熱系數(shù)選擇在8W·(m·K)-1附近時,翅片可以達到較好的散熱性能。
[Abstract]:In this paper, the forming conditions and the preparation process of the heat-conducting material are studied by the method of the experiment. At the same time, the influence of the component ratio and the addition of the heat-conductive particles on the phase structure and various properties of the blended polymer was studied. In this paper, the method of comparative analysis is carried out by experimental research, and then the multi-layer superposed composite heat-conducting polymer with special double-continuous phase structure is investigated. The influence of the component ratio and the addition of the heat-conductive particles on the properties of the composite polymer was compared. Finally, by means of three-dimensional modeling and simulation and experimental investigation, the feasibility of using the heat-conductive high-polymer material as a raw material to prepare the whole-plastic CPU radiator is studied, and the influence of the factors such as the microstructure on the fins and the thermal conductivity of the raw materials on the heat radiation ability of the fins is investigated. The results show that the double-continuous phase morphology of 1, PP/ HIPS blend is in the range of 40-60 wt%. The effect of the component content of the two polymers in the composite is very significant. Through the analysis of the change of the continuous phase coefficient obtained by the solvent extraction experiment, it is also explained that the content of the HIPS is in the range of 40% to 60%, and the two phases in the system form a two-continuous phase, that is, the sea-sea-shaped structure which is penetrated by the two phases, and the mechanical property of the high polymer can be used to judge the phase state of the high polymer. Through the analysis of the relationship between the tensile strength and the HIPS content, the double-continuous phase structure was found to be in the vicinity of 30% to 60% of the HIPS content. Then, the relationship between the mechanical properties of the bending strength and the impact strength and the HIPS content was analyzed, and the content of HIPS was found to be within the range of 30% to 70%. The melt flow rate of the blended polymer has a great relationship with the HIPS content, and when the HIPS content is increasing, the melt flow rate is gradually increased, reaching a certain degree, and gradually decreasing. The blending of the two materials, in particular the content of HIPS in the range of 30% to 60%, is beneficial to the forming and processing of the material. Through the analysis of the electron microscope photograph of the PP-AIN/ HIPS composite, it is found that the double-continuous phase structure is in the range of 40-55 wt% of the HIPS. After the addition of the A1N heat-conducting particles in the composite polymer, the implementation range of the two continuous phase forms is small. Through the analysis of the continuous phase coefficient curve from the solvent extraction experiment, the results also show that after the A1N heat-conducting filler is added into the composite material, the range of forming the double-continuous phase structure is reduced. The two continuous phase forms with good continuity exist in the range of 40% -55% of the HIPS. The experimental results show that, with the increase of the number of layers, the tensile properties of the high polymer in the multi-layer superimposed form will be better. When the component ratio of the multi-layer superimposed polymer and the common blend is PP-graphite/ HIPS = 3/7, the effect of the number of layers on the thermal conductivity of the multi-layer stacked polymer is very small. The thermal conductivity of the multi-layer superimposed polymer is superior to that of the common blended polymer, and the thermal conductivity of the high polymer is found to be basically satisfied with the results obtained by the calculation formula. the tensile property of the multi-layer composite polymer is superior to that of the common blended polymer, the thermal conductivity of the multi-layer composite material in a specific direction can be excellent, and the blend material can be basically isotropic in the three-dimensional direction, The heat dissipation capability is obviously better than that of the flat plate with no structure. The heat dissipation capacity of the various microstructure fins is in turn the optimal of the rectangular microstructure fins, and the second is a semi-circular microstructure fin, and then is a triangular micro-structured fin. When the height of the rectangular structure is 0.4 mm and the width is 0.5 mm, the heat dissipation capacity of the fins is good when the distance between the microstructures is 0.5 mm. When the thermal conductivity of the high polymer is less than 8W 路 (m 路 K) -1, with the increase of the thermal conductivity of the high polymer, the maximum temperature of the CPU is reduced rapidly; when the thermal conductivity of the high polymer exceeds 8 W 路 (m 路 K) -1, the thermal conductivity of the high polymer increases continuously. The maximum CPU temperature is not significant. When the heat-conducting coefficient of the heat-conducting high-polymer material for processing the radiator fins is selected to be around 8W 路 (m 路 K) -1, the fins can achieve better heat-dissipation performance.
【學位授予單位】：北京化工大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TB33

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本文編號：2492407