【摘要】：隨著現(xiàn)代工業(yè)技術(shù)的迅猛發(fā)展以及人們對(duì)銅及其合金的性能要求的不斷提高,傳統(tǒng)的銅合金已經(jīng)不足以滿足人們的需要,而銅基復(fù)合材料的出現(xiàn)打破了合金性能的局限。碳納米管(CNTs)因其獨(dú)特的結(jié)構(gòu)和性能,被視為銅基復(fù)合材料的理想增強(qiáng)體材料,但碳納米管易團(tuán)聚不易分散,因而解決其與銅復(fù)合時(shí)的分散和界面結(jié)合問(wèn)題才能提高復(fù)合材料的最終性能。本文通過(guò)對(duì)CNTs進(jìn)行表面化學(xué)預(yù)處理和表面化學(xué)鍍,機(jī)械球磨制備復(fù)合粉體,最后經(jīng)模壓成形和真空氣氛燒結(jié),制得碳納米管銅基復(fù)合材料,研究了球磨轉(zhuǎn)速、球磨時(shí)間和CNTs質(zhì)量分?jǐn)?shù)對(duì)CNTs與銅粉的復(fù)合粉體分散性的影響以及鍍銅CNT質(zhì)量分?jǐn)?shù)對(duì)碳納米管銅基復(fù)合材料的力學(xué)、電學(xué)、組織性能等的影響。又通過(guò)計(jì)算機(jī)數(shù)值模擬研究了碳納米管銅基復(fù)合材料發(fā)生塑性變形時(shí)內(nèi)部碳納米管的定向排列或者定向分布問(wèn)題。得出以下結(jié)論：(1)實(shí)驗(yàn)采用化學(xué)鍍的方法在碳納米管表面鍍銅,以改善碳納米管的潤(rùn)濕性和界面結(jié)合性。在CNTs化學(xué)鍍銅前,對(duì)CNTs進(jìn)行預(yù)處理,通過(guò)純化和氧化來(lái)改善CNTs的分散性,又通過(guò)敏化處理和活化處理增加CNTs上的活性點(diǎn)。實(shí)驗(yàn)選擇的化學(xué)鍍溫度為80℃,pH值為12.5。經(jīng)化學(xué)鍍銅處理后可以在碳納米管表面獲得一層均勻的納米銅顆粒沉積。(2)機(jī)械球磨的最佳實(shí)驗(yàn)條件為：轉(zhuǎn)速350 r/min、時(shí)間2小時(shí)。復(fù)合材料的硬度隨CNTs質(zhì)量分?jǐn)?shù)的增加先增大后減小,質(zhì)量分?jǐn)?shù)0.75%左右硬度最佳,相對(duì)于粉末冶金純銅提高了11%。隨著CNTs質(zhì)量分?jǐn)?shù)的增加,其密度和致密度不斷減小,導(dǎo)電性也不斷降低,0.75%時(shí),電導(dǎo)率為45.24 MS/m,相對(duì)與粉末冶金純銅僅降低了7%。添加質(zhì)量分?jǐn)?shù)為0.75%的鍍銅碳納米管制備的銅基復(fù)合材料兼具良好電性能和優(yōu)異的力學(xué)性能。(3)碳納米管銅基復(fù)合材料發(fā)生塑性變形后,碳納米管在基體分布隨之發(fā)生變化,碳納米管的彎曲程度有所減小�；瘜W(xué)鍍銅與粉末冶金相結(jié)合,可以有效改善復(fù)合材料的最終性能,是開(kāi)發(fā)高性能銅基復(fù)合材料的有效方法。而計(jì)算機(jī)仿真模擬CNTs的定向排列對(duì)制備高強(qiáng)度高導(dǎo)電的理想復(fù)合材料具有良好的指引作用。
[Abstract]:With the rapid development of modern industrial technology and the continuous improvement of the performance requirements of copper and its alloys, the traditional copper alloys are no longer enough to meet the needs of people, and the emergence of copper matrix composites has broken the limitations of alloy properties. Carbon nanotube (CNT) (CNTs) is regarded as an ideal reinforcement material for copper matrix composites because of its unique structure and properties, but CNT is easy to agglomeration and difficult to disperse. Therefore, the final properties of the composites can be improved only by solving the dispersion and interface bonding problems when they are combined with copper. In this paper, the composite powder was prepared by surface chemical pretreatment and surface chemical plating of CNTs, and the composite powder was prepared by mechanical ball milling. Finally, the carbon nanotube copper matrix composites were prepared by molding and vacuum atmosphere sintering, and the rotating speed of ball milling was studied. The effect of ball milling time and CNTs mass fraction on the dispersion of CNTs and copper powder composite powder and the effect of copper plating CNT mass fraction on the mechanics, electricity, microstructure and properties of carbon nanotube copper matrix composites. The directional arrangement or directional distribution of carbon nanotubes during plastic deformation of carbon nanotube copper matrix composites was studied by computer numerical simulation. The conclusions are as follows: (1) Electroless plating of copper on the surface of carbon nanotubes was used to improve the wettability and interfacial adhesion of carbon nanotubes. Before CNTs chemical copper plating, CNTs was pretreated, the dispersion of CNTs was improved by purification and oxidation, and the active point on CNTs was increased by sensitizing treatment and activation treatment. The experimental results show that the temperature of Electroless plating is 80 鈩，

本文編號(hào)：2488125