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套管封裝相變材料準(zhǔn)穩(wěn)態(tài)傳熱模型研究

發(fā)布時間:2019-03-19 21:41
【摘要】:本文建立了套管封裝相變材料的準(zhǔn)穩(wěn)態(tài)簡化傳熱模型,對定溫邊界條件下相變套管凝固、熔化過程的傳熱特性進(jìn)行了模擬分析。進(jìn)一步將準(zhǔn)穩(wěn)態(tài)簡化模型的模擬結(jié)果與套管封裝相變材料CFD數(shù)值傳熱模型的計算結(jié)果進(jìn)行對比分析。結(jié)果表明,在相變過程中,準(zhǔn)穩(wěn)態(tài)簡化模型計算的套管內(nèi)工質(zhì)(不流動)的溫度與通過內(nèi)、外套管表面熱流及其變化趨勢與數(shù)值計算結(jié)果一致,溫度平均誤差小于0.5℃,熱流平均誤差小于10%,模型準(zhǔn)確性較好。準(zhǔn)穩(wěn)態(tài)簡化傳熱模型的計算時間不到數(shù)值模型計算時長的1%,計算效率高,易于嵌入建筑熱濕軟件包進(jìn)行集成模擬分析。
[Abstract]:In this paper, a simplified quasi-steady-state heat transfer model for casing packaging phase change materials is established, and the heat transfer characteristics of phase change casing solidification and melting under constant temperature boundary conditions are simulated and analyzed. Furthermore, the simulation results of the simplified quasi-steady state model and the numerical heat transfer model of the casing package phase change material (CFD) are compared and analyzed. The results show that, in the process of phase transition, the temperature of the working fluid (non-flow) calculated by the quasi-steady-state simplified model is in agreement with that of the inner casing and the heat flux on the surface of the casing and its variation trend is consistent with the numerical results, and the average temperature error is less than 0.5 鈩,

本文編號:2443927

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