【摘要】：正達(dá)邁科技的研發(fā)團(tuán)隊(duì)開發(fā)出一款新型超薄PI膜(厚度1~5μm)Skin Tran,可應(yīng)用于超薄型覆蓋膜及軟性銅箔基層板,在維持原有制程并控制良好的成本效益下,完成輕量化、低反彈力軟板之制造。另外,延續(xù)2016 TPCA展出的毫米結(jié)構(gòu)識別PI膜(tPI),達(dá)邁科技在2017年藉由獨(dú)特的PI制模技術(shù),開發(fā)出具有微米結(jié)構(gòu)的PI機(jī)能膜材。在顯示與照明領(lǐng)域中,可提供做為光學(xué)擴(kuò)散及增亮的用途。
[Abstract]:The R & D team of Zhengdamai Technology has developed a new ultra-thin PI film (1 ~ 5 渭 m) Skin Tran, thickness) which can be used in ultra-thin covering film and soft copper foil base plate, which can be lightweight under the condition of maintaining the original process and controlling the cost efficiency. Manufacturing of soft plates with low rebound strength. In addition, the millimeter structure recognition PI film (tPI), Damai Technology, which continues to be on display at 2016 TPCA, developed the PI functional membrane with micron structure in 2017 with the unique PI moulding technology. In the field of display and lighting, it can be used for optical diffusion and enhancement.
【分類號】：TB383.2
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本文編號：2410102