【摘要】：微納米刻劃是測試薄膜、涂層和聚合物等材料抗摩擦磨損性的重要手段，也是加工微納米器件結構的重要方法。材料的宏觀性能是由其內部微觀力學行為所決定的，并且刻劃過程中試樣在探針強大的耦合作用下，亞表面層材料會產生相變、塑性變形、位錯和斷裂等不同微觀力學行為。納米刻劃過程中的這些力學行為對材料力學性能測試結果和刻劃加工溝槽質量有重要聯系。因而，如何提高材料的可加工性和材料性能保持性成為研究微納米刻劃過程研究的關鍵。同時，材料在刻劃加工過程中會受到材料表面性質和刻劃工藝參數等方面因素影響。 因此，針對以上問題，本文討論了不同加工條件和不同表面狀態(tài)對刻劃加工溝槽質量的影響，用壓入測試比較了單晶硅不同晶面和在不同壓入溫度下的硬度；為驗證前文的仿真以及突破對國外進口微納米刻劃測試儀器的依賴，，本文設計了微納米刻劃測試裝置，開展了相應的制造、集成、檢測調試和針對典型材料的刻劃試驗。具體內容表現在如下幾個方面： （1）建立了典型材料無氧銅的光滑粒子流模型，設定了光滑粒子流模型的模擬參數；針對表面殘余應力對刻劃加工溝槽的影響，本文對無氧銅切削表面和完整表面進行了仿真。通過對比，分析了殘余應力對刻劃切屑、刻劃加工溝槽質量和刻劃力的影響。 （2）提出了多針刻劃的新刻劃方法，建立了單晶銅的傳統(tǒng)單針連續(xù)刻劃和雙針刻劃的分子動力學模型，并設定了分子動力學模擬參數。通過對比不同刻劃進給量、刻劃深度和刻劃晶向下多針刻劃與傳統(tǒng)單針刻劃創(chuàng)成的溝槽表面質量，Von Mise應力分布和切向、側向刻劃力。通過仿真對比，雙針刻劃方法不但能提高材料刻劃加工的溝槽質量，還能提高材料加工效率。 （3）建立了單晶硅的壓入測試分子動力學模型，并結合晶體缺陷分析技術、晶體結構和納米力學理論分析了納米壓入過程中金剛石壓針下方亞表面層單晶硅的相變過程。對比了單晶硅壓入階段三個晶面的靜水壓力、相變原子數、載荷-位移曲線和Von Mise應力，建立了單晶硅宏觀硬度和微觀相變、塑性變形之間的聯系。針對刻劃過程中的摩擦熱，本文研究了壓痕溫度對單晶硅硬度的影響，并解釋了壓痕卸載階段單晶硅的粘連行為。 （4）在仿真分析基礎上，本文提出了一種可與奧林巴斯顯微鏡集成的臥式結構微納米刻劃測試裝置。利用雙剪切梁結構和八片應變片設計了二軸微力傳感器，并對其進行了校核計算，標定解耦分析和靜態(tài)特性分析。本文對該裝置的關鍵部件如精密驅動單元、精密檢測單元和整機進行了有限元靜力學分析，并分析了該裝置的誤差來源和整機性能。最后，利用自制的裝置開展了單晶硅和單晶銅在不同刻劃深度下的刻劃試驗，分析了單晶硅和單晶銅刻劃去除機理，以及刻劃深度對兩種材料加工溝槽質量的影響。
[Abstract]:Micro-nano characterization is an important means of testing the friction and wear resistance of thin films, coatings and polymers, and is also an important method of fabricating the structures of micro / nano devices. The macroscopical properties of the material are determined by its internal micromechanical behavior. In the process of characterization, different micromechanical behaviors such as phase transition, plastic deformation, dislocation and fracture will occur in the subsurface layer material under the strong coupling of the probe. These mechanical behaviors are related to the mechanical properties of materials and the quality of grooves. Therefore, how to improve the processability and performance retention of materials has become the key to the study of micro-nano characterization process. At the same time, the material is affected by the surface properties and process parameters. Therefore, the effects of different processing conditions and different surface states on the quality of grooves are discussed, and the hardness of monocrystalline silicon in different crystal planes and at different indentation temperatures is compared by indentation test. In order to verify the above simulation and break through the dependence on imported micro-nano-scale test instruments, this paper designs a micro-nano profiling testing device, and develops the corresponding manufacturing, integration, testing and debugging, as well as characterization tests for typical materials. The specific contents are as follows: (1) the smooth particle flow model of typical material oxygen free copper is established, and the simulation parameters of the smooth particle flow model are set up, and the influence of surface residual stress on the marking of grooves is discussed. In this paper, the cutting surface and the complete surface of oxygen free copper are simulated. Through comparison, the influence of residual stress on chip, grooves quality and scratching force is analyzed. (2) A new method of multi-needle scratching is proposed. The molecular dynamics models of single crystal copper with single needle continuous characterization and double needle delineation were established and the molecular dynamics simulation parameters were set up. The surface quality of grooves generated by different feed rates, depth and grain down and conventional single needle are compared. The distribution of Von Mise stress, tangential force and lateral force are obtained by comparing the surface quality of grooves created by conventional single needle method. By simulation and comparison, the double-needle method can not only improve the groove quality of material marking, but also improve the processing efficiency of material. (3) the molecular dynamics model of single crystal silicon indentation test is established, and the crystal defect analysis technique is combined. The crystal structure and nanomechanical theory were used to analyze the phase transition process of monocrystalline silicon under diamond pin in the process of nanocrystalline indentation. The hydrostatic pressure, atomic number of phase transition, load-displacement curve and Von Mise stress of three crystal planes in the process of single crystal silicon indentation are compared. The relationship between macro hardness and micro phase transformation and plastic deformation of single crystal silicon is established. In this paper, the effect of indentation temperature on the hardness of monocrystalline silicon is studied, and the adhesion behavior of monocrystalline silicon during indentation unloading is explained. (4) on the basis of simulation analysis, In this paper, a kind of horizontal structure micro-nano scribing testing device which can be integrated with Olympus microscope is presented. A two-axis micro-force sensor was designed using a two-shear beam structure and eight strain gauges, and its calibration, decoupling analysis and static characteristic analysis were carried out. In this paper, the finite element statics analysis of the key parts of the device, such as precision drive unit, precision detection unit and the whole machine, is carried out, and the error source and performance of the device are analyzed. Finally, the experiments of single crystal silicon and single crystal copper at different scratching depths were carried out by using a self-made device. The removal mechanism of single crystal silicon and single crystal copper as well as the effect of etching depth on the grooves quality of the two materials were analyzed.
【學位授予單位】：吉林大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TB383.1

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