【摘要】：微納米刻劃是測(cè)試薄膜、涂層和聚合物等材料抗摩擦磨損性的重要手段，也是加工微納米器件結(jié)構(gòu)的重要方法。材料的宏觀性能是由其內(nèi)部微觀力學(xué)行為所決定的，并且刻劃過程中試樣在探針強(qiáng)大的耦合作用下，亞表面層材料會(huì)產(chǎn)生相變、塑性變形、位錯(cuò)和斷裂等不同微觀力學(xué)行為。納米刻劃過程中的這些力學(xué)行為對(duì)材料力學(xué)性能測(cè)試結(jié)果和刻劃加工溝槽質(zhì)量有重要聯(lián)系。因而，如何提高材料的可加工性和材料性能保持性成為研究微納米刻劃過程研究的關(guān)鍵。同時(shí)，材料在刻劃加工過程中會(huì)受到材料表面性質(zhì)和刻劃工藝參數(shù)等方面因素影響。 因此，針對(duì)以上問題，本文討論了不同加工條件和不同表面狀態(tài)對(duì)刻劃加工溝槽質(zhì)量的影響，用壓入測(cè)試比較了單晶硅不同晶面和在不同壓入溫度下的硬度；為驗(yàn)證前文的仿真以及突破對(duì)國(guó)外進(jìn)口微納米刻劃測(cè)試儀器的依賴，，本文設(shè)計(jì)了微納米刻劃測(cè)試裝置，開展了相應(yīng)的制造、集成、檢測(cè)調(diào)試和針對(duì)典型材料的刻劃試驗(yàn)。具體內(nèi)容表現(xiàn)在如下幾個(gè)方面： （1）建立了典型材料無氧銅的光滑粒子流模型，設(shè)定了光滑粒子流模型的模擬參數(shù)；針對(duì)表面殘余應(yīng)力對(duì)刻劃加工溝槽的影響，本文對(duì)無氧銅切削表面和完整表面進(jìn)行了仿真。通過對(duì)比，分析了殘余應(yīng)力對(duì)刻劃切屑、刻劃加工溝槽質(zhì)量和刻劃力的影響。 （2）提出了多針刻劃的新刻劃方法，建立了單晶銅的傳統(tǒng)單針連續(xù)刻劃和雙針刻劃的分子動(dòng)力學(xué)模型，并設(shè)定了分子動(dòng)力學(xué)模擬參數(shù)。通過對(duì)比不同刻劃進(jìn)給量、刻劃深度和刻劃晶向下多針刻劃與傳統(tǒng)單針刻劃創(chuàng)成的溝槽表面質(zhì)量，Von Mise應(yīng)力分布和切向、側(cè)向刻劃力。通過仿真對(duì)比，雙針刻劃方法不但能提高材料刻劃加工的溝槽質(zhì)量，還能提高材料加工效率。 （3）建立了單晶硅的壓入測(cè)試分子動(dòng)力學(xué)模型，并結(jié)合晶體缺陷分析技術(shù)、晶體結(jié)構(gòu)和納米力學(xué)理論分析了納米壓入過程中金剛石壓針下方亞表面層單晶硅的相變過程。對(duì)比了單晶硅壓入階段三個(gè)晶面的靜水壓力、相變?cè)訑?shù)、載荷-位移曲線和Von Mise應(yīng)力，建立了單晶硅宏觀硬度和微觀相變、塑性變形之間的聯(lián)系。針對(duì)刻劃過程中的摩擦熱，本文研究了壓痕溫度對(duì)單晶硅硬度的影響，并解釋了壓痕卸載階段單晶硅的粘連行為。 （4）在仿真分析基礎(chǔ)上，本文提出了一種可與奧林巴斯顯微鏡集成的臥式結(jié)構(gòu)微納米刻劃測(cè)試裝置。利用雙剪切梁結(jié)構(gòu)和八片應(yīng)變片設(shè)計(jì)了二軸微力傳感器，并對(duì)其進(jìn)行了校核計(jì)算，標(biāo)定解耦分析和靜態(tài)特性分析。本文對(duì)該裝置的關(guān)鍵部件如精密驅(qū)動(dòng)單元、精密檢測(cè)單元和整機(jī)進(jìn)行了有限元靜力學(xué)分析，并分析了該裝置的誤差來源和整機(jī)性能。最后，利用自制的裝置開展了單晶硅和單晶銅在不同刻劃深度下的刻劃試驗(yàn)，分析了單晶硅和單晶銅刻劃去除機(jī)理，以及刻劃深度對(duì)兩種材料加工溝槽質(zhì)量的影響。
[Abstract]:Micro-nano characterization is an important means of testing the friction and wear resistance of thin films, coatings and polymers, and is also an important method of fabricating the structures of micro / nano devices. The macroscopical properties of the material are determined by its internal micromechanical behavior. In the process of characterization, different micromechanical behaviors such as phase transition, plastic deformation, dislocation and fracture will occur in the subsurface layer material under the strong coupling of the probe. These mechanical behaviors are related to the mechanical properties of materials and the quality of grooves. Therefore, how to improve the processability and performance retention of materials has become the key to the study of micro-nano characterization process. At the same time, the material is affected by the surface properties and process parameters. Therefore, the effects of different processing conditions and different surface states on the quality of grooves are discussed, and the hardness of monocrystalline silicon in different crystal planes and at different indentation temperatures is compared by indentation test. In order to verify the above simulation and break through the dependence on imported micro-nano-scale test instruments, this paper designs a micro-nano profiling testing device, and develops the corresponding manufacturing, integration, testing and debugging, as well as characterization tests for typical materials. The specific contents are as follows: (1) the smooth particle flow model of typical material oxygen free copper is established, and the simulation parameters of the smooth particle flow model are set up, and the influence of surface residual stress on the marking of grooves is discussed. In this paper, the cutting surface and the complete surface of oxygen free copper are simulated. Through comparison, the influence of residual stress on chip, grooves quality and scratching force is analyzed. (2) A new method of multi-needle scratching is proposed. The molecular dynamics models of single crystal copper with single needle continuous characterization and double needle delineation were established and the molecular dynamics simulation parameters were set up. The surface quality of grooves generated by different feed rates, depth and grain down and conventional single needle are compared. The distribution of Von Mise stress, tangential force and lateral force are obtained by comparing the surface quality of grooves created by conventional single needle method. By simulation and comparison, the double-needle method can not only improve the groove quality of material marking, but also improve the processing efficiency of material. (3) the molecular dynamics model of single crystal silicon indentation test is established, and the crystal defect analysis technique is combined. The crystal structure and nanomechanical theory were used to analyze the phase transition process of monocrystalline silicon under diamond pin in the process of nanocrystalline indentation. The hydrostatic pressure, atomic number of phase transition, load-displacement curve and Von Mise stress of three crystal planes in the process of single crystal silicon indentation are compared. The relationship between macro hardness and micro phase transformation and plastic deformation of single crystal silicon is established. In this paper, the effect of indentation temperature on the hardness of monocrystalline silicon is studied, and the adhesion behavior of monocrystalline silicon during indentation unloading is explained. (4) on the basis of simulation analysis, In this paper, a kind of horizontal structure micro-nano scribing testing device which can be integrated with Olympus microscope is presented. A two-axis micro-force sensor was designed using a two-shear beam structure and eight strain gauges, and its calibration, decoupling analysis and static characteristic analysis were carried out. In this paper, the finite element statics analysis of the key parts of the device, such as precision drive unit, precision detection unit and the whole machine, is carried out, and the error source and performance of the device are analyzed. Finally, the experiments of single crystal silicon and single crystal copper at different scratching depths were carried out by using a self-made device. The removal mechanism of single crystal silicon and single crystal copper as well as the effect of etching depth on the grooves quality of the two materials were analyzed.
【學(xué)位授予單位】：吉林大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TB383.1

【參考文獻(xiàn)】

相關(guān)期刊論文 前10條

1 馮志剛;王祁;信太克規(guī);;自確認(rèn)壓力傳感器結(jié)構(gòu)參數(shù)設(shè)計(jì)及其有限元分析[J];傳感技術(shù)學(xué)報(bào);2007年02期

2 李潔;;納米劃痕測(cè)試在材料研究領(lǐng)域的最新進(jìn)展[J];材料導(dǎo)報(bào);2010年S1期

3 劉九卿;提高鋁合金稱重傳感器穩(wěn)定性的幾個(gè)問題[J];衡器;2002年03期

4 李德剛;梁迎春;白清順;;單晶硅各向異性力學(xué)性能納米壓痕實(shí)驗(yàn)研究[J];航空精密制造技術(shù);2008年02期

5 蔣莊德;王海容;;微機(jī)械力學(xué)性能測(cè)試儀[J];河南機(jī)電高等專科學(xué)校學(xué)報(bào);2006年01期

6 梁迎春;盆洪民;白清順;;單晶Cu材料納米切削特性的分子動(dòng)力學(xué)模擬[J];金屬學(xué)報(bào);2009年10期

7 張華麗;張飛虎;;基于Nano Indenter的納米刻劃性能試驗(yàn)研究[J];機(jī)械與電子;2006年03期

8 文玉華,朱如曾,周富信,王崇愚;分子動(dòng)力學(xué)模擬的主要技術(shù)[J];力學(xué)進(jìn)展;2003年01期

9 葛繼平,鄭林,王學(xué)芝,錢鴻鈞;劃痕法測(cè)Ni-P合金鍍層結(jié)合力的研究[J];熱加工工藝;1991年06期

10 劉捍衛(wèi),陳元儒,李曙;沖擊劃痕法測(cè)定 Ni-P 化學(xué)鍍層結(jié)合強(qiáng)度[J];西南交通大學(xué)學(xué)報(bào);1997年03期

相關(guān)博士學(xué)位論文 前1條

1 彭平;基于AFM的微納尺度模板加工技術(shù)研究[D];華中科技大學(xué);2010年

本文編號(hào)：2242518