本文選題：金剛石 + 化學(xué)鍍　； 參考：《青島科技大學(xué)》2015年碩士論文

【摘要】：隨著對(duì)硅晶體材料需求量的日益增加,對(duì)其所提出的加工要求也越來越高。其中電鍍金剛石切割線憑借著高切割效率、高而穩(wěn)定的切片質(zhì)量、高成品率、長使用壽命及低污染等諸多優(yōu)勢,在硅錠的開方、切片以及陶瓷、玻璃、石材等硬脆材料的切割加工領(lǐng)域得到快速發(fā)展,應(yīng)用前景越來越明朗。它作為一種金剛石工具,受到越來越多研究人員的歡迎和關(guān)注,逐步代替?zhèn)鹘y(tǒng)的切割工具而成為硬脆材料加工的一種新的切割工具。本文針對(duì)電鍍金剛石切割線存在的制備周期長以及金剛石表面的鎳磷合金層在鍍液中易受破壞的問題進(jìn)行相應(yīng)試驗(yàn)方法來進(jìn)行研究。因金剛石顆粒表面鎳磷合金層的相關(guān)性能難以檢測,本文借助以銅片、玻璃片為基體來制備鎳磷合金層,分別研究了磷含量及熱處理?xiàng)l件對(duì)其硬度、耐腐性及導(dǎo)電性能的影響。在鎳磷合金層確定中磷含量的條件下,本文選用粒徑為30-40μmm的金剛石顆粒。首先采用化學(xué)鍍的方法在金剛石表面鍍鎳磷合金,然后進(jìn)行相應(yīng)的熱處理,最后采用掃描電子顯微鏡(SEM)對(duì)熱處理后的金剛石表面微觀形貌進(jìn)行觀察、能譜分析(EDS)以及X射線衍射儀對(duì)金剛石表面的組織結(jié)構(gòu)進(jìn)行物相分析(XRD)。結(jié)果表明：在一定范圍內(nèi),隨熱處理溫度的升高,鍍層表面變得越平滑。經(jīng)過400℃C熱處理時(shí),鍍層表面最平滑；500℃熱處理時(shí),鍍層表面變粗糙。由X射線衍射圖譜得知,鍍態(tài)試樣經(jīng)過300℃C熱處理時(shí),鍍層開始晶化,析出Ni相和Ni7P3相；經(jīng)過500℃C熱處理時(shí),析出了Ni3P相,此時(shí)晶化比較完全,實(shí)現(xiàn)了由非晶態(tài)往晶態(tài)的轉(zhuǎn)變過程。由機(jī)械攪拌實(shí)驗(yàn)得知,經(jīng)過300℃、400℃C熱處理的金剛石顆粒在電鍍液中至少可存放48h。在相同的工藝條件下,選用未熱處理及經(jīng)過300℃℃熱處理的金剛石顆粒分別進(jìn)行霍爾槽上砂試驗(yàn),并確定最佳的工藝參數(shù)。研究發(fā)現(xiàn)：采用300℃℃熱處理的金剛石顆粒的上砂量比前者多,上砂效率明顯提高。采用基體規(guī)格為Φ0.18mm鍍銅高碳鋼絲,采用氨基磺酸型鍍液,金剛石顆粒為未熱處理及300℃熱處理的。在確定的工藝參數(shù)下,分別制備電鍍金剛石切割線,并對(duì)油石進(jìn)行切割試驗(yàn)。研究發(fā)現(xiàn)：采用300℃C熱處理的金剛石制作的電鍍金剛石切割線切割油石表面質(zhì)量高,切口整齊,符合使用性能的要求。
[Abstract]:With the increasing demand for silicon crystal materials, the processing requirements are higher and higher. Among them, electroplated diamond cutting line has many advantages, such as high cutting efficiency, high and stable slice quality, high yield, long service life and low pollution. The cutting and processing field of hard and brittle materials such as stone has been developed rapidly, and the application prospect is more and more clear. As a kind of diamond tool, it has been welcomed and paid more and more attention by more and more researchers. It has gradually replaced the traditional cutting tools and become a new cutting tool for hard and brittle materials. In this paper, the problems of the long preparation period of electroplated diamond cutting line and the problem that the Ni-P alloy layer on the diamond surface is easily destroyed in the plating solution is studied in this paper. Because the correlation of Ni-P alloy layer on the surface of diamond particles is difficult to detect, the effects of phosphorus content and heat treatment conditions on hardness, corrosion resistance and electrical conductivity of Ni-P alloy layer were studied by means of copper sheet and glass substrate. Under the condition of determining the content of middle phosphorus in the Ni-P alloy layer, the diamond particles with the diameter of 30-40 渭 mm were selected in this paper. Firstly, Ni-P alloy was deposited on diamond surface by electroless plating, then the corresponding heat treatment was carried out. Finally, the microstructure of diamond surface after heat treatment was observed by scanning electron microscope (SEM). The microstructure of diamond surface was analyzed by energy dispersive spectroscopy (EDS) and X-ray diffractometer (XRD). The results show that the surface of the coating becomes smoother with the increase of heat treatment temperature in a certain range. After 400 鈩，

本文編號(hào)：2081122