發(fā)布時間：2018-05-08 01:34

  本文選題：鼓包儀 + 薄膜材料��； 參考：《湘潭大學(xué)》2017年碩士論文

【摘要】：隨著微納米技術(shù)、微電子技術(shù)和微電子機(jī)械系統(tǒng)(MEMS)等許多新興技術(shù)的迅速發(fā)展,薄膜材料在眾多高新技術(shù)和傳統(tǒng)工業(yè)領(lǐng)域獲得了越來越廣泛的應(yīng)用。在實際工作過程中,薄膜材料通常是在多種載荷復(fù)合加載的復(fù)雜條件下服役的。然而,就當(dāng)前狀況而言,學(xué)術(shù)界和工程界對復(fù)雜載荷條件下薄膜材料的變形損傷與破壞機(jī)理缺乏深入研究,進(jìn)而影響到對材料的服役性能評估和壽命預(yù)測。此外,高低溫、電場、磁場等特殊物理場也會對材料性能帶來影響,尤其高溫環(huán)境下,薄膜材料的的力學(xué)行為會發(fā)生明顯變化。因此,針對特殊物理場開展復(fù)雜載荷條件下材料的力學(xué)性能測試技術(shù)研究顯得十分必要。本文根據(jù)薄膜材料的工作環(huán)境,開發(fā)了力熱載荷自動控制系統(tǒng)。在原有鼓包儀的基礎(chǔ)上進(jìn)行升級改造,設(shè)計和組裝了一臺力熱聯(lián)合作用下新型多功能鼓包測試平臺,為力熱作用下服役的薄膜材料力學(xué)性能的表征提供了便利。該研究成果為薄膜元件應(yīng)力分析、失效分析、壽命預(yù)測提供可靠的依據(jù),具有非常重要的意義。具體工作內(nèi)容如下:(1)薄膜力學(xué)性能的測試方法有很多,不同之處主要體現(xiàn)在加載手段跟測量手段上。本文首先對力熱作用下國內(nèi)外拉伸、鼓包、壓痕等裝置進(jìn)行了分析比較,然后研究了各種測試裝置的加熱部分,設(shè)計了能夠產(chǎn)生均勻溫度場的加熱環(huán)境箱以及與之配套使用溫度控制系統(tǒng),并對該裝置進(jìn)行了調(diào)試。(2)推導(dǎo)了力熱作用下鼓包測試方程。根據(jù)材料中任一點的應(yīng)力張量、溫度增量所滿足的動力學(xué)平衡方程,結(jié)合傳統(tǒng)常溫鼓包模型,對薄膜不同變形階段進(jìn)行了力熱作用下薄膜鼓包方程的推導(dǎo)。(3)利用自主研制的鼓包實驗設(shè)備,以兩種常見的金屬薄膜鎳膜和聚合物薄膜PI膜為研究對象,對薄膜材料的力學(xué)性能進(jìn)行研究,在不同工作溫度下對樣品進(jìn)行鼓包實驗,結(jié)合力熱鼓包模型,得到了薄膜材料在不同溫度下的彈性模量值,并分析了其彈性模量隨溫度變化的原因。
[Abstract]:With the rapid development of many new technologies, such as micronanotechnology, microelectronic technology and microelectromechanical system (MEMS), thin film materials have been widely used in many fields of high and new technology and traditional industry. In practice, thin film materials are usually in service under complex conditions of multiple loads. However, as far as the current situation is concerned, there is a lack of in-depth research on the deformation damage and failure mechanism of thin film materials under complex loads, which will affect the service performance evaluation and life prediction of the materials. In addition, the special physical fields such as high and low temperature, electric field and magnetic field will also affect the properties of the film, especially at high temperature, the mechanical behavior of the thin film will change obviously. Therefore, it is necessary to study the mechanical properties of materials under complex loads for special physical fields. According to the working environment of thin film material, an automatic control system of force and heat load is developed in this paper. A new multifunctional bulging test platform was designed and assembled on the basis of the original bulging instrument, which provided convenience for the characterization of mechanical properties of thin film materials in service under mechanical heat. The research results provide reliable basis for stress analysis, failure analysis and life prediction of thin film elements. The main work is as follows: 1) there are many methods for measuring the mechanical properties of thin films. The difference lies in the loading and measuring methods. In this paper, the drawing, bulging and indentation are analyzed and compared at home and abroad under the action of force and heat, and then the heating part of various test devices is studied. The heating environment box which can produce uniform temperature field and the corresponding temperature control system are designed. The test equation of bulge under the force and heat action is deduced by debugging the device. According to the dynamic equilibrium equation satisfied by the stress Zhang Liang at any point in the material and the temperature increment, combined with the traditional normal temperature bulging model, The equation of film bulging at different deformation stages was derived. (3) two kinds of common metal film nickel film and polymer film Pi film were studied by using the self-developed bulging experimental equipment. The mechanical properties of the films were studied. The samples were belled at different working temperatures. The elastic modulus of the films at different temperatures was obtained by combining the thermal bulging model. The reason of the change of elastic modulus with temperature is analyzed.
【學(xué)位授予單位】：湘潭大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TB383.2

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本文編號：1859393