本文選題：碳納米管宏觀膜 + 分離��； 參考：《江西理工大學(xué)》2017年碩士論文

【摘要】：隨著電子科學(xué)與信息技術(shù)的高速發(fā)展,電子設(shè)備及器件正大規(guī)模地普及。這些電子設(shè)備產(chǎn)生的電磁波為人類生活帶來極大便利的同時(shí)也帶來了一定的安全隱患。因而須使用電磁屏蔽材料屏蔽電磁波產(chǎn)生的輻射。目前常用的屏蔽材料主要為金屬材料和導(dǎo)電填充型復(fù)合材料等。但是這類材料密度高、不具有柔性,因而給較多場(chǎng)合的使用帶來了不便。碳納米管(CNTs)作為一種新型納米材料,表現(xiàn)出了優(yōu)異的屏蔽性能。通常CNTs作為導(dǎo)電填充劑添加到高分子聚合物上,用于制備電磁屏蔽材料。但是該法制備的屏蔽材料由于其填充量有限導(dǎo)致屏蔽效能不高、質(zhì)量不夠輕。本研究以CNTs宏觀膜(CMF)作為基體制備電磁屏蔽材料。在制備CMF時(shí),通常需要基底作支撐,要實(shí)現(xiàn)CMF的應(yīng)用需要將其從基底上分離成自支撐CMF。按目前方法,實(shí)現(xiàn)CMF從基底上分離成自支撐膜尚有一定難度。本文對(duì)制備的CMF做了一些無損分離的嘗試,并研究了其電磁屏蔽性能。(1)本文采用浮動(dòng)催化裂解的化學(xué)氣相沉積法(CVD)合成了CNTs,并通過乙醇水溶液(Vol%,50%)將其置于打印紙上組裝并分離了CMF。探討了CMF與打印紙間的組裝和分離機(jī)理。在乙醇水溶液的作用下,CNTs吸附在打印紙上組裝成CMF,它們間僅發(fā)生物理吸附而不發(fā)生化學(xué)吸附。在微觀尺度下,打印紙表面具有較大的表面平均粗糙度,使得CMF易從打印紙上分離。(2)通過XRD、SEM、HR-TEM等手段表征CMF的結(jié)構(gòu)和形貌。在宏觀尺度上,CMF具有平整的表面、良好的厚度均勻性,同時(shí)還具有良好的石墨化結(jié)構(gòu)。經(jīng)過10%以下的拉伸變形,其導(dǎo)電性變化很小,表明經(jīng)過彎曲、折疊等操作不會(huì)影響CMF的使用。制備的CMF尺寸高達(dá)1880 mm*1000 mm。(3)通過電沉積的方式在CMF表面沉積Cu薄層,得到了Cu/CMF復(fù)合材料,并對(duì)其柔性、屏蔽性能進(jìn)行研究。發(fā)現(xiàn)Cu/CMF具有與Cu箔一致的導(dǎo)電性,經(jīng)多次折疊甚至揉搓后,依舊保持了其質(zhì)輕、高柔的特點(diǎn)。在高頻波段,Cu/CMF比CMF和填充Fe納米顆粒的CMF具有更高的屏蔽效能。相比電沉積Cu前的CMF,在10-18 GHz頻率范圍內(nèi),其平均屏蔽效能提高了10.3-25.7%,最高達(dá)55%。與填充Fe納米顆粒的CMF相比,在9-18 GHz頻率范圍內(nèi),其平均電磁屏蔽效能提高了7.5-19%。在~15 GHz時(shí),Cu/CMF的電磁屏蔽效能高達(dá)53.3 dB。
[Abstract]:With the rapid development of electronic science and information technology, electronic devices and devices are popularizing on a large scale. The electromagnetic wave generated by these electronic devices brings great convenience to human life, but also brings some security risks. Therefore, electromagnetic shielding materials must be used to shield the radiation generated by electromagnetic waves. At present, the main shielding materials are metal materials and conductive filled composites. However, this kind of material is not flexible because of its high density, so it is inconvenient to be used in many occasions. Carbon nanotubes (CNTs), as a new nano material, exhibit excellent shielding properties. CNTs is usually added to polymer as a conductive filler to prepare electromagnetic shielding materials. However, the shielding material prepared by this method is of low shielding efficiency and low mass due to its limited filling. In this study, electromagnetic shielding materials were prepared by using CNTs macroscopical membrane as substrate. In the preparation of CMF, the substrate is usually needed as the support, and to realize the application of CMF, it is necessary to separate it from the substrate into self-supporting CMF. According to the present method, it is difficult to separate CMF from the substrate into self-supporting membrane. In this paper, we try to separate the CMF without damage. In this paper, CNTswere synthesized by floating catalytic pyrolysis chemical vapor deposition (CVD). The CNTswere assembled and separated on printed paper by ethanol aqueous solution. The mechanism of assembly and separation between CMF and printing paper was discussed. CNTs were adsorbed on printed paper to form CMFs under the action of ethanol aqueous solution, and there was only physical adsorption and no chemisorption between them. On the micro scale, the surface of printing paper has a large average surface roughness, which makes it easy for CMF to be separated from printing paper.) the structure and morphology of CMF are characterized by means of XRDX, SEM, HR-TEM and so on. The CMF has a smooth surface, a good thickness uniformity and a good graphitization structure. After tensile deformation of less than 10%, the electrical conductivity change is very small, indicating that after bending, folding and other operations will not affect the use of CMF. The size of the prepared CMF is up to 1880 mm*1000 / mm 路m3) Cu thin layer was deposited on the surface of CMF by electrodeposition, and its flexibility and shielding properties were studied. It is found that Cu/CMF has the same electrical conductivity as Cu foil. After fold and even knead for many times, Cu/CMF still keeps its characteristics of light weight and high flexibility. The shielding efficiency of Cu / CMF in high frequency band is higher than that of CMF and CMF filled with Fe nanoparticles. Compared with the CMF before electrodeposition, the average shielding efficiency increased by 10.3-25.7in the frequency range of 10-18 GHz. Compared with the CMF filled with Fe nanoparticles, the average electromagnetic shielding efficiency increases 7.5-19 in the range of 9-18 GHz frequency. At 15 GHz, the electromagnetic shielding efficiency of Cu- / CMF is as high as 53.3 dB.
【學(xué)位授予單位】：江西理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TB34

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本文編號(hào)：1830863