本文選題：化學(xué)鍍銅 + 沉積速率　； 參考：《陜西師范大學(xué)》2015年碩士論文

【摘要】：由于印制電路板(PCB)具有輕量化、微型化、易于標(biāo)準(zhǔn)化等優(yōu)點(diǎn),幾乎是所有電子設(shè)備的核心部件�；瘜W(xué)鍍銅工藝是印制電路金屬化的關(guān)鍵技術(shù)。目前,化學(xué)鍍銅的工廠、車間幾乎遍布世界各地,而計(jì)算機(jī)行業(yè)和航空工業(yè)的高速發(fā)展,對(duì)電子組件屏蔽信號(hào)干擾的功能提出了更高要求,進(jìn)而也對(duì)化學(xué)鍍銅提出了新的要求：(1)發(fā)展新的添加劑,降低成本,提高沉銅速率,提高經(jīng)濟(jì)效益。(2)延長(zhǎng)化學(xué)鍍銅液的壽命�；瘜W(xué)鍍銅液處于熱力學(xué)不穩(wěn)定狀態(tài),因此,提高其穩(wěn)定性,延長(zhǎng)使用壽命,對(duì)提高鍍銅層質(zhì)量、降低原材料消耗,減少環(huán)境污染。其中化學(xué)鍍銅液的穩(wěn)定性是決定該化學(xué)鍍銅液能否應(yīng)用于實(shí)際生產(chǎn)的關(guān)鍵問(wèn)題,在化學(xué)鍍?nèi)芤褐刑砑痈鞣N添加劑是提高鍍液穩(wěn)定性的重要手段之一本文主要致力于研究化學(xué)鍍銅溶液的壽命問(wèn)題,為了提高鍍液的穩(wěn)定性,需向鍍液中添加合適的穩(wěn)定劑,而穩(wěn)定劑的加入會(huì)導(dǎo)致沉積速率下降太快。因此本論文首先研究了化學(xué)鍍銅溶液的加速劑,在添加加速劑的基礎(chǔ)上,選擇合適的穩(wěn)定劑,通過(guò)沉積速率的測(cè)量和SEM圖像的觀察發(fā)現(xiàn)：L-蘋果酸、2,6-二氨基吡啶、腺嘌呤和鳥嘌呤有比較好的加速作用；亞硫酸鈉、硅酸鈉、聚乙烯吡咯烷酮、FC-80、8-羥基-7-碘-5-喹啉磺酸、六氟硅酸鈉、FC-134都不同程度的降低了化學(xué)鍍銅的沉積速率,可作為該體系的穩(wěn)定劑；并且腺嘌呤與亞硫酸鈉、鳥嘌呤與高鐵試劑、L-蘋果酸與硅酸鈉、L-蘋果酸與六氟硅酸鈉達(dá)成了協(xié)同作用。在本實(shí)驗(yàn)室已得到的低溫化學(xué)鍍銅體系中,分別加入適量六氟硅酸鈉、FC-80、FC-134后,化學(xué)鍍銅膜表面形貌得到優(yōu)良的改善。然后用X-射線衍射法測(cè)定分析了銅膜的表面應(yīng)力,同樣在已得到的體系中,分別加入適量的上述穩(wěn)定劑,研究發(fā)現(xiàn)只有六氟硅酸鈉、FC-80、FC-134三種穩(wěn)定劑能降低銅膜表面的應(yīng)力,其中FC-134在降低應(yīng)力方面能到到更好的效果。最后通過(guò)氧化還原滴定法和酸堿滴定法對(duì)鍍液中各成分的損耗進(jìn)行分析,確定各成分的最佳補(bǔ)充量。在負(fù)載為40.0cm2/L的情況下,通過(guò)空氣攪拌,不斷補(bǔ)給,連續(xù)施鍍,測(cè)定鍍液的周期。在已得到的低溫化學(xué)鍍銅體系中,再分別加入穩(wěn)定劑亞硫酸鈉、硅酸鈉、聚乙烯吡咯烷酮、六氟硅酸鈉、全氟FC-80、FC-134、高鐵試劑時(shí),化學(xué)鍍銅溶液的周期個(gè)數(shù)分別延長(zhǎng)到4.68、4.91、5.72、5.61、5.79、6.03、4.41。其中FC-134的穩(wěn)定性最好,周期最大值為6.03,即化學(xué)鍍銅溶液能夠連續(xù)使用54個(gè)小時(shí),大大降低了化學(xué)鍍銅工業(yè)的成本,減少了環(huán)境污染,對(duì)我國(guó)印制電路板產(chǎn)業(yè)的飛速發(fā)展起到了促進(jìn)作用。本文最終獲得了低溫低應(yīng)力的穩(wěn)定性良好、能夠連續(xù)使用的化學(xué)鍍銅溶液,其組成為：五水硫酸銅10g·L-1,酒石酸鉀鈉28.25g-L-1,甲醛(37%)5mL·L-1,L-蘋果酸2.0mg·L-1,2,2'-聯(lián)吡啶2.0mg·L-1,十二烷基苯磺酸鈉(SDBS)5.0mg·L-1, FC-80或FC-134 3.0mg·L-1。在該體系中沉積速率高,銅膜外觀較好,應(yīng)力低,使用周期長(zhǎng)。當(dāng)加入3.0mg·L-1FC-80時(shí),最小應(yīng)力可達(dá)到為-5.80MPa,周期為5.79；當(dāng)用等量的FC-134替換時(shí),最小應(yīng)力可達(dá)到為4.42MPa,周期為6.03。
[Abstract]:As the printed circuit board (PCB) has the advantages of lightweight, miniaturization, and easy to standardize, it is almost the core component of all electronic devices. Electroless copper plating is the key technology for the metallization of printed circuits. At present, the factory of electroless copper plating is almost all over the world, and the rapid development of the computer industry and the aviation industry, to the electronic group The function of shielding signal interference puts forward higher requirements, and then puts forward new requirements for electroless copper plating: (1) developing new additives, reducing cost, improving copper deposition rate and improving economic efficiency. (2) prolonging the life of electroless copper plating solution. The electroless copper plating solution is in a thermodynamic unstable state, thus improving its stability and prolonging the use of life. In order to improve the quality of copper plating, reduce the consumption of raw materials and reduce the environmental pollution, the stability of the electroless copper plating solution is the key problem to determine whether the electroless copper plating solution can be applied to the actual production, and the addition of various additives in the electroless plating solution is one of the important means to improve the stability of the plating bath. In order to improve the stability of the solution, in order to improve the stability of the bath, it is necessary to add a suitable stabilizer to the bath, and the addition of stabilizers will lead to the deposition rate falling too quickly. The observation of the image shows that L- malic acid, 2,6- two amino pyridine, adenine and guanine have a better acceleration effect. Sodium sulfite, sodium silicate, polyvinylpyrrolidone, FC-80,8- hydroxyl -7- iodide -5- quinoline sulfonic acid, six sodium fluorosilicate, FC-134 can reduce the deposition rate of chemical copper plating in varying degrees, and can be used as stabilizers for this system. And adenine and sodium sulfite, guanine and ferric reagent, L- malic acid and sodium silicate, L- malic acid and six sodium fluorosilicate have reached synergistic effect. In the low temperature electroless copper plating system which has been obtained in this laboratory, the surface morphology of the copper plating film is improved by adding appropriate amount of six sodium fluorosilicate, FC-80, and FC-134. Then it is shot with X-. The surface stress of the copper film is measured and analyzed by line diffraction. The same stabilizer is added to the obtained system. It is found that only six sodium fluosilicate, FC-80, FC-134 can reduce the stress on the surface of the copper film, and FC-134 can achieve better effect in reducing the stress. Finally, the redox titration can be achieved by oxidation reduction titration. The loss of all components in the bath was analyzed by method and acid base titration, and the best supplement of each component was determined. Under the condition of the load of 40.0cm2/L, it was stirred by air, continuously recharged, continuous plating, and determination of the period of the plating bath. The stabilizer sodium sulfite, sodium silicate and polyethylene were added to the obtained low temperature chemical copper plating system. When pyrrolidone, six sodium fluosilicate, perfluoro FC-80, FC-134, and ferric reagent, the periodic number of the electroless copper plating solution is extended to 4.68,4.91,5.72,5.61,5.79,6.03,4.41., respectively, of which the stability of the FC-134 is best, the maximum of the cycle is 6.03, that is, the electroless copper plating solution can be used for 54 hours, greatly reducing the cost of the electroless copper plating industry. Less environmental pollution has played a role in promoting the rapid development of printed circuit board industry in China. This paper has finally obtained a good stability of low temperature and low stress and can be used continuously in electroless copper plating solution, which consists of five water copper sulfate 10g L-1, potassium tartrate sodium 28.25g-L-1, formaldehyde (37%) 5mL. L-1, L- malic acid 2.0mg. L-1,2,2'- couplet. 2.0mg. L-1, twelve alkyl benzene sulfonate (SDBS) 5.0mg. L-1, FC-80 or FC-134 3.0mg. L-1. have high deposition rate in this system. The appearance of the copper film is better, the stress is low and the use period is long. When 3.0mg L-1FC-80 is added, the minimum stress can be reached as -5.80MPa, the period is 5.79. The cycle is 6.03.

【學(xué)位授予單位】：陜西師范大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TB306

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本文編號(hào)：1824775