本文選題：納米多孔金　切入點(diǎn)：三元去合金化　出處：《功能材料》2017年07期

【摘要】：采用磁控濺射鍍銅金銀多層膜,經(jīng)過(guò)長(zhǎng)時(shí)間高溫?zé)崽幚砗辖鸹苽淝膀?qū)體三元合金,以不同的酸溶液自由腐蝕去合金化去除合金中的銅元素和銀元素,成功制備出納米多孔金薄膜。采用掃描電鏡和X射線能譜儀對(duì)去合金腐蝕前后樣品的形貌和成分進(jìn)行了分析。結(jié)果表明,400℃,36h熱處理后銅金銀多層膜完全合金化,獲得了Au_3Ag_(28.5)Cu_(68.5)合金材料;FeCl_3+HCl溶液自由腐蝕去除銅可獲得連續(xù)均勻的納米尺寸孔隙結(jié)構(gòu),獲得了幾乎不含銅的樣品;采用漸進(jìn)濃度的硝酸自由腐蝕去合金化后去除銀后獲得了孔隙率約84%的納米多孔金薄膜,其微觀結(jié)構(gòu)為連續(xù)的三維多孔結(jié)構(gòu),其系帶尺寸10~35nm,并且20~25nm的系帶分布達(dá)77%。
[Abstract]:The precursor ternary alloy was prepared by magnetron sputtering copper, gold and silver multilayers, and alloyed for a long time at high temperature. Copper and silver elements in the alloy were removed by free corrosion and alloying with different acid solutions. Nano-porous gold films were successfully prepared. The morphology and composition of the samples before and after dealloying were analyzed by scanning electron microscopy and X-ray energy spectrometer. The results showed that copper gold and silver multilayers were completely alloyed after heat treatment at 400 鈩，

本文編號(hào)：1687835