本文選題：硅片　切入點：表面織構(gòu)　出處：《北京理工大學》2015年碩士論文　論文類型：學位論文

【摘要】：隨著微納機械器件結(jié)構(gòu)尺寸的微型化，導致表面積與體積之比增大，表面效應明顯增強，由此帶來嚴重的粘著、摩擦和磨損問題，影響了器件的工作性能和使用壽命，阻礙了微納機電系統(tǒng)(MEMS/NEMS)的發(fā)展和應用。對MEMS/NEMS表面進行織構(gòu)化處理，是解決這一問題的有效途徑。為此，本文通過試驗對微納尺度下織構(gòu)化硅片表面的摩擦學行為進行了研究。本文主要工作和結(jié)論如下： 通過光學光刻和電感耦合等離子體刻蝕技術(shù)在單晶硅(100)晶面上進行了柱狀織構(gòu)的構(gòu)筑，，分別使用掃描電子顯微鏡和原子力顯微鏡對織構(gòu)化硅片表面進行了形貌表征。觀測結(jié)果表明：在硅片表面上形成了較為規(guī)則的圓柱陣列。當相鄰織構(gòu)間的距離保持不變，而直徑逐漸增大時，織構(gòu)覆蓋率及表面均方根粗糙度均隨之增大。 使用配備有膠狀探針的原子力顯微鏡進行了粘著試驗，分別在室溫下的大氣和去離子水環(huán)境中對粘著力進行了測量，考察了柱狀織構(gòu)對硅片表面粘著行為產(chǎn)生的影響。測量結(jié)果表明：柱狀織構(gòu)起到了顯著的減粘作用，同時降低了范德華力和毛細力的大小。當間距一定時，具有較小直徑的織構(gòu)面更有利于粘著力的減小。另外，毛細力對表面粘著力的貢獻處于重要地位。 使用膠狀探針在原子力顯微鏡下進行了摩擦試驗，研究了織構(gòu)化硅片表面的摩擦行為。試驗結(jié)果表明：柱狀織構(gòu)減小了探針與硅片表面之間的滑動摩擦力。同樣地，當織構(gòu)的間距一定時，直徑越小表面上的摩擦力也越小。此外，通過改變試驗中的載荷和滑動速度還發(fā)現(xiàn)：織構(gòu)化表面上的摩擦力隨著載荷以及滑動速度的增大而增大，而相對摩擦系數(shù)隨著載荷的增大而降低。 使用原子力顯微鏡測量硅片表面形貌，對多尺度特性進行了研究，并建立了粗糙表面接觸的多尺度模型，探究了表面間的真實接觸面積與尺度數(shù)之間的關(guān)系。計算結(jié)果表明：當尺度越來越小時，越來越多更小尺度下的粗糙峰開始出現(xiàn)，表面間的真實接觸面積隨著尺度數(shù)的增加而不斷減小。
[Abstract]:With the miniaturization of the structural dimensions of micro / nano mechanical devices, the ratio of surface area to volume is increased, and the surface effect is obviously enhanced. As a result, serious problems of adhesion, friction and wear are brought about, which affect the working performance and service life of the devices. This hinders the development and application of MEMS / NEMS. Texturing the surface of MEMS/NEMS is an effective way to solve this problem. In this paper, the tribological behavior of textured silicon wafers at micro- and nanoscale scale has been studied by experiments. The main work and conclusions are as follows:. By means of optical lithography and inductively coupled plasma etching technique, the columnar texture was constructed on the crystal plane of monocrystalline silicon (100). The morphology of textured silicon wafers was characterized by scanning electron microscope (SEM) and atomic force microscope (AFM). The results show that a regular cylindrical array is formed on the wafer surface, and the distance between adjacent textures remains constant. As the diameter increases, the texture coverage and RMS roughness increase. Adhesion tests were carried out using an atomic force microscope equipped with a colloidal probe, and the adhesion was measured in atmospheric and deionized water environments at room temperature, respectively. The effect of columnar texture on the adhesion behavior of silicon wafer surface is investigated. The results show that the columnar texture plays a significant role in reducing the viscosity and decreasing the van der Waals force and the capillary force. In addition, the contribution of capillary force to surface adhesion is important. The friction behavior of textured silicon wafer surface was studied by using a colloidal probe under atomic force microscope. The results show that the cylindrical texture reduces the sliding friction force between the probe and the wafer surface. When the spacing of texture is constant, the friction force on the surface of the smaller the diameter is also smaller. In addition, by changing the load and sliding velocity in the experiment, it is found that the friction force on the texture surface increases with the increase of the load and the sliding velocity. The relative friction coefficient decreases with the increase of load. The surface morphology of silicon wafer was measured by atomic force microscope (AFM) and the multi-scale model of rough surface contact was established. The relationship between the real contact area between surfaces and the number of scales is investigated. The results show that as the scale becomes smaller and smaller, more and more rough peaks begin to appear. The true contact area between surfaces decreases with the increase of the number of scales.
【學位授予單位】：北京理工大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TB306;TN304.12

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