發(fā)布時間：2018-03-17 00:13

  本文選題：環(huán)氧樹脂　切入點：復合材料　出處：《昆明理工大學》2017年碩士論文　論文類型：學位論文

【摘要】：隨著電子設備及照明設備向著小型化、大規(guī)模集成化及高功率化發(fā)展,電子設備中的集成電路工作過程中會產(chǎn)生越來越多的熱量,且產(chǎn)生熱量的部位較為集中。若不能及時地將這些熱量傳遞出去,會大大地降低設備的工作效率及壽命,甚至失效。環(huán)氧樹脂通常被作為電子器件的絕緣封裝材料,然而導熱系數(shù)很低,室溫下只有0.1～0.2 Wm-1K-1左右,熱膨脹系數(shù)較大,難以與硅電子元器件始終貼合在一起,無法保證良好的散熱效果。大長徑比與高比表面積的碳化硅納米線(SiCNWs)由于本身具有高導熱性能、高熱穩(wěn)定性、高擊穿電場、優(yōu)異的機械性能及耐腐蝕性,作為填料能夠以很低的含量引入環(huán)氧樹脂中,能有效提高其導熱性能、降低環(huán)氧樹脂的熱膨系數(shù)或熱變形參數(shù)。本文采用一種簡單的溶液共混法在環(huán)氧樹脂基體中引入極少量的SiC NWs制備出Epoxy/SiCNWs復合材料,以此改善其導熱性能及熱穩(wěn)定性。在此基礎上,采用高溫處理SiCNWs制備出核殼結(jié)構(gòu)的納米線SiC@Si02NWs,使得納米線之間,及SiC@Si02 NWs與環(huán)氧樹脂之間有一層Si02作為聲子振動的過渡層,從而進一步的提高了環(huán)氧復合材料(Epoxy/SiC@Si02NWs)的導熱性能。在核殼結(jié)構(gòu)SiC@Si02 NWs的啟發(fā)下,通過真空抽濾方法,制備出具有核殼結(jié)構(gòu)的石墨烯包覆碳纖維雜化填料,并與環(huán)氧樹脂復合制備出Epoxy/CF@G復合材料,極大的提高了環(huán)氧樹脂的導熱性能。通過LFA、IR、DSC和TG等儀器對復合材料的導熱性能和熱穩(wěn)定性進行表征發(fā)現(xiàn):(1)Epoxy/SiCNWs復合材料的導熱系數(shù)最大達到了 0.449 Wm-1K-1,相比于純環(huán)氧樹脂,其導熱系數(shù)提高了 106%,熱變形量參數(shù)優(yōu)于同類文獻所制備的復合材料;(2)采用良好界面浸潤性的核殼結(jié)構(gòu)SiC@SiO2 NWs制備的Epoxy/SiC@Si02NWs復合材料的最大導熱系數(shù)達到了 0.391 Wm-1K-1,相比于純環(huán)氧樹脂提高了 79.4%,同時導熱性能優(yōu)于同等含量的Epoxy/SiC NWs復合材料。(3)采用核殼結(jié)構(gòu)的CF@G制備的Epoxy/CF@G復合材料相比于CF/Epoxy導熱性能明顯提高了一倍,最大導熱系數(shù)達1.19Wm-1K-1,儲存模量提高了 1248.7%,熱機械性能有極大的提升。由此,制備的復合材料在電子封裝領域具有較大的應用前景。
[Abstract]:With the development of electronic equipment and lighting equipment towards miniaturization, large-scale integration and high power, the integrated circuit in electronic equipment will produce more and more heat in the working process. If the heat is not transmitted in time, the efficiency and service life of the equipment will be greatly reduced, or even defunct. Epoxy resin is usually used as an insulating packaging material for electronic devices. However, the thermal conductivity is very low. At room temperature, it is only about 0.1 Wm-1K-1, and the coefficient of thermal expansion is large, so it is difficult to bond with silicon electronic components all the time. Because of its high thermal conductivity, high thermal stability, high breakdown electric field, excellent mechanical properties and corrosion resistance, As fillers can be introduced into epoxy resin at a very low content, it can effectively improve its thermal conductivity. In this paper, a simple solution blending method was used to prepare Epoxy/SiCNWs composites by introducing a small amount of SiCNWs into epoxy resin matrix. In order to improve its thermal conductivity and thermal stability, a core-shell structure nanowire SICP Si02NWswas prepared by high temperature treatment of SiCNWs, so that there is a layer of Si02 between nanowires and between SiC@Si02NWs and epoxy resin as the transition layer for phonon vibration. The thermal conductivity of epoxy composite Epoxyr / sic @ Si02NWs was further improved. Under the inspiration of core-shell structure SiC@Si02NWs, graphene coated carbon fiber hybrid filler with core-shell structure was prepared by vacuum filtration method. Epoxy/CF@G composites were prepared by blending with epoxy resin. The thermal conductivity and thermal stability of the composites were characterized by LFA-IR DSC and TG. It was found that the maximum thermal conductivity of the Epoxy- / SiCNWs composite was 0.449 Wm-1K-1, which was higher than that of pure epoxy resin. The thermal conductivity of the composite is increased by 106, and the thermal deformation parameter is better than that of the composite prepared by the same literature.) the maximum thermal conductivity of the Epoxy/SiC@Si02NWs composite prepared by using core-shell structure SiC@SiO2 NWs with good interfacial wettability is 0.391 Wm-1K-1, compared with that of the core-shell structure with good interfacial wettability. The thermal conductivity of the pure epoxy resin is 79.4%, and the thermal conductivity is better than that of the same content of Epoxy/SiC NWs composite. 3) compared with CF/Epoxy, the thermal conductivity of the Epoxy/CF@G composite prepared by using core-shell structure CF@G is much higher than that of CF/Epoxy. The maximum thermal conductivity is 1.19Wm-1K-1, the storage modulus is increased by 1248.7and the thermo-mechanical properties are greatly improved.
【學位授予單位】：昆明理工大學
【學位級別】：碩士
【學位授予年份】：2017
【分類號】：TB332

【參考文獻】

相關期刊論文 前10條

1 陳衛(wèi)東;張鵬云;陳艷麗;顧莉;;高性能環(huán)氧樹脂膠黏劑研究概況[J];化工科技;2016年03期

2 田雨華;宰學榮;宰敬U，

本文編號：1622295