本文關(guān)鍵詞： 碳納米管 預(yù)處理 化學(xué)鍍銅 CNTs/Cu復(fù)合材料　出處：《昆明理工大學(xué)》2017年碩士論文　論文類型：學(xué)位論文

【摘要】：碳納米管(Carbon Nanotubes,CNTs)具有密度小、強(qiáng)度高、比表面積大、導(dǎo)電和導(dǎo)熱性能優(yōu)良、熱膨脹系數(shù)低及耐強(qiáng)酸強(qiáng)堿等特性,但也存在容易團(tuán)聚、潤濕性差等缺點(diǎn)。本文通過在CNTs表面化學(xué)鍍銅的方法對其進(jìn)行表面改性處理,采用粉末冶金法制備CNTs/Cu復(fù)合材料,并對比了化學(xué)鍍銅CNTs與原始CNTs對CNTs/Cu復(fù)合材料性能的影響。(1)對CNTs預(yù)處理工藝進(jìn)行了研究,考察了 CNTs純化、活化、敏化工藝對碳納米管表面性能的影響。通過TEM、XRD、EDS、紅外光譜等分析結(jié)果表明,經(jīng)過預(yù)處理的CNTs表面鍍覆一層Pd和SnO粒子共同構(gòu)成的活化層。(2)對CNTs化學(xué)鍍銅的工藝參數(shù)進(jìn)行了研究,化學(xué)鍍液配方由還原劑NaBH4、銅鹽CuSO4 · 5H20、絡(luò)合劑、穩(wěn)定劑、分散劑組成。采用單因素法研究鍍液pH值、施鍍時間、施鍍溫度、CNTs濃度對CNTs化學(xué)鍍銅層的影響,通過TEM、XRD、SEM、EDS分析CNTs表面銅層的均勻性和連續(xù)性,進(jìn)而確定最優(yōu)工藝條件為:pH=11、t=30min、T=50℃和CNTs濃度為0.08g/L。(3)對CNTs化學(xué)鍍銅的界面組織進(jìn)行了研究,通過TEM觀察到化學(xué)鍍銅CNTs的界面結(jié)合為銅的(110)晶面與碳層浸潤形成過渡層,其夾角小于90°;通過電子探針發(fā)現(xiàn)化學(xué)鍍銅增加了 CNTs與銅的潤濕性,改善了 CNTs的分散性;探討了 CNTs表面化學(xué)鍍銅的機(jī)理源于由原子氫機(jī)析出理和電子還原機(jī)理共同作用。(4)對CNTs/Cu復(fù)合材料的力學(xué)性能和電性能進(jìn)行了研究,將化學(xué)鍍銅CNTs和原始CNTs分別加入純銅粉中進(jìn)行高能球磨得到CNTs/Cu復(fù)合粉末。通過對CNTs/Cu復(fù)合粉末的粒度中位徑D50和松裝密度檢測,得到在CNTs含量為0.25wt%時,經(jīng)過化學(xué)鍍銅的CNTs/Cu復(fù)合粉末的粒度D50和松裝密度分別由50.91μm和2.67g/cm3下降到39.12μm和2.24g/cm3;并通過真空熱壓成型后發(fā)現(xiàn)化學(xué)鍍銅CNTs/Cu復(fù)合材料的導(dǎo)電率、抗拉強(qiáng)度和硬度都高于未進(jìn)行化學(xué)鍍銅的CNTs/Cu復(fù)合材料,在CNTs含量為0.25wt%時,未進(jìn)行化學(xué)鍍銅CNTs/Cu復(fù)合粉末和化學(xué)鍍銅CNTs/Cu復(fù)合粉末的導(dǎo)電率分別為62.5%IACS和77.21%IACS,抗拉強(qiáng)度分別為212.50MPa和272.174MPa,硬度分別為34.6Hv和 40.9Hv。
[Abstract]:Carbon nanotubes (CNTs) are characterized by low density, high strength, large specific surface area, excellent conductivity and thermal conductivity, low thermal expansion coefficient and strong acid and alkali resistance. However, there are some disadvantages such as easy agglomeration and poor wettability. In this paper, the surface of CNTs was modified by electroless copper plating, and the CNTs/Cu composite was prepared by powder metallurgy. The effects of electroless copper plated CNTs and original CNTs on the properties of CNTs/Cu composites were compared. The pretreatment process of CNTs was studied. The purification and activation of CNTs were investigated. Effects of sensitization process on surface properties of carbon nanotubes. The process parameters of electroless copper plating on CNTs were studied by coating an activated layer of PD and SnO particles on the surface of CNTs. The formula of electroless plating solution is composed of reducing agent NaBH4, copper salt CuSO4 路5H20, complexing agent, stabilizer and dispersant. The pH value of plating solution, plating time and plating temperature are studied by single factor method. The effect of CNTs concentration on the electroless copper plating on CNTs was studied. The uniformity and continuity of copper coating on CNTs surface were analyzed by TEM XRDX SEME-EDS. The interfacial structure of electroless copper plating on CNTs was studied under the optimum technological conditions of 30 min t ~ (50 鈩，

本文編號：1447944