發(fā)布時(shí)間：2018-01-03 20:31

  本文關(guān)鍵詞：時(shí)效處理對(duì)含銅不銹鋼耐蝕性能的影響　出處：《南京理工大學(xué)》2017年碩士論文　論文類(lèi)型：學(xué)位論文

  更多相關(guān)文章： 含銅不銹鋼 時(shí)效處理 富銅相 晶界敏化 耐蝕性能

【摘要】：含銅抗菌不銹鋼是通過(guò)在普通不銹鋼的基礎(chǔ)上添加一定量的銅而制成的一種新型結(jié)構(gòu)功能一體化材料。它的良好而持久的抗菌性能是源自不銹鋼在固溶、時(shí)效處理中析出的富銅相。然而,時(shí)效往往會(huì)使材料的耐蝕性能降低,一定程度上限制了材料的實(shí)際應(yīng)用。因此,研究含銅抗菌不銹鋼時(shí)效后耐蝕性降低的機(jī)理,對(duì)于促進(jìn)含銅不銹鋼的實(shí)際應(yīng)用具有重要意義。本文通過(guò)對(duì)普通不銹鋼和含銅不銹鋼進(jìn)行不同的時(shí)效處理,對(duì)比研究了時(shí)效處理對(duì)含銅不銹鋼耐蝕性能的影響及相關(guān)機(jī)制。采用了如下的分析和表征手段:雙環(huán)動(dòng)電位再極化、動(dòng)電位極化和靜電位極化方法分析不同熱處理狀態(tài)下材料的耐蝕性能;透射電鏡、3D原子探針?lè)治龊~不銹鋼時(shí)效過(guò)程的析出相,光學(xué)顯微鏡、激光共聚焦顯微鏡分析材料表面的腐蝕形貌。實(shí)驗(yàn)結(jié)果表明:含銅304L不銹鋼最易發(fā)生晶界敏化的時(shí)效溫度為735℃,該溫度下發(fā)生晶界敏化的時(shí)間為1.4h;700℃時(shí)效10h,隨著時(shí)效時(shí)間的延長(zhǎng),含銅304L不銹鋼的點(diǎn)蝕電位從230mV下降到160mV,耐晶間腐蝕性能和耐點(diǎn)蝕性能均降低;相同時(shí)效狀態(tài)下,含銅不銹鋼的耐晶間腐蝕性能和耐點(diǎn)蝕性能均比普通不銹鋼低。造成含銅不銹鋼發(fā)生敏化現(xiàn)象、進(jìn)而降低其耐晶間腐蝕和耐點(diǎn)蝕性能的原因是富銅相的析出,而不是碳化物的析出。而且,由于富銅相具有快速的形核能力,含銅不銹鋼發(fā)生晶界敏化所需的時(shí)間更短(700℃下時(shí)效,含銅304L不銹鋼發(fā)生敏化的時(shí)間為2h,普通304L不銹鋼發(fā)生敏化的時(shí)間為10h),敏化溫度區(qū)間更大。但由于富銅相的長(zhǎng)大速率降低,含銅不銹鋼的敏化速率隨時(shí)效時(shí)間的增加而逐漸降低。
[Abstract]:Copper-containing antibacterial stainless steel is a new kind of structure-functional integrative material which is made by adding a certain amount of copper on the basis of common stainless steel. Its good and lasting antibacterial properties are derived from the solid solution of stainless steel. The copper-rich phase precipitated in aging treatment. However, aging will often reduce the corrosion resistance of the material, which limits the practical application of the material to a certain extent. It is of great significance to study the mechanism of corrosion resistance reduction of copper containing antibacterial stainless steel after aging, which is of great significance to promote the practical application of copper containing stainless steel. In this paper, different aging treatment of common stainless steel and copper containing stainless steel is carried out. The effect of aging treatment on corrosion resistance of copper containing stainless steel and its related mechanism were studied. The following means of analysis and characterization were used: double cyclic potentiodynamic repolarization. The corrosion resistance of materials under different heat treatment conditions was analyzed by potentiodynamic polarization and electrostatic potential polarization. The precipitation phase and optical microscope of the aging process of copper-containing stainless steel were analyzed by transmission electron microscope (TEM) and 3D atomic probe. The surface corrosion morphology of the material was analyzed by laser confocal microscopy. The experimental results showed that the aging temperature of grain boundary sensitization of 304L stainless steel containing copper was 735 鈩，

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