【摘要】：超聲成像技術(shù)在醫(yī)學(xué)診斷、無損檢測、超聲顯微鏡和水下探測等多個領(lǐng)域內(nèi)具有廣泛的應(yīng)用前景。超聲波換能器是超聲成像設(shè)備的核心部件，傳統(tǒng)的壓電式超聲波換能器由于種種限制已不能滿足現(xiàn)代超聲檢測的需求，而新型的電容式超聲波換能器（CMUT）以其靈敏度高、頻帶寬、與介質(zhì)阻抗匹配及適合制造集成陣列等優(yōu)勢已逐漸成為各國的研究熱點(diǎn)，被認(rèn)為是下一代超聲傳感器的發(fā)展方向。 本文在研究了超聲成像理論的基礎(chǔ)上，結(jié)合現(xiàn)有的加工技術(shù)，設(shè)計了適用于水下超聲成像的一維16元CMUT線陣，并針對線陣的設(shè)計、加工、封裝及性能測試等開展了較為詳細(xì)的研究，具體研究內(nèi)容如下： （1）對超聲成像換能器陣列輻射聲場及指向性問題進(jìn)行了研究；分析了一維線陣聲束的聚焦、偏轉(zhuǎn)，并對影響超聲成像圖像質(zhì)量的空間分辨率和偽像問題進(jìn)行了簡單的研究分析。 （2）根據(jù)ANSYS有限元仿真確定了敏感單元的結(jié)構(gòu)尺寸以及工作電壓、塌陷電壓、靜態(tài)電容、變化電容和輸出電流等性能參數(shù)；在敏感單元的設(shè)計基礎(chǔ)上，研究了陣元間距、陣元寬度及陣元數(shù)目對一維線陣指向性的影響，，并確定了一維線陣的結(jié)構(gòu)參數(shù)。 （3）結(jié)合現(xiàn)有的加工工藝水平及實(shí)驗(yàn)室前期的加工經(jīng)驗(yàn)，優(yōu)化了基于硅-硅鍵合的加工工藝路線并完成了一維CMUT線陣的加工；針對換能器線陣面向水下應(yīng)用的需求，設(shè)計了防水性能和透聲性能良好的封裝外殼。 （4）對線陣的表面形貌進(jìn)行了簡單測試，測試發(fā)現(xiàn)器件的實(shí)際尺寸與設(shè)計尺寸基本相符，驗(yàn)證了加工流程的準(zhǔn)確性和可行性；對超聲波換能器發(fā)射和接收超聲波的性能進(jìn)行了測試，并研究了直流偏置電壓和交流激勵電壓對換能器發(fā)射性能的影響；最后利用一維CMUT線陣進(jìn)行了初步的成像實(shí)驗(yàn)，得到了水下目標(biāo)圖像，實(shí)現(xiàn)了水下成像的應(yīng)用初探。
[Abstract]:Ultrasonic imaging technology has been widely used in many fields, such as medical diagnosis, nondestructive testing, ultrasonic microscope and underwater detection. Ultrasonic transducer is the core component of ultrasonic imaging equipment. The traditional piezoelectric ultrasonic transducer can not meet the needs of modern ultrasonic detection due to various limitations, while the new capacitive ultrasonic transducer (CMUT) has high sensitivity. The advantages of frequency bandwidth, matching with dielectric impedance, and suitable for manufacturing integrated arrays have become the research hotspot in many countries, and are considered to be the development direction of next generation ultrasonic sensors. In this paper, based on the research of ultrasonic imaging theory and combined with the existing processing technology, a one-dimensional 16-element CMUT linear array for underwater ultrasonic imaging is designed, and the linear array is designed and processed. Packaging and performance testing are studied in detail. The main contents are as follows: (1) the acoustic field and directivity of ultrasonic imaging transducer array are studied. The focusing and deflection of one dimensional linear array sound beam are analyzed, and the spatial resolution and artifacts which affect the image quality of ultrasonic imaging are simply studied and analyzed. (2) according to the ANSYS finite element simulation, the structure size, the working voltage, the collapse voltage, the static capacitance, the variable capacitance and the output current of the sensitive unit are determined. Based on the design of sensitive elements, the effects of array spacing, element width and number of elements on the directivity of one-dimensional linear array are studied, and the structural parameters of one-dimensional linear array are determined. (3) based on the existing processing technology level and the experience in laboratory, the process route based on silicon-silicon bonding is optimized and the one-dimensional CMUT linear array processing is completed. In order to meet the need of underwater application of transducer linear array, a package with good waterproof and sound permeability was designed. (4) the surface morphology of the linear array is simply tested, and it is found that the actual size of the device is basically consistent with the design size, which verifies the accuracy and feasibility of the machining process. The performance of ultrasonic transducer was tested, and the effects of DC bias voltage and AC excitation voltage on the performance of ultrasonic transducer were studied. Finally, a preliminary imaging experiment is carried out using one dimensional CMUT linear array, and the underwater target image is obtained, which realizes the application of underwater imaging.
【學(xué)位授予單位】：中北大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TB552

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