電子束蒸發(fā)法沉積金屬聚合物基復(fù)合薄膜成膜機理及其性能研究
發(fā)布時間:2018-06-20 05:31
本文選題:電子束蒸發(fā)法 + Cu/PE薄膜 ; 參考:《南京理工大學(xué)》2017年碩士論文
【摘要】:以銅、銀等納米材料為代表的抗菌材料以其高效的抗菌性能,在生活中有廣泛的應(yīng)用潛力,也成為當(dāng)代科研的熱點。與此同時,具有防污,自清潔的疏水材料也是目前人們追求的潮流,因此本文基于聚合物的疏水特性,再結(jié)合納米銀、銅顆粒的高效抗菌性能,采用低功率電子束蒸發(fā)法(EBD),制備既具有疏水性能,又具有高效抗菌性能的多功能復(fù)合膜材料。主要研究內(nèi)容如下:采用低功率電子束蒸發(fā)法,分別選用乙酸銅粉末、聚乙烯粉末為原材料,使用單晶硅片、石英片、氯化鈉片為基底,制備摻銅聚合物基復(fù)合薄膜。氮氣氣氛下,在300-500℃范圍內(nèi),通過管式爐對初始態(tài)薄膜樣品進(jìn)行熱處理,通過Tg觀察了復(fù)合薄膜結(jié)構(gòu)成分變化,XPS分析復(fù)合薄膜的元素組成、FTIR和UV-vis分析復(fù)合薄膜表面的內(nèi)部成分,TEM和SEM觀察了薄膜的表面形貌,所制備的的復(fù)合薄膜為銅納米顆粒均勻分布于聚合物基膜中的兩相結(jié)構(gòu)。復(fù)合薄膜具有一定的疏水性能,同時對大腸桿菌有著比較明顯的抗菌效果。采用低功率電子束蒸發(fā)法,以硝酸銀粉末為銀源,分別以聚甲基丙烯酸甲酯、聚乙烯、聚乳酸為聚合物基體材料,采用上述相同的制備工藝參數(shù),制備銀摻雜不同聚合物基復(fù)合薄膜。在氮氣氣氛下,75-225℃范圍內(nèi),通過管式爐對初始態(tài)薄膜樣品進(jìn)行熱處理,得到了銀納米顆粒均勻分布于不同聚合物基膜中的兩相結(jié)構(gòu)。經(jīng)過UV-vis、FTIR、XPS等測試手段研究薄膜成分和結(jié)構(gòu),探究電子束蒸發(fā)法制備金屬聚合物基復(fù)合薄膜的成膜機理。
[Abstract]:The antibacterial materials, such as copper, silver and other nanomaterials, with their high antibacterial properties, have wide application potential in daily life, and have also become the focus of contemporary scientific research. At the same time, anti-fouling, self-cleaning hydrophobic materials are also the current trend, so this paper based on the hydrophobic properties of polymers, and combined with nano-silver, copper particles of high efficiency antibacterial properties, Low power electron beam evaporation (EBD) method was used to prepare multifunctional composite membrane materials with both hydrophobic and antibacterial properties. The main contents are as follows: copper doped polymer based composite films were prepared by low power electron beam evaporation, copper acetate powder, polyethylene powder as raw material, single crystal silicon wafer, quartz wafer and sodium chloride as substrate. In nitrogen atmosphere, the initial thin film samples were treated by tube furnace in the range of 300-500 鈩,
本文編號:2043151
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