本文選題：激光 + 銅膜��； 參考：《天津大學(xué)》2014年碩士論文

【摘要】：金屬薄膜在MEMS設(shè)備制造,航空航天,半導(dǎo)體加工等眾多領(lǐng)域均有廣泛的應(yīng)用。在金屬薄膜上制作微結(jié)構(gòu)的方法很多,本文針對使用激光直寫技術(shù)在銅薄膜上制作微結(jié)構(gòu)進(jìn)行了理論分析和實驗研究。本文針對實際加工的需求,提出了不同的實驗方法,論文的主要工作包括以下幾個部分:1.從理論角度分析了激光與材料相互作用的機(jī)理,描述了金屬對激光的反射和吸收,并利用雙溫模型描述了熱量在材料中的傳播過程。通過激光的能量密度公式推導(dǎo)出脈沖能量的對數(shù)與燒蝕點直徑的平方呈線性關(guān)系。通過累積模型提出運動的光斑燒蝕銅膜的模型。2.以中心波長為355 nm的固態(tài)激光器為核心設(shè)計并搭建了一套紫外納秒脈沖激光加工系統(tǒng)。系統(tǒng)運動控制核心為PMAC運動控制卡,PMAC通過擴(kuò)展卡將輸出信號發(fā)送給位移臺的驅(qū)動電機(jī),進(jìn)而控制位移臺的運動方式。上位機(jī)軟件通過通訊接口控制激光器的參數(shù)并向PMAC發(fā)送指令,通過對激光器和位移臺的協(xié)調(diào)控制實現(xiàn)對樣品的加工。3.本文使用搭建的紫外納秒脈沖激光加工系統(tǒng)進(jìn)行了脈沖激光燒蝕銅膜的實驗,實驗使用的銅膜厚度為200 nm。實驗主要分為兩部分:單脈沖燒蝕銅膜和激光在銅膜上直寫直線結(jié)構(gòu)。通過實驗得到激光脈沖能量和燒蝕點直徑的關(guān)系,以及使用本系統(tǒng)加工金屬薄膜時,能夠獲得較好加工效果所需要的參數(shù)。此外還將銅膜放置在焦平面外進(jìn)行燒蝕實驗。實驗發(fā)現(xiàn)將銅膜放置在焦平面外一定距離時,加工效果較為理想,這種加工方式適合加工尺寸較大的微結(jié)構(gòu)。
[Abstract]:Metal thin films are widely used in many fields, such as MEMS equipment manufacturing, aerospace, semiconductor processing and so on. There are many methods to fabricate microstructures on metal thin films. In this paper, the theoretical analysis and experimental study on the fabrication of microstructures on copper thin films by laser direct writing have been carried out. According to the requirement of practical processing, different experimental methods are put forward in this paper. The main work of this paper includes the following parts: 1: 1. The mechanism of laser interaction with materials is analyzed theoretically, the reflection and absorption of metal to laser are described, and the heat propagation process in materials is described by double temperature model. A linear relationship between the logarithm of pulse energy and the square of ablation point diameter is derived by the formula of laser energy density. Based on the cumulative model, the model of moving spot ablating copper film is proposed. A UV nanosecond pulse laser processing system is designed and built based on 355nm solid-state laser with center wavelength of 355nm. The motion control core of the system is the PMAC motion control card, which sends the output signal to the driving motor of the displacement table through the extension card, and then controls the motion mode of the displacement table. The upper computer software controls the parameters of the laser and sends instructions to the PMAC through the communication interface. Through the coordinated control of the laser and the displacement table, the processing of the sample is realized. 3. In this paper, the experiment of pulsed laser ablation of copper film has been carried out by using the UV nanosecond pulsed laser processing system. The thickness of the copper film used in the experiment is 200 nm. The experiment is mainly divided into two parts: monopulse ablating copper film and laser direct writing straight line structure on copper film. The relationship between laser pulse energy and ablation point diameter is obtained by experiments, and the parameters needed for better machining effect can be obtained when the system is used to process metal films. In addition, the copper film was placed outside the focal plane for ablation experiments. It is found that when the copper film is placed at a certain distance outside the focal plane, the processing effect is ideal, and this kind of processing method is suitable for machining the microstructures with larger size.
【學(xué)位授予單位】：天津大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2014
【分類號】：TN249;TB383.2;TG146.11

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