本文選題：HDI印制電路板 + CO_2激光鉆孔��； 參考：《重慶大學(xué)》2014年碩士論文

【摘要】：印制電路板（Printed Circuit Board簡稱PCB）是各種電子產(chǎn)品的基礎(chǔ)，其主要功能是支撐電子元器件，并實(shí)現(xiàn)元器件之間的電信號(hào)連通。隨著電子技術(shù)的不斷進(jìn)步，電子產(chǎn)品不斷向輕、薄、短、小的方向發(fā)展，高密度互連（High DensityInterconnection,HDI）技術(shù)便應(yīng)運(yùn)而生。隨著HDI印制電路板朝著高密度化的方向發(fā)展，對HDI制備技術(shù)要求越來越高。本文主要對HDI板制作過程中的共性關(guān)鍵技術(shù)進(jìn)行研究，并將研究成果應(yīng)用于10層二階陰陽HDI板工業(yè)試生產(chǎn)中。論文研究的主要結(jié)果如下： 1.HDI板微盲孔成孔工藝。以微盲孔的孔型為優(yōu)化目標(biāo)，應(yīng)用單純形優(yōu)化技術(shù)，對CO2激光成孔工藝參數(shù)實(shí)施優(yōu)化，獲得的100μm的微盲孔優(yōu)化工藝參數(shù)為：脈寬13.8μs，脈沖能量14.8mJ，脈沖次數(shù)2，光圈（Mask）2.2mm。工藝參數(shù)對真圓度影響關(guān)系為：脈沖能量脈沖寬度脈沖次數(shù)Mask；對上下孔徑比的影響關(guān)系為：Mask脈沖能量脈沖寬度脈沖次數(shù)。在優(yōu)化工藝參數(shù)條件下，100μm微盲孔的真圓度為99.32%、上下孔徑比為82.36%，該孔型能夠充分滿足后續(xù)生產(chǎn)的要求； 2.微盲孔填鍍工藝。以不溶性材料—鈦籃，，作為陽極，系統(tǒng)研究了填孔電流密度與微盲孔填鍍效果的關(guān)系。實(shí)驗(yàn)結(jié)果表明：小電流密度下，微盲孔填充率較高，但是填鍍時(shí)間較長，生產(chǎn)效率較低；大電流密度下，雖然電鍍時(shí)間縮短，但是微盲孔內(nèi)出現(xiàn)空洞，嚴(yán)重影響電信號(hào)傳輸及其穩(wěn)定性。在進(jìn)一步研究電流密度與微盲孔填鍍爆發(fā)期關(guān)系的基礎(chǔ)上，提出了采用組合電鍍工藝參數(shù)的設(shè)想。在組合電鍍工藝參數(shù)為：1.8A/dm2×15min+1.0A/dm2×30min+1.8A/dm2×15min的條件下，微盲孔填充率高（96.1%）、電鍍時(shí)間短，極大地提高了生產(chǎn)效率。 3.階梯線路制作工藝。提出了一種流程簡單、無磨板、制作成本低廉的階梯線路板制作工藝，并通過優(yōu)選抗蝕劑類型，建立15μm/30μm與15μm/45μm兩種階梯板的蝕刻補(bǔ)償關(guān)系，成功實(shí)現(xiàn)了HDI階梯線路板制作，形成了具有原創(chuàng)知識(shí)產(chǎn)權(quán)的HDI階梯線路板制作技術(shù)。 4.共性關(guān)鍵技術(shù)用于試生產(chǎn)。利用博敏電子股份有限公司的工業(yè)生產(chǎn)線，將本文研究成果應(yīng)用于試制“10層二階陰陽HDI電路板”，獲得了合格率為77.9%的10層二階陰陽HDI電路板，為這些共性關(guān)鍵技術(shù)的工業(yè)應(yīng)用奠定了基礎(chǔ)。
[Abstract]:Printed Circuit Board (PCB) is the basis of all kinds of electronic products. Its main function is to support electronic components and to realize electrical signal connectivity between components. With the development of electronic technology and the development of electronic products in the direction of light, thin, short and small, the high density interconnection (HDI) technology emerges as the times require. With the development of high density HDI PCB, HDI fabrication technology is becoming more and more important. In this paper, the common key technologies in the process of making HDI boards are studied, and the results are applied to the industrial trial production of 10 layers of second-order Yin and Yang HDI boards. The main results are as follows: 1. HDI plate microblind hole forming process. Aiming at the hole shape of microblind hole, the optimization parameters of CO _ 2 laser were optimized by simplex optimization technique. The optimized parameters of 100 渭 m microblind hole were obtained as follows: pulse width 13.8 渭 s, pulse energy 14.8mJ, pulse number 2, aperture (Mask) 2.2mm. The effect of processing parameters on true roundness is as follows: the pulse number of pulse energy pulse width Maskand the relation of influence on the ratio of upper and lower aperture is the number of times of pulse width of energy pulse with the ratio of up and down Mask pulse. Under the optimized technological parameters, the true roundness of 100 渭 m microblind hole is 99.32, the ratio of upper and lower aperture is 82.36, the pass can fully meet the requirements of subsequent production; 2. Microblind hole filling plating process. The relationship between the filling current density and the effect of microblind hole plating was systematically studied with the insoluble material titanium basket as the anode. The experimental results show that the filling rate of microblind holes is higher at low current density, but the filling time is longer and the production efficiency is low. At high current density, although the electroplating time is shortened, there are holes in the microblind holes. The transmission and stability of electrical signals are seriously affected. Based on the further study of the relationship between the current density and the explosive period of microblind hole filling plating, the assumption of adopting the combined electroplating process parameters is put forward. Under the condition that the combined electroplating process parameter is: 1: 1.8 A / r / dm 2 脳 15min 1.0A/dm2 脳 30min 1.8A/dm2 脳 15min, the microblind hole filling rate is high (96.1%), the electroplating time is short, and the production efficiency is greatly improved. Ladder circuit manufacturing process. In this paper, a simple process, no grinding board and low cost step circuit board fabrication technology is proposed. By selecting the type of corrosion inhibitor, the etching compensation relationship between 15 渭 m / 30 渭 m and 15 渭 m / 45 渭 m step boards is established, and the HDI ladder circuit board fabrication is successfully realized. Has formed the original intellectual property right HDI ladder circuit board manufacture technology. 4. Common key technologies are used in trial production. Using the industrial production line of Bomin Electronics Co., Ltd., the research results of this paper are applied to the trial production of "10 layers of second order Yin and Yang HDI Circuit Board". The 10 layers of second order yin and yang HDI circuit board with a qualified rate of 77.9% are obtained. It lays a foundation for the industrial application of these common key technologies.
【學(xué)位授予單位】：重慶大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2014
【分類號(hào)】：TN41

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