【摘要】：芯片真空拾取與貼裝是完成芯片從晶圓盤轉(zhuǎn)移至基板電路并實(shí)現(xiàn)電氣互連組裝極為關(guān)鍵的工藝過程。隨著IC芯片超薄化和I/0密度越來越高,可靠高效的真空拾取與貼裝工藝對降低封裝成本,改善封裝性能和器件可靠性等具有重要意義。本文從工藝機(jī)理建模、工藝分析和實(shí)驗(yàn)驗(yàn)證等方面對真空拾取和貼裝工藝進(jìn)行了深入系統(tǒng)地研究,建立了超薄芯片真空拾取與高密度貼裝的理論工藝窗口。本文主要研究工作和創(chuàng)新之處在于以下幾個方面：1)建立超薄芯片-厚膠層-基板粘接結(jié)構(gòu)的分層理論模型,實(shí)現(xiàn)精確的超薄芯片組件翹曲和界面應(yīng)力理論預(yù)測；建立了表面加載分布力載荷的芯片-較薄膠層-基板的力學(xué)模型,為描述真空拾取工藝提供理論支撐。2)基于理論解析,建立了真空拾取工藝的理論模型,并通過二分法算法實(shí)現(xiàn)了真空吸附作用下有效藍(lán)膜長度的理論計(jì)算。引入界面剝離能量釋放率和拾取力來評估真空拾取工藝可靠性,揭示了真空吸附作用下的芯片-粘膠-藍(lán)膜結(jié)構(gòu)的界面剝離機(jī)理以及芯片大小和厚度、真空負(fù)壓、藍(lán)膜厚度與材料等因素對工藝可靠性的影響,理論預(yù)測了拾取位移不斷增大條件下真空拾取超薄芯片的界面剝離過程,建立了超薄芯片真空拾取的理論工藝窗口。3)基于Hele-Shaw擠壓流體模型,輔助芯片引腳捕捉導(dǎo)電粒子數(shù)量的實(shí)驗(yàn)研究,實(shí)現(xiàn)了高密度超薄芯片貼裝過程的理論描述,研究了引腳間距、各向異性導(dǎo)電膠(ACA)粘度和壓力等因素對芯片貼裝過程和導(dǎo)電粒子壓縮變形的影響�；诜謱永碚�,精確計(jì)算了貼裝過程中超薄芯片組件發(fā)生的翹曲位移,研究了芯片-ACA-柔性基板結(jié)構(gòu)尺寸和材料對芯片翹曲程度的影響,提出了減小超薄芯片組件翹曲的方法。4)搭建真空拾取工藝實(shí)驗(yàn)平臺,進(jìn)行了不同真空負(fù)壓下的拾取力和拾取位移等關(guān)鍵工藝參數(shù)的定量測試,驗(yàn)證了本文真空拾取理論模型的有效性；進(jìn)行了系統(tǒng)的拾取工藝實(shí)驗(yàn)研究,提出了一種高效可靠的超薄芯片拾取工藝方法和機(jī)械裝置。同時,進(jìn)行了超薄芯片熱壓貼裝實(shí)驗(yàn)和翹曲位移測試,實(shí)驗(yàn)測試結(jié)果與分層理論預(yù)測結(jié)果基本一致。
[Abstract]:Chip vacuum pickup and mounting is the key process to complete the chip transfer from the wafer to the substrate circuit and to realize the electrical interconnection and assembly. With the IC chip thinning and the increasing density of I / O, the reliable and efficient vacuum pickup and mount process is of great significance to reduce the packaging cost, improve the packaging performance and device reliability. In this paper, the vacuum pickup and mounting process is studied systematically from the aspects of process mechanism modeling, process analysis and experimental verification, and the theoretical process window of vacuum pickup and high density mounting of ultra-thin chip is established. The main research work and innovations in this paper are as follows: 1) to establish a layered theoretical model of ultra-thin chip-thick adhesive lamina-substrate bonding structure to achieve accurate prediction of warping and interfacial stress of ultra-thin chipsets; A mechanical model of chip, thin rubber layer and substrate with distributed force loading on the surface is established, which provides theoretical support for describing vacuum pickup process. 2) based on theoretical analysis, a theoretical model of vacuum pickup process is established. The theoretical calculation of the effective blue film length under vacuum adsorption is realized by the dichotomy algorithm. The reliability of vacuum pickup process is evaluated by introducing the energy release rate and picking force of interface stripping. The mechanism of interface stripping of chip-viscose blue film structure under vacuum adsorption, chip size and thickness, vacuum negative pressure are revealed. The influence of blue film thickness and material on the process reliability is discussed theoretically. The interface stripping process of vacuum pickup ultra-thin chip is predicted under the condition of increasing pickup displacement. The theoretical and technological window of vacuum pickup of ultra-thin chip is established. 3) based on the Hele-Shaw squeeze fluid model, the experimental research on the number of conductive particles in the chip pin is carried out, and the theoretical description of the mounting process of the ultra-thin chip with high density is realized. The effects of pin spacing, viscosity and pressure of anisotropic conductive adhesive (ACA) on the chip mounting process and compression deformation of conductive particles were studied. Based on delamination theory, the warpage displacement of ultra-thin chipsets in the process of mounting is accurately calculated, and the effects of chip ACA- flexible substrate structure size and material on the chip warping degree are studied. A method to reduce the warpage of ultra-thin chipsets is proposed. 4) the experimental platform of vacuum pickup process is built and the key technological parameters such as picking force and pickup displacement under different vacuum negative pressure are measured quantitatively. The validity of the theoretical model of vacuum pickup is verified. An efficient and reliable picking process method and mechanical device for ultra-thin chip are proposed. At the same time, the hot pressing experiment and the warpage displacement test of the ultra-thin chip are carried out, and the experimental results are in good agreement with the prediction results of stratification theory.
【學(xué)位授予單位】：華中科技大學(xué)
【學(xué)位級別】：博士
【學(xué)位授予年份】：2016
【分類號】：TN405

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