本文關(guān)鍵詞：基于并聯(lián)柔順機(jī)構(gòu)共面平衡的晶圓交接關(guān)鍵技術(shù)研究　出處：《哈爾濱工業(yè)大學(xué)》2017年博士論文　論文類(lèi)型：學(xué)位論文

  更多相關(guān)文章： 晶圓交接 并聯(lián)柔順機(jī)構(gòu) 位姿解算 平面擬合

【摘要】：晶圓交接是晶圓在輸送機(jī)構(gòu)與工件臺(tái)間的傳輸與轉(zhuǎn)移,是光刻流程的開(kāi)始和結(jié)束,其平穩(wěn)性、準(zhǔn)確性和快速性是光刻過(guò)程安全、穩(wěn)定、高效的前提和保證。平穩(wěn)性可以減小碰撞和應(yīng)力集中,避免晶圓破損;準(zhǔn)確性可以保證晶圓交接位姿滿(mǎn)足對(duì)準(zhǔn)測(cè)量的要求;快速性與最終產(chǎn)率息息相關(guān)。作為晶圓交接中的核心部件,并聯(lián)柔順機(jī)構(gòu)結(jié)構(gòu)輕量緊湊,運(yùn)動(dòng)平滑連續(xù),在平穩(wěn)快速方面具有優(yōu)勢(shì)。但柔性單元的多自由度帶來(lái)了復(fù)雜的運(yùn)動(dòng)行為,同時(shí)柔性結(jié)構(gòu)加工裝配困難使交接面位姿存在差異,這些都給并聯(lián)柔順機(jī)構(gòu)的結(jié)構(gòu)設(shè)計(jì)、位姿分析以及運(yùn)動(dòng)控制增加了難度,影響晶圓交接的平穩(wěn)性、準(zhǔn)確性和快速性,成為制約并聯(lián)柔順機(jī)構(gòu)在光刻機(jī)晶圓交接中應(yīng)用的關(guān)鍵技術(shù)瓶頸。本文旨在解決光刻機(jī)中晶圓交接平穩(wěn)性、準(zhǔn)確性和快速性的實(shí)現(xiàn)問(wèn)題。本文在建立并聯(lián)柔順機(jī)構(gòu)整體柔度模型的基礎(chǔ)上,針對(duì)晶圓吸附過(guò)程分析了交接面柔性支撐晶圓達(dá)到共面平衡的作用機(jī)理,從而提出基于并聯(lián)柔順機(jī)構(gòu)共面平衡的晶圓位姿解算方法,并利用最小區(qū)域平面擬合方法準(zhǔn)確提供位姿解算必須的交接面信息,達(dá)到了晶圓平穩(wěn)、準(zhǔn)確交接的目的。同時(shí)針對(duì)柔性臂運(yùn)動(dòng)過(guò)程提出限幅下時(shí)間最優(yōu)的高精度運(yùn)動(dòng)定位方法,實(shí)現(xiàn)了快速、高精度的晶圓交接。論文的主要研究?jī)?nèi)容如下:針對(duì)現(xiàn)有簡(jiǎn)單柔性單元模型無(wú)法完整、準(zhǔn)確的描述并聯(lián)柔順機(jī)構(gòu)整體柔度特性和交接中晶圓位姿變化的問(wèn)題,建立了并聯(lián)柔順機(jī)構(gòu)整體柔度模型,并基于特征旋量的方法對(duì)整體柔度矩陣進(jìn)行柔度分析,優(yōu)化結(jié)構(gòu)參數(shù)使工作方向特征柔度滿(mǎn)足平穩(wěn)性要求。在整體柔度模型與交接面準(zhǔn)確位姿研究的基礎(chǔ)上,提出基于并聯(lián)柔順機(jī)構(gòu)共面平衡的晶圓位姿解算方法。該方法中,柔性臂末端的交接面與晶圓發(fā)生相互作用達(dá)到共面平衡,交接面產(chǎn)生了小角度旋轉(zhuǎn)與小范圍平移,通過(guò)坐標(biāo)變換得到柔性結(jié)構(gòu)的相應(yīng)變形,建立平衡方程和幾何約束方程,實(shí)現(xiàn)晶圓交接位姿的準(zhǔn)確解算,然后分析了交接面位姿對(duì)晶圓交接位姿的影響。分析結(jié)果表明,并聯(lián)柔順機(jī)構(gòu)可極大地減小交接面高度差異產(chǎn)生的晶圓傾斜,可以自行調(diào)整交接面初始傾斜實(shí)現(xiàn)交接共面,同時(shí)消除點(diǎn)接觸引起的應(yīng)力集中問(wèn)題,使晶圓交接更加平穩(wěn)。最后對(duì)晶圓交接位姿解算方法進(jìn)行了實(shí)驗(yàn)驗(yàn)證,結(jié)果表明,晶圓交接共面平衡位姿的實(shí)驗(yàn)結(jié)果與理論分析結(jié)果偏差小于0.2mrad,驗(yàn)證了晶圓交接位姿解算方法的正確性和有效性。針對(duì)交接面位姿平面擬合中存在求取最小區(qū)域精確解與高效可靠處理大量離散點(diǎn)數(shù)據(jù)之間難以兼顧的問(wèn)題,提出一種逐步縮小約束區(qū)域的凸殼投影最小區(qū)域平面擬合方法。該方法通過(guò)縮小平面法向量的約束區(qū)域減小搜索范圍,在處理大量凸殼點(diǎn)時(shí)可以快速定位到目標(biāo)區(qū)域,結(jié)合基于凸殼棱邊投影的計(jì)算幾何方法計(jì)算得到最小區(qū)域精確解。分別對(duì)多種典型數(shù)據(jù)集和交接面的實(shí)測(cè)數(shù)據(jù)集進(jìn)行平面擬合,結(jié)果表明,該方法可以得到與現(xiàn)有多種典型算法相等或更優(yōu)的最小區(qū)域解,同時(shí)可以高效可靠處理大量離散點(diǎn)數(shù)據(jù),實(shí)現(xiàn)了交接面最小區(qū)域平面擬合的精確求解,保證了晶圓交接的準(zhǔn)確性。針對(duì)并聯(lián)柔順機(jī)構(gòu)晶圓交接中時(shí)間最優(yōu)與高精度跟蹤指令運(yùn)動(dòng)以及控制幅值限制間難以兼顧的問(wèn)題,建立了并聯(lián)柔順機(jī)構(gòu)晶圓交接運(yùn)動(dòng)模型,并提出了一種零相位誤差跟蹤和限幅的最小拍方法。該方法在原有最小拍方法基礎(chǔ)上,通過(guò)調(diào)整控制拍數(shù)滿(mǎn)足幅值限制,利用無(wú)振蕩和時(shí)間最優(yōu)建立非齊次線(xiàn)性方程組來(lái)求解每拍的控制量,同時(shí)結(jié)合零相位誤差跟蹤環(huán)節(jié),實(shí)現(xiàn)限幅下最優(yōu)運(yùn)動(dòng)時(shí)間與高精度跟蹤定位。仿真結(jié)果表明,在滿(mǎn)足輸入電壓幅值小于等于6伏的要求下,系統(tǒng)經(jīng)過(guò)4個(gè)采樣周期8ms完成100μm的定位運(yùn)動(dòng),階躍響應(yīng)準(zhǔn)確、穩(wěn)定,同時(shí)有良好的快速跟蹤性能。最后,搭建了實(shí)驗(yàn)平臺(tái),對(duì)并聯(lián)柔順機(jī)構(gòu)的性能以及晶圓交接技術(shù)進(jìn)行了實(shí)驗(yàn)研究。結(jié)果表明,并聯(lián)柔順機(jī)構(gòu)在交接位附近可以實(shí)現(xiàn)1μm的分辨力,100μm階躍響應(yīng)調(diào)節(jié)時(shí)間為8ms,相比傳統(tǒng)交接方法時(shí)間縮短了59.4%,定位誤差為2μm。晶圓交接實(shí)驗(yàn)采用零相位誤差跟蹤和限幅最小拍方法完成時(shí)間為0.454s,相比傳統(tǒng)交接方法縮短9.9%,驗(yàn)證了新方法的正確性和有效性,實(shí)現(xiàn)了快速高精度的晶圓交接。
[Abstract]:The transfer of wafer in wafer conveying transmission and transfer mechanism and the workpiece table between the start and end of the lithography process, stability, accuracy and rapidity of the lithography process is safe, stable and efficient. The premise and guarantee of stability can reduce the collision and the stress concentration, avoid wafer breakage; can ensure the accuracy of wafer transfer to meet the requirements of pose alignment measurement; fast and is closely related to the final yield. As a core component of wafer handover in parallel, compliant mechanism structure lightweight and compact, smooth and continuous movement, has advantages in fast and steady. But the flexible element of multi degree of freedom movement brought the complex behavior of a flexible structure and difficult processing and assembling the handover face pose differences, which gave the parallel compliant mechanism design, displacement analysis and motion control to increase the difficulty, influence the stability of wafer transfer, accuracy and Fast, has become key technology bottlenecks in the application of parallel compliant mechanism of lithography wafer transfer. This paper aims to solve the smooth circular handover lithography machine MICROTEK, realize the speed and accuracy. Based on the establishment of this parallel compliant mechanism general flexibility model, according to the analysis of the adsorption process wafer interface flexible support to wafer the mechanism of coplanar balance, thus put forward the wafer position based on coplanar parallel balancing of compliant mechanism solution method, and using the minimum zone plane fitting method provides accurate pose calculation interface information must be reached, wafer is stable, accurate transfer. At the same time put forward high precision motion positioning method under the optimal time limit for the flexible arm movement process, to achieve a rapid, high precision wafer transfer. The main contents of this thesis are as follows: according to the existing simple flexible single element model Able to complete, accurate description of the parallel compliant mechanism overall flexibility characteristic and transfer MICROTEK circular posture change, established a parallel compliant mechanism overall flexibility model, and the overall flexibility matrix method for feature torsors based on flexibility analysis, optimization of structure parameters of the work to meet the stability requirement of directional features flexibility in the overall flexibility. The interface model and the exact position on the basis of the research, put forward the wafer pose based on coplanar parallel balance compliant mechanism calculation method. In this method, the interface with the end of the flexible arm wafer interact to produce coplanar balance, the interface of small angle rotation and small range of translation, the corresponding deformation of flexible structures by coordinate transformation, the establishment of equations and geometric constraint equations of equilibrium, achieve accurate pose wafer handover solution, and then analyzes the interface position of the wafer transfer position . analysis results show that the parallel mechanism can greatly reduce the production of soft handover surface height difference of wafer tilt, can adjust the interface to achieve the initial tilt transfer of coplanar, while eliminating stress caused by the contact problem, make the transition more smoothly. At the end of the wafer wafer transfer pose calculation method is verified by experiments. The results show that the experimental results of wafer transfer balance pose coplanar with the theoretical analysis results deviation is less than 0.2mrad, to verify the correctness and effectiveness of the wafer transfer pose calculation method. The minimum area accurate and efficient and reliable treatment is difficult to balance between a large number of discrete data problems in the interface plane pose this presents a narrow convex hull projection plane fitting method of minimum area constraint. The method by reducing the constraint plane normal vector to reduce the search The scope of the handling of large quantity of convex hull points can quickly locate the target region, combined with the exact solution of minimum convex hull edge projection area calculation method based on computational geometry. On several typical data sets and the interface between measured data set plane fitting, results show that the method can be obtained with various existing typical algorithms or equal the better the minimum zone solution, at the same time can be efficient and reliable processing of discrete data, the exact solution of the interface of minimum zone plane fitting, to ensure the accuracy of wafer handover. The parallel mechanism of wafer transfer smooth time optimal and high precision tracking motion and control amplitude constraints difficult to balance, set up parallel transfer wafer motion model of compliant mechanism, and proposes a method of minimum zero phase error tracking and limiting the beat. The original method in the small shoot Based on the method, by adjusting the number of beats to meet the amplitude limit, the oscillation and time optimal control quantity to establish non homogeneous linear equations for each shot, with zero phase error tracking links, to achieve optimal motion amplitude and time limit of high precision tracking. The simulation results show that while the input voltage amplitude less than or equal to 6 volts at the request of the system after the 4 sampling period 8ms completed 100 m positioning movement, the step response is accurate, stable, fast and good tracking performance. Finally, the experimental platform is set up on the performance of parallel compliant mechanism and wafer transfer technology were studied. The results show that the parallel compliant mechanism can achieve 1 m resolution in the transfer of a near 100 m step response settling time is 8ms, compared to the traditional handover method can shorten the time of 59.4%, the positioning error of 2 M. wafer transfer experiments. The zero phase error tracking and limiting minimum beat method is completed at 0.454s, which is shortened by 9.9% compared with the traditional handover method. The correctness and effectiveness of the new method is verified, and the wafer transfer with fast and high accuracy is achieved.

【學(xué)位授予單位】：哈爾濱工業(yè)大學(xué)
【學(xué)位級(jí)別】：博士
【學(xué)位授予年份】：2017
【分類(lèi)號(hào)】：TN405

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