本文關(guān)鍵詞：陶瓷微熱板氣體傳感器陣列及檢測(cè)系統(tǒng)研究　出處：《哈爾濱理工大學(xué)》2015年博士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 微機(jī)電系統(tǒng) 傳感器陣列 氣體傳感器 陶瓷微熱板 熱失穩(wěn)

【摘要】：目前,我國是世界最大的能源化工原料的生產(chǎn)和消費(fèi)國家。能源與化工原料的生產(chǎn)和運(yùn)輸安全形勢(shì)非常嚴(yán)峻,能源化工領(lǐng)域�；沸孤┍ㄊ鹿暑l發(fā),工農(nóng)業(yè)中有毒有害氣體的排放導(dǎo)致大氣污染程度日益突出,要求快捷有效的檢測(cè)手段不斷提高,其中,�；分杏卸居泻怏w的檢測(cè)技術(shù)尤為迫切。采用傳統(tǒng)的傳感器檢測(cè)具有體積大、功耗高、缺乏集成化等缺陷,已無法滿足現(xiàn)代智能化、網(wǎng)絡(luò)化安全檢測(cè)的需要。而采用MEMS傳感器陣列技術(shù)可以滿足氣體傳感器的微型化、集成化、低功耗檢測(cè)要求。MEMS硅基工藝的體硅刻蝕技術(shù)主要適用于微機(jī)械量傳感器,在硅基微熱板氣體傳感器及陣列中存在多種成膜工藝復(fù)雜、兼容性差、熱失配等缺陷。而陶瓷微熱板傳感器及陣列技術(shù)具有工藝簡(jiǎn)單、膜基結(jié)合性及熱匹配性好優(yōu)點(diǎn),有利于納米敏感材料的結(jié)合。特別是優(yōu)良的機(jī)械加工性能,較高的介電系數(shù),在結(jié)構(gòu)上可實(shí)現(xiàn)梁膜結(jié)構(gòu)。本文針對(duì)硅基微熱板氣體傳感器及陣列存在的工藝復(fù)雜性、膜基兼容性差、熱應(yīng)力失配等失穩(wěn)行為,提出了采用氮化鋁陶瓷基MEMS工藝制備陶瓷微熱板傳感器陣列的技術(shù)。解決陶瓷微熱板傳感器陣列的熱干擾問題,及陶瓷基MEMS工藝的光刻剝離技術(shù)和刻蝕技術(shù),實(shí)現(xiàn)了基于Al N陶瓷微熱板氣體傳感器陣列的制備,及對(duì)幾種有毒有害氣體的檢測(cè),并對(duì)檢測(cè)數(shù)據(jù)進(jìn)行了氣敏特性分析和氣敏機(jī)理的探討。主要研究?jī)?nèi)容如下:1.陶瓷微熱板傳感器陣列的熱結(jié)構(gòu)尺度設(shè)計(jì)。根據(jù)陶瓷微熱板熱結(jié)構(gòu)尺度效應(yīng)和陶瓷濕法定向刻蝕難實(shí)現(xiàn)的特點(diǎn),提出可適用于激光微加工刻蝕工藝的熱隔離設(shè)計(jì),通過熱隔離梯形通孔結(jié)構(gòu)實(shí)現(xiàn)熱傳導(dǎo)損結(jié)構(gòu)幾何因子的減小,降低了熱損耗。并給出了熱結(jié)構(gòu)穩(wěn)態(tài)和瞬態(tài)特性及熱應(yīng)力耦合分析,利用ANSYS有限元法進(jìn)行了陶瓷微熱板的熱結(jié)構(gòu)和熱應(yīng)力仿真計(jì)算,確定了設(shè)計(jì)合理性及可行性。2.In-Nb復(fù)合氧化物半導(dǎo)體敏感材料的合成及特性研究。為解決氯氣等強(qiáng)氧化性氣體的高濃度、寬量程、低溫檢測(cè)要求。研究并制備了Sn O2和InNb復(fù)合半導(dǎo)體納米氧化物作為敏感材料,并對(duì)其進(jìn)行了XRD和SEM表征分析。通過不同溫度下納米結(jié)構(gòu)變化規(guī)律特征,給出了氣敏特性和電導(dǎo)特性的影響機(jī)理分析。3.氮化鋁陶瓷微熱板傳感器陣列的制備工藝技術(shù)研究。為改進(jìn)陶瓷襯底表面復(fù)雜形貌金屬成型工藝難實(shí)現(xiàn),及陶瓷基底難加工特點(diǎn),提出了柔性機(jī)械剝離工藝方法和激光微加工工藝方法相結(jié)合的工藝制備技術(shù)。通過柔性機(jī)械剝離工藝法,提高傳統(tǒng)光刻剝離工藝的剝離效果,相對(duì)反轉(zhuǎn)膠剝離工藝法,簡(jiǎn)化了剝離工藝步驟,降低了制備工藝成本。4.氮化鋁陶瓷微熱板傳感器陣列熱失穩(wěn)特性及氣敏特性測(cè)試分析。根據(jù)陣列單元之間的熱耦合特性,提出了陣列單元的四種熱干擾模式,并進(jìn)行了四種模式下的熱干擾測(cè)試分析。對(duì)熱隔離前后的熱響應(yīng)特性進(jìn)行對(duì)比分析,給出了溫度調(diào)至下存在的三種熱響應(yīng)機(jī)制。針對(duì)Cl2、NO2、SO2、CO四種典型有毒有害氣體進(jìn)行了氣敏響應(yīng)特性和靈敏度特性分析,得到了InNb復(fù)合氧化物半導(dǎo)體氣體傳感器陣列,對(duì)氧化性氣體Cl2、NO2能實(shí)現(xiàn)高濃度、寬量程的理想檢測(cè)要求。5.針對(duì)所制備的氮化鋁陶瓷微熱板傳感器陣列,設(shè)計(jì)并實(shí)現(xiàn)了基于ARM Cortex-M3微處理器的數(shù)據(jù)采集檢測(cè)系統(tǒng)。并搭建了可用于有毒有害氣體檢測(cè)的密閉測(cè)試系統(tǒng)平臺(tái),實(shí)現(xiàn)了所制備的陶瓷微熱板傳感器陣列實(shí)時(shí)在線信號(hào)檢測(cè)要求。經(jīng)測(cè)試結(jié)果分析,驗(yàn)證了所制備的陶瓷微熱板氣體傳感器陣列設(shè)計(jì)的合理性及關(guān)鍵工藝技術(shù)的可行性,為陶瓷微熱板傳感器陣列微系統(tǒng)技術(shù)的深入研究和發(fā)展奠定了基礎(chǔ)。
[Abstract]:At present, China is the world's largest energy and chemical raw materials production and consumption country. The production and transportation of chemical raw materials and energy security situation is very serious, the energy and chemical field of hazardous chemicals leakage explosion accidents, toxic and harmful gases in industrial and agricultural emissions lead to air pollution have become increasingly prominent, fast and effective testing means to continuously improve among them, detection of toxic and harmful gases of hazardous chemicals in urgent. The traditional detection sensor has large volume, high power consumption, the lack of integration and other defects, has been unable to meet the needs of modern intelligent network security detection. Using MEMS sensor array technology can meet the miniaturization of integrated gas sensor technical requirements, bulk silicon etching of silicon.MEMS technology of low power detection is mainly applicable to the micro mechanical quantity sensor in silicon based micro hotplate gas sensor array and storage In a variety of film forming process is complex, poor compatibility, thermal mismatch and other defects. The ceramic hotplate and sensor array technology has the advantages of simple process, adhesion and heat, the advantages of good, is a good combination of nanomaterials. Especially excellent mechanical properties, dielectric coefficient is high, the structure of can realize beam membrane structure. According to the process complexity of silicon based micro hotplate gas sensor array and the membrane, poor compatibility, thermal stress mismatch instability behavior, put forward the preparation of ceramic hotplate sensor array using aluminum nitride Tao Ciji MEMS process technology. To solve the thermal interference problem of ceramic hotplate sensor array MEMS process and ceramic matrix, lithography stripping technology and etching technology, realizes the Al N micro hotplate gas sensor array based on the preparation, and detection of several toxic and harmful gases, and the test data The analysis and the sensitive mechanism of gas sensing characteristics are discussed. The main contents are as follows: the thermal structure of 1. scale ceramic hotplate sensor array design. According to the characteristics of ceramic hotplate thermal structure scale and ceramic wet etching orientation difficult to achieve, the applicable thermal isolation design in laser micromachining etching process, the thermal insulation ladder through hole structure can reduce the heat loss of geometric structure factor, reduce the heat loss. And gives the stress coupling analysis of thermal structure of steady and transient characteristics of heat and the thermal structure and ceramic hotplate stress calculation simulation by ANSYS finite element method, the synthesis and characterization of the design rationality and feasibility.2.In-Nb composite oxide semiconductor sensitive material. The high concentration solution, chlorine and other strong oxidizing gases and wide range, low temperature detection requirements. The research and preparation of Sn O2 and InNb composite Nano semiconductor oxide as a sensitive material, and has carried on the analysis of XRD and SEM respectively. Through the nano structure change under different temperature characteristics, analysis of.3. aluminum nitride ceramic hotplate sensor array preparation technology research on the impact mechanism gives the gas sensing properties and electrical conductivity. In order to improve the surface morphology of metal forming complex ceramic substrate the process is difficult to achieve, and the ceramic base of hard machining characteristics, put forward the process of flexible mechanical stripping process and laser micro processing technology combining method of preparation technology. Through the flexible mechanical stripping process, improve the traditional photolithography process stripping stripping effect, relative inversion stripping process, simplify the stripping process steps, reduce the preparation of test sensitivity analysis of losing stability and gas production cost of.4. aluminum nitride ceramic hotplate thermal sensor array. According to the thermal coupling between array elements together The characteristics, puts forward four kinds of thermal interference patterns of the array elements, and analyzed the thermal interference test under the four models. The comparative analysis of the response characteristics of thermal isolation before and after heat, three kinds of thermal response mechanism is given under the temperature to exist. For Cl2, NO2, SO2, CO four kinds of typical toxic gas analysis characteristics and sensitivity characteristics of gas sensing response, InNb composite oxide semiconductor gas sensor array is obtained, the oxidizing gas Cl2, NO2 can achieve high concentration, wide range of ideal detection requirements.5. for aluminum nitride ceramic hotplate sensor array preparation, design and implementation of data acquisition and detection system of ARM Cortex-M3 based on the microprocessor. And set up can be used for the detection of toxic and harmful gas sealed test system platform, realizes the real-time signal detection of ceramic hotplate sensor array prepared by measuring the requirements. The results show that the design of the ceramic micro hotplate gas sensor array is reasonable and the feasibility of the key process technology is feasible, which lays the foundation for further research and development of ceramic micro hotplate sensor array micro system technology.

【學(xué)位授予單位】：哈爾濱理工大學(xué)
【學(xué)位級(jí)別】：博士
【學(xué)位授予年份】：2015
【分類號(hào)】：TP212

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