本文選題：Mo-Cu復合材料 + 噴霧干燥-煅燒-氫氣還原法�。� 參考：《中南大學》2011年碩士論文

【摘要】：Mo-Cu復合材料作為微電子封裝材料及集成電路的熱沉材料,要求具有高致密度、高結(jié)構(gòu)均勻性、高的熱導電導性和低膨脹系數(shù)。研究高致密度、高熱導電導和低銅含量Mo-Cu復合材料,作為電子封裝材料及熱沉材料具有非常積極的意義。 本研究以MoO3懸浮液為原料,采用噴霧干燥-煅燒-氫氣還原工藝制備良好壓制性能的鉬粉,然后采用壓制-低溫預燒骨架-熔滲法制備高致密度、低銅含量鉬銅復合材料。探討了MoO3懸浮料漿體積固相含量、氨水添加量、PEG含量的選擇,噴霧干燥、煅燒和氫氣還原工藝的選擇；此外對鉬粉壓制特性、骨架預燒工藝、熔滲工藝進行了研究,并對熔滲法制備Mo-Cu復合材料的力學性能及熱物性能進行了測試分析。主要結(jié)論如下： 1)配制體積固含量15%、PEG 2wt%分散劑、pH值為4.5的Mo03懸浮料漿,噴霧干燥-煅燒-氫氣還原,制備了低雜質(zhì)含量,顆粒密實的球形鉬粉。 2)制備鉬粉比傳統(tǒng)鉬粉具有更優(yōu)越的壓縮特性,壓坯密度隨壓力變化滿足黃培云壓制方程。壓力P小于等于1000MPa和P大于等于1000MPa時,傳統(tǒng)鉬粉壓制模量M分別為0.073和0.79,硬化指數(shù)分別為4.17和2.15。制備鉬粉壓制模量M分別為0.066和0.15,硬化指數(shù)分別為4.05和3.41。 3)熔滲溫度為1300℃時,熔滲時間1h,合金致密度最高。Mo65、Mo70最佳熔滲溫度為1200℃, Mo75、Mo80、Mo85最佳熔滲溫度為1250℃。 4)制備的Mo70Cu、Mo75Cu、Mo80Cu、Mo85Cu合金熱導率和熱膨脹系數(shù)分別為190、181、166、153 W.m-1.K-1和8.4×10-4、7.7×10-4、7.1×10-4、6.4×10-4℃-1-,合金熱導率隨鉬體積分數(shù)成線性負相關(guān),實驗結(jié)果與利氏公式預測值較為一致,整體上實驗測定值比理論預測值低。 5) Mo65Cu、Mo70Cu,鉬銅兩相組織分別比較均勻,但有少量富銅存在。Mo75Cu、Mo80Cu、Mo85Cu,其鉬、銅相顯微組織結(jié)構(gòu)均勻,無富銅相存在,鉬顆粒均比較細小,無明顯長大趨勢。采用熔滲法制備低銅含量鉬銅合金,能夠保證合金高致密度和組織結(jié)構(gòu)的均勻性,從而提高聲子的傳導效率,保證合金高熱導性及氣密性。
[Abstract]:As microelectronic packaging materials and heat sink materials of integrated circuits, Mo-Cu composites require high density, high structural uniformity, high thermal conductivity and low expansion coefficient. It is of great significance to study Mo-Cu composites with high density, high thermal conductivity and low copper content as electronic packaging materials and heat sink materials. In this study, molybdenum powder with good compaction performance was prepared by spray drying, calcination and hydrogen reduction process with MoO3 suspension as raw material, and then high density, low copper content molybdenum copper composite was prepared by pressure-low temperature pre-sintering skeleton infiltration method. The selection of volume solid content of MoO3 suspension slurry, the content of ammonia water, the selection of spray drying, calcination and hydrogen reduction process were discussed, and the characteristics of molybdenum powder pressing, skeleton pre-firing process and infiltration process were also studied. The mechanical properties and thermal properties of Mo-Cu composites prepared by infiltration method were tested and analyzed. The main conclusions are as follows: 1) spherical molybdenum powder with low impurity content and dense particles was prepared by spray drying, calcination and hydrogen reduction of Mo03 suspension slurry with pH 4.5 of PEG2wt% dispersant. 2) the prepared molybdenum powder has more superior compression properties than the traditional molybdenum powder, and the compaction density changes with the pressure to satisfy Huang Peiyun's pressing equation. When the pressure P is less than or equal to 1000MPa and P > equal to 1000MPa, the compression modulus M of traditional molybdenum powder is 0.073 and 0.79, and the hardening index is 4.17 and 2.15 respectively. The compaction modulus M of molybdenum powder is 0.066 and 0.15, and the hardening index is 4.05 and 3.41 respectively. 3) when the infiltration temperature is 1300 鈩，

本文編號：1851003