本文選題：基片 + 薄膜傳感器　； 參考：《中國(guó)科技論文》2015年23期

【摘要】：為了尋找薄膜熱傳感器合適的基片材料,基于二氧化硅、聚酰亞胺薄膜和氧化鋁陶瓷3種不同的基片材料,設(shè)計(jì)并制作了大小為4mm×8mm的復(fù)合薄膜熱傳感器,傳感器包括一個(gè)用于熱流測(cè)量的熱電堆和一個(gè)用于溫度測(cè)量的熱電偶。綜合測(cè)試發(fā)現(xiàn):以聚酰亞胺薄膜為基片的傳感器有良好的性能表現(xiàn),其中,薄膜熱電偶和薄膜熱流計(jì)靈敏度分別為19.94μV/℃和0.010 121μV/(W·m-2),響應(yīng)時(shí)間分別是0.26s和1.57s,薄膜熱電偶靜態(tài)標(biāo)定擬合直線的相關(guān)系數(shù)均為0.997。
[Abstract]:In order to find suitable substrate material for thin film thermal sensor, a composite thin film thermal sensor with the size of 4mm 脳 8mm was designed and fabricated based on three different substrate materials, silicon dioxide, polyimide film and alumina ceramic. The sensor includes a thermoelectric stack for heat flow measurement and a thermocouple for temperature measurement. The comprehensive test shows that the sensor with polyimide film as substrate has good performance, among which, The sensitivity of the film thermocouple and the thin film thermometer are 19.94 渭 V / 鈩，

本文編號(hào)：2003464