【摘要】：面向第四代移動(dòng)通信技術(shù)標(biāo)準(zhǔn)LTE(Long Term Evolution長(zhǎng)期演進(jìn)技術(shù))的集成通信基帶處理功能與移動(dòng)計(jì)算處理能力于一體的新一代智能手機(jī)芯片,是移動(dòng)終端的核心部件,其功能眾多,芯片設(shè)計(jì)集中體現(xiàn)出SOC(System on Chip簡(jiǎn)稱SOC)技術(shù),是當(dāng)前芯片設(shè)計(jì)行業(yè)的最大挑戰(zhàn),也是本課題的研究焦點(diǎn)。 智能手機(jī)迎來(lái)革命,而功能集成化、性能電腦化、通信多�；⑵脚_(tái)一致化、產(chǎn)品同質(zhì)化成為新時(shí)代智能手機(jī)芯片的主要特點(diǎn)。與此相對(duì)應(yīng)的移動(dòng)終端朝著輕薄化、大屏化、低價(jià)化趨勢(shì)發(fā)展,導(dǎo)致功耗與性能之間矛盾越來(lái)越突出,產(chǎn)品同質(zhì)化導(dǎo)致產(chǎn)品生命周期越來(lái)越短。如何提前做好芯片的產(chǎn)品規(guī)劃及設(shè)計(jì)成本的預(yù)測(cè)與分析顯得尤為重要。本文結(jié)合作者實(shí)際工作對(duì)這兩個(gè)問題進(jìn)行了分析和闡述。 國(guó)內(nèi)外對(duì)于LTE通信終端基帶處理技術(shù)有不少相關(guān)研究,但具體與應(yīng)用處理器相結(jié)合的針對(duì)智能手機(jī)芯片的報(bào)告則相對(duì)較少。而從產(chǎn)品規(guī)劃和成本分析方面著眼進(jìn)行分析的更是鳳毛麟角。本文結(jié)合聯(lián)芯科技在TD-SCDMA及LTE終端基帶芯片設(shè)計(jì)方面的研究基礎(chǔ),通過(guò)分析,認(rèn)為該SOC芯片工藝節(jié)點(diǎn)應(yīng)該選擇28nnm,封裝應(yīng)選擇Flip-chip BGA,通信模式則至少支持五種制式,暨GSM/TDSCDMA/LTE-TDD/LTE-FDD/WCDMA。通過(guò)一套成本分析工具能夠?qū)崿F(xiàn)設(shè)計(jì)之前對(duì)目標(biāo)成本有清晰的估算,做到有的放矢。 同時(shí),本論文以本課題研究中的無(wú)線連接芯片設(shè)計(jì)實(shí)例進(jìn)行了說(shuō)明,闡明了產(chǎn)品規(guī)劃對(duì)應(yīng)的設(shè)計(jì)實(shí)現(xiàn),互為印證。 本論文的研究工作主要采用信息收集、歸納總結(jié)、數(shù)據(jù)統(tǒng)計(jì)和參數(shù)假設(shè)等方法進(jìn)行。本人查找了國(guó)內(nèi)外大量的技術(shù)資料、市場(chǎng)分析和產(chǎn)業(yè)報(bào)告,總結(jié)了新一代智能手機(jī)芯片所涉及到的關(guān)鍵技術(shù)、通信標(biāo)準(zhǔn)以及成本分析的方法,進(jìn)而對(duì)芯片的產(chǎn)品規(guī)劃提出清晰的思路和目標(biāo)。通過(guò)本項(xiàng)目的研究,可以得出新一代智能手機(jī)芯片的產(chǎn)品規(guī)劃思路和結(jié)論,為芯片設(shè)計(jì)提供目標(biāo)指導(dǎo)。通過(guò)對(duì)芯片設(shè)計(jì)成本的分析,能夠給出可量化的成本分解及計(jì)算工具,為快速進(jìn)行成本評(píng)估提供了依據(jù)。
[Abstract]:The integrated communication baseband processing function and mobile computing processing capability are the core components of mobile terminal, which is the core component of mobile terminal, and has many functions, which is oriented to the long-term evolution of the fourth generation mobile communication technology standard (LTE (Long Term Evolution). Chip design embodies SOC (System on Chip (SOC) technology, which is the biggest challenge of chip design industry and the research focus of this topic. Smart phone ushered in a revolution, and the main features of smart phone chips in the new era are integration of functions, computerization of performance, multimode communication, consistent platform and homogenization of products. The corresponding mobile terminals are developing towards thinning, large screen and low price, which leads to more and more contradiction between power consumption and performance, and product homogenization leads to shorter and shorter product life cycle. It is very important to predict and analyze the product planning and design cost in advance. This paper analyzes and expounds these two problems in combination with the author's practical work. There are many related researches on baseband processing technology of LTE communication terminal at home and abroad, but there are relatively few reports on smart phone chips combined with application processors. But from the product plan and the cost analysis aspect carries on the analysis to be more rare. Based on the research foundation of TD-SCDMA and LTE terminal baseband chip design, this paper considers that the process node of the SOC chip should select 28nnm, and the package should choose Flip-chip BGA, communication mode to support at least five kinds of systems, and GSM/TDSCDMA/LTE-TDD/LTE-FDD/WCDMA.. Through a set of cost analysis tools, the target cost can be estimated clearly before the design. At the same time, the design example of wireless connection chip in this thesis is introduced, and the corresponding design realization of product planning is explained. Information collection, induction, data statistics and parameter hypothesis are used in this paper. I have looked up a lot of technical data, market analysis and industry report at home and abroad, summed up the key technologies, communication standards and cost analysis methods involved in the new generation of smart phone chips. Then the chip product planning and clear ideas and objectives. Through the research of this project, we can get the product planning idea and conclusion of the new generation smart phone chip, and provide the target guidance for the chip design. By analyzing the design cost of the chip, a quantifiable cost decomposition and calculation tool can be provided, which provides the basis for rapid cost evaluation.
【學(xué)位授予單位】：中國(guó)科學(xué)院大學(xué)（工程管理與信息技術(shù)學(xué)院）
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2014
【分類號(hào)】：TN929.53

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