LCD真空貼合基板吸附和剝離關(guān)鍵技術(shù)的研究
[Abstract]:TFT-LCD (Thin Film Transistor Liquid Crystal Display) is the mainstream flat panel display technology. The technical performance of TFT-LCD equipment determines the production process level of LCD panel. The optoelectronic liquid crystal display panel of CAAC is transformed to small size, and the performance of some equipments can not meet the technical requirements of small size panel. In this paper, aiming at the problem of showing light leakage and liquid crystal screen bubble in the panel of vacuum bonding equipment when it corresponds to small panel, the technological process of vacuum bonding equipment and the technology of substrate adsorption and stripping under vacuum condition are studied in this paper. The following research work is done: defect analysis of vacuum bonding products and establishment of new process model. The structure and process principle of vacuum bonding equipment are analyzed, and the process parameters to characterize the precision of substrate bonding are put forward. The causes of light leakage and bubble defects in liquid crystal panel display are analyzed, a new process model is established, an improved design scheme for vacuum bonding equipment is put forward, and the feasibility of its realization is analyzed. The design and reliability verification of the substrate adsorption and stripping unit, the design of the new viscous rubber adsorption unit and the high pressure air bag stripping unit, and the reliability of the operation of the unit are verified by experiments. It is proved by the products that the new type of substrate adsorption and stripping unit will not cause the panel to be bad. The design of the fixed disk and electrical system, and the design of the SDC (Stick Diaphragm Chuck) substrate adsorption and stripping unit fixed disc and electrical system to meet the needs of the substrate adsorption and stripping action. The control program and man-machine interface are designed, and the control program and touch screen interface are designed to meet the requirements of the new process. Final assembly and equipment performance test, vacuum bonding equipment assembly and system debugging, through mass production test to verify the improvement of vacuum bonding equipment and the effectiveness of the new process model.
【學(xué)位授予單位】:上海交通大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2014
【分類(lèi)號(hào)】:TN873.93
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