玻璃覆晶的封裝互連性能檢測方法及倒裝設(shè)備研究
發(fā)布時間：2018-07-17 15:31
【摘要】：近年來，液晶顯示器（LCD）行業(yè)發(fā)展迅速，制造更大尺寸、輕薄化、低功耗、高分辨率的的LCD成為產(chǎn)業(yè)技術(shù)發(fā)展的方向。LCD模組普遍采用各向異性膠互連（ACF）的玻璃覆晶（COG）封裝方式，其芯片凸點間距已達(dá)25μm，封裝密度高，工藝參數(shù)復(fù)雜。在ACF-COG互連工藝設(shè)計與優(yōu)化過程中，互連電阻因其不穩(wěn)定性和易于退化的特點已成為評估產(chǎn)品互連性能的關(guān)鍵指標(biāo)，容易引發(fā)嚴(yán)重的可靠性問題。互連電阻的數(shù)值與產(chǎn)品邦定工藝、設(shè)備特性、封裝材料特性、COG產(chǎn)品設(shè)計等諸多參數(shù)相關(guān)，影響因素眾多。如何確保在相鄰?fù)裹c不短路的情況下，互連電阻小、均勻并且可控是COG封裝領(lǐng)域研究的熱點。目前評估互連電阻的主要方法是通過制造測試芯片，采用電阻監(jiān)測及人工經(jīng)驗相結(jié)合的方式，費時費力，且缺乏有效的定量分析手段。因此，對于后續(xù)更高密度的玻璃覆晶模組互連性能評估而言，亟需一種互連電阻的自動估計及定量分析方法。 本文在分析國內(nèi)外COG封裝工藝及互連電阻模型研究現(xiàn)狀的基礎(chǔ)上，針對ACF-COG互連電阻自動估計方法開展研究，重點解決基于顆粒導(dǎo)電面積的ACF互連電阻模型、以及凸點導(dǎo)電面積的自動獲取方法，為更高密度的LCD模組封裝自動化電阻監(jiān)測及工藝優(yōu)化決策提供支持�？紤]到國內(nèi)高密度COG倒裝設(shè)備研發(fā)的迫切性，本文結(jié)合COG封裝工藝特點，開展倒裝設(shè)備的設(shè)計與研發(fā)工作，并在該設(shè)備上進(jìn)行了互連電阻自動估計方法的測試驗證。主要研究工作及取得的成果如下： 一、提出了基于導(dǎo)電面積的互連電阻估計思路，并以此為出發(fā)點，提出了基于導(dǎo)電面積的ACF-COG封裝導(dǎo)電顆粒電阻模型，該模型中包括顆粒與電極/凸點接觸電阻、顆粒薄壁體電阻以及接觸面上的隧道電阻。通過模型測試與數(shù)據(jù)比對發(fā)現(xiàn)，與其他已發(fā)表的電阻模型相比，該導(dǎo)電顆�；ミB電阻模型預(yù)測結(jié)果與實測試據(jù)吻合度更高�；谠搶�(dǎo)電顆粒的電阻模型，提出了多導(dǎo)電顆粒情況下凸點與電極的互連電阻模型，該模型綜合了因顆粒間的電場交互及邊界電勢效應(yīng)引入的附加電阻，為后續(xù)獲得導(dǎo)電顆粒的接觸面積和位置后求解凸點互連電阻提供了途徑。 二、提出了基于機(jī)器視覺的COG凸點互連電阻估計方法，解決了凸點導(dǎo)電面積自動獲取的難題。根據(jù)凸點邊界直線概率較大的特點，本文提出了基于邊界特征提取、能量梯度、凸點幾何特征信息融合的凸點邊界提取及區(qū)域截取方法，可以自動實現(xiàn)凸點角度糾偏及凸點區(qū)域提取，該方法對于圖像中顆粒團(tuán)聚或氣泡等噪聲的干擾具有強(qiáng)魯棒性。通過圖像形態(tài)學(xué)操作，可實現(xiàn)凸點導(dǎo)電顆粒的識別與導(dǎo)電面積的計算，并利用電阻模型，準(zhǔn)確估計凸點互連電阻。經(jīng)凸點圖片測試分析發(fā)現(xiàn)，利用本文提出的凸點邊界提取及區(qū)域截取方法，凸點檢出率超過95%。在凸點導(dǎo)電顆粒計數(shù)方面，，通過人工比對，準(zhǔn)確率達(dá)到94%，特別在因壓力過大或者顆粒識別噪聲較大的顆粒難識別的情況下，本方法有明顯優(yōu)勢。在互連電阻估計方面，該方法可以通過精確的導(dǎo)電面積及顆粒位置計算獲得較準(zhǔn)確的凸點互連電阻。 三、根據(jù)ACF-COG封裝封裝密度高、工藝流程復(fù)雜、對位精度高的特點，提出了一種高密度高精度倒裝機(jī)新結(jié)構(gòu)形式。該倒裝機(jī)由IC上料轉(zhuǎn)臺、玻璃上料機(jī)械手、精密對位預(yù)壓臺以及雙頭本壓臺等關(guān)鍵部分組成。設(shè)計并優(yōu)化了邦定壓頭結(jié)構(gòu)，以控制壓頭的平面溫差及平面度，通過結(jié)構(gòu)熱傳遞與熱應(yīng)變仿真分析并調(diào)整結(jié)構(gòu)參數(shù)，實現(xiàn)了熱壓面溫差與平面度分別為3.39C、2μm，達(dá)到設(shè)備熱壓要求。根據(jù)高密度高精度COG倒裝機(jī)的方案設(shè)計，對預(yù)壓對位、芯片拾取的視覺系統(tǒng)進(jìn)行了設(shè)計與選型，設(shè)計了IC芯片上料機(jī)構(gòu)、邦定壓頭、運動平臺，并最終完成了設(shè)備機(jī)械結(jié)構(gòu)設(shè)計。 四、結(jié)合高密度高精度COG倒裝設(shè)備的功能與結(jié)構(gòu)設(shè)計，設(shè)計了設(shè)備的控制系統(tǒng)方案，分析并優(yōu)化了系統(tǒng)控制時序，實現(xiàn)了雙片生產(chǎn)時間12s（11.75s）生產(chǎn)工序規(guī)劃與控制。針對設(shè)備的移動定位精度、視覺對位精度、邦定壓頭熱壓穩(wěn)定性進(jìn)行了測試，結(jié)果顯示，設(shè)備的定位和熱壓精度達(dá)到了預(yù)期的設(shè)計目標(biāo)。采用LCD玻璃基板和芯片進(jìn)行邦定，采集測試模組的228個凸點圖片進(jìn)行了互連電阻估計及統(tǒng)計測試，實驗測試結(jié)果表明，經(jīng)方法估計的凸點互連電阻及邦定壓力與實測值吻合，在準(zhǔn)確性和凸點性能分析方面有優(yōu)勢。該方法可獲取凸點導(dǎo)電面積、凸點下導(dǎo)電顆粒數(shù)目、顆粒導(dǎo)電面積等信息數(shù)據(jù)并進(jìn)行統(tǒng)計分析，同時可快速定位缺陷凸點，為COG封裝工藝分析與優(yōu)化提供了便捷的手段。
[Abstract]:In recent years , liquid crystal display ( LCD ) industry has been developing rapidly , making LCD of larger size , light thinning , low power consumption and high resolution becoming the direction of industrial technology development .
On the basis of analyzing the current research situation of COG packaging technology and interconnection resistance model at home and abroad , this paper focuses on the research of ACF - COG interconnection resistance automatic estimation method , and focuses on the ACF interconnection resistance model based on the particle conductive area and the automatic acquisition method of the conductive area of the bump . In view of the urgency of research and development of the high - density COG flip - chip equipment , the design and research and development of the flip - chip equipment are carried out in consideration of the characteristics of the COG packaging technology . The test verification of the automatic estimation method of the interconnection resistance is carried out on the equipment . The main research work and the achievement obtained are as follows :
Based on the resistance model of the conductive particles , the interconnection resistance model of the bump and the electrode in the case of multi - conductive particles is proposed , which combines the electric field interaction with other published resistance models and the additional resistance introduced by the boundary potential effect , which provides a way for the subsequent obtaining of contact area and position of the conductive particles and solving the bump interconnection resistance .
This paper presents a method for estimation of bump boundary extraction based on machine vision , which solves the problem of auto - acquisition of convex - point conductive area . Based on the feature of large - line probability of convex point boundary , this paper presents the method of convex point boundary extraction and region interception based on boundary feature extraction , energy gradient and convex point geometry information fusion .
3 . According to the characteristics of high packing density , complicated process flow and high contraposition precision of ACF - COG package , a new structure of high - density high - precision pouring machine is proposed .
Based on the function and structural design of high - density high - precision COG flip - chip equipment , the control system scheme of equipment is designed , the system control timing is optimized , and the process planning and control of 12s ( 11.75s ) production process are optimized . The results show that the positioning and hot - pressing accuracy of the equipment reach the expected design goal . The results show that the method can obtain the information data such as the conductive area of the bump , the number of conductive particles under the convex point , the conductive area of the particles , and make statistical analysis . At the same time , the defect bump can be quickly located , which provides a convenient means for the analysis and optimization of COG packaging process .
【學(xué)位授予單位】：上海交通大學(xué)
【學(xué)位級別】：博士
【學(xué)位授予年份】：2014
【分類號】：TN873.93
本文編號：2130107
[Abstract]:In recent years , liquid crystal display ( LCD ) industry has been developing rapidly , making LCD of larger size , light thinning , low power consumption and high resolution becoming the direction of industrial technology development .
On the basis of analyzing the current research situation of COG packaging technology and interconnection resistance model at home and abroad , this paper focuses on the research of ACF - COG interconnection resistance automatic estimation method , and focuses on the ACF interconnection resistance model based on the particle conductive area and the automatic acquisition method of the conductive area of the bump . In view of the urgency of research and development of the high - density COG flip - chip equipment , the design and research and development of the flip - chip equipment are carried out in consideration of the characteristics of the COG packaging technology . The test verification of the automatic estimation method of the interconnection resistance is carried out on the equipment . The main research work and the achievement obtained are as follows :
Based on the resistance model of the conductive particles , the interconnection resistance model of the bump and the electrode in the case of multi - conductive particles is proposed , which combines the electric field interaction with other published resistance models and the additional resistance introduced by the boundary potential effect , which provides a way for the subsequent obtaining of contact area and position of the conductive particles and solving the bump interconnection resistance .
This paper presents a method for estimation of bump boundary extraction based on machine vision , which solves the problem of auto - acquisition of convex - point conductive area . Based on the feature of large - line probability of convex point boundary , this paper presents the method of convex point boundary extraction and region interception based on boundary feature extraction , energy gradient and convex point geometry information fusion .
3 . According to the characteristics of high packing density , complicated process flow and high contraposition precision of ACF - COG package , a new structure of high - density high - precision pouring machine is proposed .
Based on the function and structural design of high - density high - precision COG flip - chip equipment , the control system scheme of equipment is designed , the system control timing is optimized , and the process planning and control of 12s ( 11.75s ) production process are optimized . The results show that the positioning and hot - pressing accuracy of the equipment reach the expected design goal . The results show that the method can obtain the information data such as the conductive area of the bump , the number of conductive particles under the convex point , the conductive area of the particles , and make statistical analysis . At the same time , the defect bump can be quickly located , which provides a convenient means for the analysis and optimization of COG packaging process .
【學(xué)位授予單位】：上海交通大學(xué)
【學(xué)位級別】：博士
【學(xué)位授予年份】：2014
【分類號】：TN873.93
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本文編號：2130107
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