發(fā)布時(shí)間：2018-06-07 04:24

  本文選題：印刷電子 + NFC天線��； 參考：《電子科技大學(xué)》2015年碩士論文

【摘要】：伴隨著信息技術(shù)的快速發(fā)展,智能手機(jī)開始被更多尋常百姓所應(yīng)用,而配備了NFC系統(tǒng)的智能手機(jī)正逐漸改變?nèi)藗兊娜粘Ｉ罘绞?交通卡、銀行卡、門禁卡等射頻芯片卡都可以被具有NFC功能的智能手機(jī)所替代。為了大規(guī)模推廣NFC系統(tǒng),就必須想方設(shè)法降低其制造成本。目前傳統(tǒng)的NFC天線制造技術(shù)如刻蝕法和導(dǎo)電油墨印刷法都具有工序復(fù)雜、設(shè)備昂貴、環(huán)境污染、資源浪費(fèi)等缺點(diǎn)。因此本論文提出了一種基于溶液型功能性前驅(qū)油墨噴印天線圖形金屬化的“加成法”天線制造技術(shù),該技術(shù)具有工藝簡單、環(huán)境友好、成本低等優(yōu)點(diǎn),有望取代傳統(tǒng)的天線制造工藝。印刷電子技術(shù)是以“加成法”為主要特征,利用傳統(tǒng)的印刷技術(shù)將功能性油墨(如金屬導(dǎo)電油墨、半導(dǎo)體油墨、介質(zhì)油墨等)印刷到有機(jī)、無機(jī)基材上形成電子線路、電子器件與系統(tǒng)的科學(xué)與技術(shù)。本論文的主要研究內(nèi)容是:1.研究NFC天線原理,分析天線厚度h對(duì)天線的電阻值、電感、阻抗的影響。比較了蝕刻法、凹版印刷法、絲網(wǎng)印刷法、噴墨印刷法和激光直寫工藝制造NFC天線的優(yōu)缺點(diǎn),闡明了本論文研究的印刷電子技術(shù)在天線制造上的優(yōu)勢(shì)。2.簡述了選用聚酰亞胺(PI)基板作為天線承印基材的原因,介紹了幾種基板表面改性方式。研究了用堿性高錳酸鉀對(duì)基板表面改性的工藝,發(fā)現(xiàn)通過堿性高錳酸鉀溶液可提高PI薄膜表面粗糙度,同時(shí)通過水解作用引入羧基和羥基,將原本憎水的基板表面變得親水。討論了適宜噴印的溶液型功能性前驅(qū)油墨的制備技術(shù),制備出了黏度、表面張力、pH值符合要求的墨水。3.研究了用天線圖形轉(zhuǎn)移平臺(tái)噴印天線圖形的最優(yōu)工藝設(shè)置,確定了其噴印精度為127μm,最佳噴印距離為2 mm。討論了天線線條金屬化后線寬變化規(guī)律,指導(dǎo)了天線的線寬設(shè)計(jì)。針對(duì)線條與噴頭運(yùn)行方向的不同夾角,研究了0°、30°和45°夾角下線寬的變化和銅層的表面形態(tài)。研究了二步法鍍銅工藝,確定了40-50℃,鍍銅4 min的一次鍍銅工藝。分析了二次鍍液中添加劑對(duì)銅層致密度的影響,確定了在二次鍍液中加入2 mg/L的2-MBT以提高銅層致密度,并最終將銅鍍層的電阻率降低到2.8×10-8Ω·m。最后針對(duì)二次鍍液配方復(fù)雜、高溫下鍍液不穩(wěn)定的特點(diǎn),給出了電鍍加厚銅層的解決方案。
[Abstract]:With the rapid development of information technology, smart phones are being used by more and more ordinary people, and smartphones equipped with NFC system are gradually changing people's daily life style, transportation card, bank card. Radio-frequency chip cards such as access cards can be replaced by smart phones with NFC capabilities. In order to popularize NFC system on a large scale, we must find ways to reduce its manufacturing cost. At present, the traditional NFC antenna manufacturing techniques such as etching and conductive ink printing have the disadvantages of complicated process, expensive equipment, environmental pollution, waste of resources and so on. Therefore, this paper proposes a "addition method" antenna manufacturing technology based on the metallization of the solution type functional precursor ink jet antenna, which has the advantages of simple process, friendly environment, low cost and so on. It is expected to replace the traditional antenna manufacturing technology. Printing and electronic technology is characterized by "addition method", using traditional printing technology to print functional inks (such as metal conductive ink, semiconductor ink, dielectric ink, etc.) onto organic and inorganic substrates to form electronic circuits. Science and Technology of Electronic Devices and Systems. The main content of this thesis is 1: 1. The principle of NFC antenna is studied, and the effect of antenna thickness h on the resistance, inductance and impedance of antenna is analyzed. The advantages and disadvantages of etching, gravure printing, screen printing, ink-jet printing and laser direct writing to fabricate NFC antenna are compared. The reason why polyimide (Pi) substrate is used as antenna substrate is briefly introduced, and several kinds of surface modification methods are introduced. The surface modification of the substrate with alkaline potassium permanganate was studied. It was found that the surface roughness of Pi film could be improved by alkaline potassium permanganate solution, and the hydrophilic surface of the hydrophobic substrate could be changed by the introduction of carboxyl and hydroxyl groups through hydrolysis. The preparation technology of solution type functional precursor ink suitable for spray printing was discussed. The ink with viscosity and surface tension and pH value was prepared. In this paper, the optimal process setting of the antenna pattern is studied. The precision of the spray printing is 127 渭 m, and the optimum printing distance is 2 mm. The variation rule of line width after wire metallization is discussed, and the design of antenna linewidth is guided. According to the different angle between the line and the nozzle running direction, the variation of the line width and the surface morphology of the copper layer under the angles of 0 擄~ 30 擄and 45 擄are studied. The two-step copper plating process was studied. The primary copper plating process at 40-50 鈩，

本文編號(hào)：1989758