本文選題：北斗二代 + 多通道��； 參考：《電子科技大學(xué)》2014年碩士論文

【摘要】：由我國(guó)自主研發(fā)和獨(dú)立運(yùn)行的北斗衛(wèi)星系統(tǒng)經(jīng)過(guò)不斷的發(fā)展和完善,已經(jīng)逐步應(yīng)用于日常生活和軍事領(lǐng)域中,對(duì)其地面站中的收發(fā)系統(tǒng)的研究也得到廣泛的重視,根據(jù)北斗二代系統(tǒng)收發(fā)系統(tǒng)的研究現(xiàn)狀和發(fā)展趨勢(shì),本文完成一款基于提供授權(quán)服務(wù)的B3頻段的多通道收發(fā)模塊小型化設(shè)計(jì)制作和測(cè)試。主要的工作內(nèi)容為:1.根據(jù)北斗二代測(cè)試系統(tǒng)的要求,完成多通道收發(fā)模塊中收發(fā)通道電路的設(shè)計(jì)方案,接收通道要實(shí)現(xiàn)對(duì)輸入的射頻信號(hào)到中頻信號(hào)的變換,在有限的模塊設(shè)計(jì)尺寸內(nèi)采用一次變頻結(jié)構(gòu)完成接收的下變頻,為了方便對(duì)各接收通道的輸出信號(hào)幅度進(jìn)行調(diào)試,在接收通道中使用AGC電路完成對(duì)中頻的放大;在發(fā)射通道中,通過(guò)一次上變頻結(jié)構(gòu)實(shí)現(xiàn)中頻到射頻的上變頻,使用兩級(jí)功率分配器實(shí)現(xiàn)八個(gè)發(fā)射輸出端口的信號(hào)分配。2.模塊的上下變頻電路需要精確、穩(wěn)定、頻譜純度高的本振信號(hào),采用鎖相環(huán)電路作為本振信號(hào)源,并且通過(guò)CPLD芯片對(duì)鎖相環(huán)進(jìn)行控制。為了保證各接收通道輸出信號(hào)的帶寬、帶外抑制和帶內(nèi)平坦度采用聲表面波濾波器并且濾波器的尺寸能夠滿足模塊小型化的設(shè)計(jì)要求,因?yàn)槁暠砻娌V波器的匹配電路對(duì)模塊接收通道的多個(gè)參數(shù)都有比較重要的影響,所以調(diào)試時(shí)需要根據(jù)各通道的輸出信號(hào)對(duì)匹配電路做相應(yīng)調(diào)整。接收通道中作為中頻放大器的AGC電路的輸入匹配電路對(duì)放大器的增益有較大影響,需要使用ADS軟件對(duì)匹配電路進(jìn)行仿真后再選用合適的器件進(jìn)行焊接,最后通過(guò)添加合適的金屬屏蔽罩能夠保證各模塊電路正常工作。3.通過(guò)ADS軟件對(duì)設(shè)計(jì)的電路進(jìn)行仿真驗(yàn)證并確定各電路的指標(biāo)參數(shù)以此完成相應(yīng)的芯片選型,通過(guò)protel99se根據(jù)合理的射頻電路布局和走線規(guī)則完成多層PCB版設(shè)計(jì),使用成本較低的FR-4基板完成模塊的小型化制作,在現(xiàn)有的測(cè)試條件下對(duì)焊接并調(diào)試完成的模塊進(jìn)行主要指標(biāo)測(cè)試,由測(cè)試結(jié)果可知設(shè)計(jì)完成的多通道小型化模塊的各項(xiàng)指標(biāo)均達(dá)到設(shè)計(jì)要求,并根據(jù)最后的數(shù)據(jù)對(duì)進(jìn)一步工作做出展望。
[Abstract]:The Beidou satellite system, which is independently developed and operated independently by our country, has been gradually applied to the daily life and military field through continuous development and improvement. The research on the transceiver system in its earth station has also been widely paid attention to. According to the research status and development trend of Beidou second generation transceiver system, this paper completes the miniaturization design and test of a multi-channel transceiver module based on B3 band which provides authorized services. The main job is 1: 1. According to the requirements of the Beidou second generation test system, the design of the transceiver channel circuit in the multi-channel transceiver module is completed. The receiving channel must realize the conversion of the input RF signal to the intermediate frequency signal. In order to debug the output signal amplitude of each receiving channel, AGC circuit is used to amplify the intermediate frequency in the receiving channel. A single up-conversion structure is used to realize if to RF upconversion, and two stage power divider is used to realize the signal allocation of eight output ports. The up-down conversion circuit of the module needs the local oscillator signal which is accurate, stable and with high spectral purity. The phase-locked loop circuit is used as the local oscillator signal source, and the phase-locked loop is controlled by CPLD chip. In order to ensure the bandwidth of the output signal of each receiving channel, the surface acoustic wave filter is used for out-of-band suppression and in-band flatness, and the size of the filter can meet the design requirements of module miniaturization. Because the matching circuit of saw filter has an important effect on many parameters of the receiving channel of the module, the matching circuit should be adjusted according to the output signal of each channel. The input matching circuit of the AGC circuit used as an intermediate frequency amplifier in the receiving channel has a great influence on the gain of the amplifier. It is necessary to use the ADS software to simulate the matching circuit and then select the appropriate device for welding. Finally, by adding a suitable metal shield, we can ensure the normal operation of each module circuit. 3. The circuit is simulated and verified by ADS software and the parameters of each circuit are determined so as to complete the chip selection. The multilayer PCB version is designed by protel99se according to the reasonable RF circuit layout and circuit routing rules. Using the low-cost FR-4 substrate to complete the miniaturization of the module, under the existing test conditions, the welding and debugging of the module completed by the main indicators test, The test results show that each index of the multi-channel miniaturization module is up to the design requirements, and the future work is prospected according to the final data.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2014
【分類號(hào)】：TN967.1

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