本文關鍵詞：有源相控陣天線小通道冷板的熱仿真分析與熱設計　出處：《電子科技大學》2014年碩士論文　論文類型：學位論文

  更多相關文章： 有源相控陣天線 T/R組件 小通道 熱仿真 熱設計

【摘要】：從20世紀60年代開始,有源相控陣天線由于巨大的技術潛力而受到國內(nèi)外的普遍重視,并得到大力發(fā)展和應用。但是,隨著天線的集成度和熱功耗不斷地增加,天線的高組裝密度使得熱設計變得尤為重要和突出。天線的熱設計與天線的電性能指標直接相關,會影響到天線的探測、跟蹤和識別等功能的實現(xiàn)。而有源相控陣天線的熱功耗主要集中在T/R組件上,天線陣面可能有幾千個T/R組件和幾萬個功率晶體管,組成了龐大的發(fā)熱體。因此,如何解決這幾千個T/R組件的發(fā)熱便成了天線熱設計最關鍵的問題�；诖�,本文以有源相控陣天線為主要研究對象,對其進行散熱需求分析,以單個T/R組件為載體深入研究微小通道散熱技術,最后設計出新型冷板以解決天線的散熱問題。具體工作包括:(1)研究了T/R組件的熱需求和某組件熱仿真分析的詳細過程。首先分析有源相控陣天線的結(jié)構和散熱系統(tǒng),仔細介紹了T/R組件的結(jié)構與工作特點。然后對某組件的詳細模型進行熱仿真分析,并對三種簡化建模方法進行研究,最后提出T/R組件的熱阻模型并計算,確定T/R組件的冷卻任務,提出合理的冷卻方式。(2)研究了不同因素對散熱器的壓降和散熱性能的影響,并對小通道散熱器進行優(yōu)化設計�；趥鳠釋W和計算流體力學,建立流熱耦合數(shù)學模型;研究小通道的水力直徑、高寬比、孔隙率以及冷卻液的入口速度對壓降和散熱性能的單因素影響。闡述了析因設計和響應面法的基本理論,并基于仿真數(shù)據(jù),通過析因設計和響應面優(yōu)化方法對小通道的多因素參數(shù)進行影響因子評估和設計小通道結(jié)構參數(shù)與流體參數(shù)。(3)研究了冷板流道的拓撲形狀對冷板的壓降和散熱性能的影響分析并設計出新型流道冷板。建立有源相控陣天線線陣的冷板模型,分析常規(guī)流道的小通道冷板的散熱效果;提出仿蜂窩流道的小通道冷板并對其溫度場、壓力場進行仿真分析,與常規(guī)流道的小通道冷板進行對比分析后發(fā)現(xiàn),新型流道冷板更好解決了散熱和壓降的問題,滿足了T/R組件上表面熱流密度為95W/cm2的功率晶體管的散熱需求。最后將新型流道冷板應用于整個有源相控陣天線系統(tǒng),并進行熱仿真分析。
[Abstract]:Since 1960s, active phased array antenna has been widely paid attention at home and abroad because of its huge technical potential, and has been vigorously developed and applied. With the increasing integration and thermal power consumption of the antenna, the high density of the antenna assembly makes the thermal design more important and prominent. The thermal design of the antenna is directly related to the electrical performance of the antenna. The thermal power consumption of active phased array antenna is mainly focused on the T / R module. The antenna array may have thousands of T / R components and tens of thousands of power transistors that make up a huge heat. How to solve the heating of thousands of T / R components has become the most critical problem in antenna thermal design. Based on this, this paper takes active phased array antenna as the main research object, and analyzes its heat dissipation requirements. Using a single T / R module as the carrier, the micro-channel heat dissipation technology is deeply studied. Finally, a new type of cold plate is designed to solve the heat dissipation problem of the antenna. The thermal requirements of the T / R module and the detailed process of thermal simulation analysis of a component are studied. Firstly, the structure and heat dissipation system of the active phased array antenna are analyzed. The structure and working characteristics of the T / R component are introduced in detail. Then the detailed model of a component is analyzed by thermal simulation and three simplified modeling methods are studied. Finally, the thermal resistance model of the T / R module is put forward and calculated, the cooling task of the T / R module is determined, and the reasonable cooling mode is put forward. (2) the influence of different factors on the pressure drop and heat dissipation performance of the radiator is studied. Based on heat transfer and computational fluid dynamics, the mathematical model of fluid-heat coupling is established. The single factor influence of hydraulic diameter, aspect ratio, porosity and inlet velocity of coolant on pressure drop and heat dissipation performance of small passage is studied. The basic theory of factorial design and response surface method is expounded and based on simulation data. Through factorial design and response surface optimization method, the influence factors of multi-factor parameters of small channel are evaluated and the structural parameters and fluid parameters of small passage are designed. The influence of the topology of the cold plate runner on the pressure drop and heat dissipation performance of the cold plate was studied and a new type of cold plate was designed. The cold plate model of the active phased array antenna linear array was established. The heat dissipation effect of the small channel cold plate of the conventional flow channel is analyzed. The simulation analysis of the temperature field and pressure field of the small channel cold plate is presented, and the results are compared with those of the conventional channel cold plate. The new runner cooling plate solves the problems of heat dissipation and pressure drop better. The heat dissipation requirement of the power transistor with heat flux of 95 W / cm 2 on the surface of the T / R module is satisfied. Finally, a new type of flow channel cold plate is applied to the whole active phased array antenna system, and the thermal simulation is carried out.
【學位授予單位】：電子科技大學
【學位級別】：碩士
【學位授予年份】：2014
【分類號】：TN821.8

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本文編號：1385217