【摘要】：壓電式噴墨打印技術以其經濟、耐用、高效、分辨率高等優(yōu)點得到廣泛的應用。該項技術已經向微電子制造、微型光學元件制作、微電子封裝等其他工業(yè)領域發(fā)展。同時這種技術的噴射材料也不止局限于墨水現在也可以用于銀漿、光刻膠等的噴射。這項技術現在被國外壟斷,因此國內很多學者也在進行這方面的研究�，F在噴墨腔室的制作方法主要有犧牲層法和鍵合法,但是由于噴墨腔室的內部尺寸較小,犧牲層材料不易排出。現有的鍵合法是在蓋板上做好結構然后進行鍵合,增加了鍵合難度和成本。本文利用改進的直接熱鍵合法制作出了低成本的腔室。主要研究內容如下：(1)提出了一種改進的直接熱鍵合方法,可以有效的解決在鍵合過程中凹陷問題。首先利用MEMS工藝中的光刻工藝制得開放的噴墨腔室結構,然后鍵合一層厚度約10μm的SU-8膠膜,完成光刻后再旋涂一層SU-8膠完成鍵合。同時分析了鍵合壓力、鍵合時間和鍵合溫度對鍵合率和鍵合強度的影響。與其他鍵合方法相比鍵合過程中不易出現凹陷,鍵合率和鍵合強度比較高,可以為制作低成本高鍵合強度微通道提供一種新的工藝方法。(2)使用氧等離子體處理噴墨腔室表面提高SU-8膠的表面能提高鍵合強度。固化的SU-8膠的表面能很低鍵合層在顯影時很容易起膠。用氧等離子體處理SU-8膠表面后能夠增加其表面的浸潤性增強鍵合強度。同時設計了通過氣壓控制鍵合壓力大小的鍵合夾具,增大了鍵合過程中的施力面積,因此利用這個夾具可以對整個鍵合面施加均勻的鍵合壓力,使鍵合率和鍵合強度有了很大的改善。(3)研究了影響噴墨孔通孔率的因素。本文中的基底表面比較復雜,曝光的過程中在基底發(fā)生漫反射,反射光會使噴墨孔位置的SU-8膠曝光,影響噴墨孔的通孔率。通過實驗分析防反射材料AZBaril-Ⅱ可以把入射光全部吸收消除反射光的影響,在基底應用防反射材料AZBaril-Ⅱ使通孔率有了一定的提高。同時在鍵合的過程中因為鍵合參數的影響會引起鍵合層的凹陷,在曝光的過程中會在鍵合層發(fā)生全反射使噴墨孔曝光影響通孔率,因此研究了最佳的鍵合壓力、鍵合時間和鍵合溫度減小了鍵合層的凹陷,使通孔率達到90%以上。(4)最后,本文用墨滴測試實驗平臺進行了噴墨測試,驗證了壓電式噴墨打印頭制作工藝的合理性,也為我們的優(yōu)化以及后期的研究制作提供了幫助。
[Abstract]:Piezoelectric inkjet printing technology has been widely used because of its economic, durable, efficient, high resolution and other advantages. The technology has been developed to other industrial fields such as microelectronics manufacturing, micro-optical component fabrication, microelectronic packaging and so on. At the same time, the spray material of this technology is not limited to ink, but also can be used in the spray of silver paste, photolithography and so on. The technology is now monopolized by foreign countries, so many domestic scholars are also doing this research. At present, the manufacturing methods of inkjet chamber mainly include sacrifice layer method and bond method, but because of the small internal size of the chamber, the material of sacrificial layer is not easy to be discharged. The existing bonding method is to make a good structure on the cover plate and then bond, which increases the bonding difficulty and cost. In this paper, a low cost chamber has been fabricated by an improved direct thermal bonding method. The main contents are as follows: (1) an improved direct thermal bonding method is proposed, which can effectively solve the sag problem in the bonding process. First, an open chamber structure of inkjet chamber was fabricated by MEMS lithography, then a SU-8 film with thickness of about 10 渭 m was bonded to finish the lithography and then a layer of SU-8 adhesive was rotated to finish bonding. At the same time, the effects of bonding pressure, bonding time and bonding temperature on bond rate and bond strength were analyzed. Compared with other bonding methods, the bonding process is not easy to appear depression, and the bond rate and bond strength are relatively high. It can provide a new process method for fabricating low cost and high bonding strength microchannel. (2) the surface of SU- 8 adhesive can be improved by oxygen plasma treatment on the surface of inkjet chamber. The surface of the solidified SU- 8 adhesive is very low bonding layer, which is easy to be glued when it is developed. After the surface of SU-8 adhesive was treated with oxygen plasma, the wettability and bond strength of the adhesive could be increased. At the same time, a bonding fixture controlled by air pressure is designed, which increases the applied force area in the bonding process. Therefore, the uniform bonding pressure can be applied to the whole bonding surface by using the clamp. The bonding rate and bond strength have been greatly improved. (3) the factors affecting the porosity of inkjet holes have been studied. The surface of the substrate in this paper is rather complex. Diffuse reflection occurs on the substrate during exposure. The reflected light will expose the SU- 8 adhesive at the position of the inkjet hole, which will affect the porosity of the ink-jet hole. The experimental results show that the anti-reflection material AZBaril- 鈪，

本文編號：2471302