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基于ARM11的板級支持包的設(shè)計與實現(xiàn)

發(fā)布時間:2018-12-18 12:15
【摘要】:隨著嵌入式技術(shù)的不斷發(fā)展,嵌入式系統(tǒng)被應(yīng)用到了社會的各個領(lǐng)域。加載和引導(dǎo)操作系統(tǒng)內(nèi)核、開發(fā)相關(guān)設(shè)備驅(qū)動、固化軟件等是嵌入式系統(tǒng)開發(fā)的首要任務(wù)。板級支持包(Board Support Package,簡稱BSP),是位于嵌入式操作系統(tǒng)和硬件之間的一層軟件,它的主要任務(wù)是初始化硬件環(huán)境,引導(dǎo)和加載嵌入式操作系統(tǒng),為嵌入式系統(tǒng)軟件的開發(fā)提供調(diào)試支持。 以基于ARM11的硬件平臺為基礎(chǔ),設(shè)計了能夠引導(dǎo)Windows CE操作系統(tǒng)和為系統(tǒng)開發(fā)提供調(diào)試支持的板級支持包。將板級支持包劃分為引導(dǎo)模塊、操作系統(tǒng)硬件抽象層模塊、相關(guān)設(shè)備驅(qū)動模塊和擴展模塊四部分。引導(dǎo)模塊實現(xiàn)系統(tǒng)的初始化和操作系統(tǒng)的加載和引導(dǎo);操作系統(tǒng)硬件抽象層模塊實現(xiàn)操作系統(tǒng)定義的底層硬件接口,為操作系統(tǒng)運行提供支持;相關(guān)設(shè)備驅(qū)動模塊完成操作硬件設(shè)備和向BSP提供簡單操作接口;擴展功能模塊完成板級支持包基本功能外的具體功能需求。 引導(dǎo)模塊中,完成了系統(tǒng)上電后的板級初始化,實現(xiàn)了Windows CE的加載和引導(dǎo)。操作系統(tǒng)硬件抽象層實現(xiàn)了中斷處理、時鐘操作、CPU狀態(tài)管理三個模塊的接口函數(shù)。驅(qū)動模塊實現(xiàn)了USB驅(qū)動和SD卡驅(qū)動。擴展功能模塊中,設(shè)計了宿主機和目標機之間的通信協(xié)議,,實現(xiàn)了基于USB協(xié)議的軟件固化;分析了SD卡的啟動原理,實現(xiàn)了SD卡方式的軟件固化;為了提高用戶體驗,實現(xiàn)了開機畫面的固化和加載顯示。
[Abstract]:With the development of embedded technology, embedded system has been applied to every field of society. Loading and booting operating system kernel, developing device driver and solidifying software are the most important tasks of embedded system development. Board level support package (Board Support Package,) is a layer of software located between embedded operating system and hardware. Its main task is to initialize hardware environment, boot and load embedded operating system. It provides debugging support for the development of embedded system software. Based on the hardware platform based on ARM11, a board support package is designed to boot the Windows CE operating system and provide debugging support for system development. The board support package is divided into four parts: boot module, operating system hardware abstract layer module, related device driver module and extension module. The bootstrap module realizes the initialization of the system and the loading and booting of the operating system, and the hardware abstraction layer module of the operating system realizes the underlying hardware interface defined by the operating system, which provides support for the operation of the operating system. The related device driver module completes the operation of the hardware device and provides a simple operation interface to the BSP, and the extended function module completes the specific functional requirements beyond the basic functions of the board level support package. In the boot module, the board initialization is completed after the system is powered on, and the loading and booting of Windows CE is realized. The interface functions of interrupt processing, clock operation and CPU state management are implemented in the abstract layer of operating system hardware. The driver module realizes USB driver and SD card driver. In the extended function module, the communication protocol between host computer and target computer is designed, and the software solidification based on USB protocol is realized, and the principle of SD card startup is analyzed, and the software solidification of SD card mode is realized. In order to improve the user experience, the solidification and loading display of the boot screen are realized.
【學(xué)位授予單位】:華中科技大學(xué)
【學(xué)位級別】:碩士
【學(xué)位授予年份】:2012
【分類號】:TP368.1

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