發(fā)布時(shí)間：2018-06-25 02:21

  本文選題：半導(dǎo)體制冷 + 熔融沉積��； 參考：《機(jī)電工程》2016年02期

【摘要】：針對(duì)熔融沉積(fused deposition modeling,FDM)3D打印過(guò)程中打印大斜率小截面結(jié)構(gòu)時(shí),因散熱不良引起的層錯(cuò)位和坍塌問(wèn)題,對(duì)傳統(tǒng)FDM 3D打印機(jī)PID溫度控制方案中存在的問(wèn)題進(jìn)行了分析,將半導(dǎo)體制冷技術(shù)應(yīng)用于3D打印過(guò)程溫度控制之中,設(shè)計(jì)開(kāi)發(fā)了一種功率可調(diào)型半導(dǎo)體制冷系統(tǒng),對(duì)不同散熱條件下發(fā)生層錯(cuò)位和坍塌問(wèn)題的角度范圍進(jìn)行了測(cè)量和對(duì)比。研究結(jié)果表明,所設(shè)計(jì)的半導(dǎo)體制冷系統(tǒng)冷端溫度最低可達(dá)3.1℃,其熱端溫度可控制在65℃以下,改善了大斜率小截面結(jié)構(gòu)3D打印過(guò)程的散熱條件;采用該制冷系統(tǒng)后打印試樣發(fā)生層錯(cuò)位和坍塌的角度范圍比無(wú)散熱條件時(shí)發(fā)生上述問(wèn)題的角度范圍減小了50%以上,比普通風(fēng)扇冷卻條件下發(fā)生上述問(wèn)題的角度范圍減小了25%以上。
[Abstract]:In order to solve the problem of layer dislocation and collapse caused by poor heat dissipation in the process of printing large slope and small section structure in 3D printing process of fused deposition (fused deposition, the problems in pid temperature control scheme of traditional 3D printer are analyzed. The semiconductor refrigeration technology is applied to the temperature control of 3D printing process. A kind of power adjustable semiconductor refrigeration system is designed and developed. The angle range of layer dislocation and collapse under different heat dissipation conditions is measured and compared. The results show that the cold end temperature of the designed semiconductor refrigeration system can be as low as 3.1 鈩，

本文編號(hào)：2064087