本文關(guān)鍵詞：面向手機(jī)應(yīng)用的TFT-LCD驅(qū)動(dòng)芯片版圖設(shè)計(jì)　出處：《天津大學(xué)》2013年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： TFT-LCD 驅(qū)動(dòng)控制芯片 版圖設(shè)計(jì) 信號(hào)完整性分析 可制造性設(shè)計(jì)

【摘要】：隨著移動(dòng)互聯(lián)網(wǎng)時(shí)代的到來，，智能手機(jī)正深刻地影響和改變著人們的生活和工作的各個(gè)領(lǐng)域。作為用戶的主要互動(dòng)接口，720P高清TFT-LCD(Thin FilmTransistor-Liquid Crystal Display)屏幕已經(jīng)成為了手機(jī)市場(chǎng)的主導(dǎo)顯示終端，而TFT-LCD驅(qū)動(dòng)控制芯片作為手機(jī)處理器與手機(jī)顯示屏幕之間的接口電路，其性能將直接影響顯示畫面的質(zhì)量和系統(tǒng)功耗。 為了適應(yīng)手持移動(dòng)設(shè)備輕薄短小的產(chǎn)品需求，微型化、低功耗、高集成度、高色彩分辨率以及低成本設(shè)計(jì)是中小尺寸高清TFT-LCD驅(qū)動(dòng)IC的版圖設(shè)計(jì)的主要挑戰(zhàn)。 本論文從分析驅(qū)動(dòng)IC版圖設(shè)計(jì)難點(diǎn)著手，結(jié)合生產(chǎn)工藝和芯片封裝的特點(diǎn)，設(shè)計(jì)并實(shí)現(xiàn)了一個(gè)能適應(yīng)于720P以上的高清TFT-LCD驅(qū)動(dòng)芯片SSL0510的版圖設(shè)計(jì)，具體采取的措施如下： 在制造工藝上采用具有5個(gè)阱的混合信號(hào)CMOS工藝來提高單芯片的集成度和減少芯片的功耗；通過合理的版圖布局、允許普通器件直接放置在PAD下方和其它節(jié)省面積的設(shè)計(jì)技巧來縮減芯片尺寸降低成本；采用COG封裝、3層Stagger PAD和Fine Pitch的版圖設(shè)計(jì)方法來實(shí)現(xiàn)高色彩分辨率的輸出；為保證芯片的可靠性和穩(wěn)定性，還將可制造性設(shè)計(jì)技術(shù)DFM(Design For Manufacture)，信號(hào)完整性分析SI(Signal Integrity)，以及天線效應(yīng)和閂鎖預(yù)防(Latch-up)加入到了版圖設(shè)計(jì)之中，在保證了版圖設(shè)計(jì)質(zhì)量的同時(shí)兼顧到了芯片設(shè)計(jì)最小尺寸的考慮。 本設(shè)計(jì)采用了110nm四層金屬一層POLY的CMOS混合電壓、混合信號(hào)工藝，可以驅(qū)動(dòng)高清晰度的非晶硅(a-Si: amorphous silicon) TFT-LCD面板，最高支持720RGB*1280的分辨率，可以達(dá)到16.7M色全彩顯示，集成了2160個(gè)SOURCE驅(qū)動(dòng)信號(hào)和1280個(gè)GATE時(shí)序控制信號(hào)，以及電源電路和TCON(Timer ControlRegister)時(shí)序控制器。測(cè)試表明本設(shè)計(jì)達(dá)到了國際市場(chǎng)同類先進(jìn)產(chǎn)品的性能。
[Abstract]:With the advent of the mobile Internet era, smart phones are profoundly affecting and changing the lives and work of people in all fields, as the main interface for users. 720P HD TFT-LCD(Thin FilmTransistor-Liquid Crystal display. The screen has become the dominant display terminal in the mobile phone market. As the interface circuit between the mobile phone processor and the display screen, the performance of the TFT-LCD driver control chip will directly affect the quality of the display screen and the power consumption of the system. In order to meet the demand of handheld mobile devices, miniaturization, low power consumption and high integration. High color resolution and low cost design are the main challenges in layout design of medium and small size HD TFT-LCD driver IC. This paper begins with the analysis of the difficulties of driving IC layout design, combining the characteristics of production process and chip packaging. This paper designs and implements the layout design of a high-definition TFT-LCD driver chip SSL0510, which can be applied to 720P or more. The specific measures are as follows: In the manufacturing process, a mixed signal CMOS process with five wells is adopted to improve the integration level of a single chip and reduce the power consumption of the chip. Through a reasonable layout, common devices are allowed to be placed directly under the PAD and other area-saving design techniques to reduce the chip size and reduce the cost; The layout design method of COG encapsulated Stagger PAD and Fine Pitch is adopted to realize the output of high color resolution. In order to ensure the reliability and stability of the chip, the manufacturability design technology DFM(Design For is also introduced. Signal Integrity Analysis (SI(Signal Integrity), as well as antenna effect and latch-up, are added to the layout design. Not only the quality of layout design is guaranteed, but also the minimum size of chip design is considered. This design adopts 110nm four-layer metal one layer POLY CMOS mixed voltage, mixed signal technology. Can drive high-definition amorphous silicon a-Si: amorphous silicon TFT-LCD panel, up to 720RGB / 1280 resolution. It can achieve 16.7 M color full-color display and integrate 2160 SOURCE driver signals and 1280 GATE timing control signals. The test results show that the design achieves the performance of similar advanced products in the international market.
【學(xué)位授予單位】：天津大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2013
【分類號(hào)】：TN402;TP334.7

【參考文獻(xiàn)】

相關(guān)期刊論文 前10條

1 吳豐順,張金松,吳懿平,鄭宗林,王磊,譙鍇;集成電路互連引線電遷移的研究進(jìn)展[J];半導(dǎo)體技術(shù);2004年09期

2 趙珉;楊清華;劉明;陳寶欽;;可制造性設(shè)計(jì)在納米SOC中的應(yīng)用和發(fā)展[J];微納電子技術(shù);2007年06期

3 翁壽松;;光刻、OPC與DFM[J];電子工業(yè)專用設(shè)備;2006年04期

4 王胤翔,周鳳亭,陸生禮;深亞微米IC物理設(shè)計(jì)流程中的串?dāng)_控制[J];電子器件;2005年01期

5 楊兵;羅靜;于宗光;;深亞微米CMOS電路多電源全芯片ESD技術(shù)研究[J];電子器件;2012年03期

6 萬永波;;驅(qū)動(dòng)IC在降低手機(jī)液晶模組能耗中的作用[J];中國電子商情(基礎(chǔ)電子);2009年04期

7 韋素芬;梁宇;;深亞微米SOC設(shè)計(jì)的去耦電容優(yōu)化方法學(xué)[J];大眾科技;2010年01期

8 張穎;潘亮;;芯片版圖面積的設(shè)計(jì)優(yōu)化[J];中國集成電路;2006年07期

9 李蜀霞;劉輝華;趙建明;何春;;超深亞微米IC設(shè)計(jì)中的天線效應(yīng)[J];中國集成電路;2008年04期

10 趙繼業(yè);楊旭;;納米級(jí)工藝對(duì)物理設(shè)計(jì)的影響[J];中國集成電路;2008年08期

本文編號(hào)：1409903