【摘要】：基于冗余結構,采用模塊化思路設計出一種大功率電鍍電源。由多個分散的模塊電源構成并機系統(tǒng),能根據負載需求靈活配比電源,利用STM32主控芯片和FPGA芯片組成集中控制系統(tǒng)實現均流控制,并利用FPGA芯片保證所有功率模塊的同步性。該電鍍電源具有成本低、控制精度高、可靠性強等優(yōu)點,能夠滿足電鍍工藝發(fā)展對電鍍電源提出的要求。
[Abstract]:Based on redundant structure, a kind of high power electroplating power supply is designed by modularization. The system is composed of a number of distributed modular power sources and can flexibly match the power supply according to the load requirements. The centralized control system is composed of STM32 main control chip and FPGA chip, and the synchronization of all power modules is ensured by using FPGA chip. The electroplating power supply has the advantages of low cost, high control precision and high reliability. It can meet the requirements of the electroplating process development for the electroplating power supply.
【作者單位】： 重慶電子工程職業(yè)學院物聯網學院;
【分類號】：TQ153
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本文編號：2380644