【摘要】：采用旋轉(zhuǎn)電鍍銀的方法進(jìn)行靜端導(dǎo)電塊的電鍍,研究了旋轉(zhuǎn)鍍時(shí)的轉(zhuǎn)速、有無反轉(zhuǎn)設(shè)置、施鍍電流密度、陽極電力線均布套筒(板)設(shè)置對(duì)鍍層厚度均勻性的影響,并采用對(duì)比方法對(duì)施鍍件在不同條件下,不同直徑上的鍍層的平均厚度、同一直徑上鍍層厚度的最大差值以及不同直徑上鍍層平均厚度的差值進(jìn)行了比較。結(jié)果表明,施鍍工作電流密度為0.8 A/dm~2、轉(zhuǎn)速為10 r/min,設(shè)置陽極電力線均布套筒(板)時(shí),鍍層均勻性好,d為70 mm處與d為40 mm處平均鍍層厚度相差僅為0.1μm。該陰極旋轉(zhuǎn)鍍裝置在自動(dòng)生產(chǎn)線上已成功實(shí)現(xiàn)了應(yīng)用。
[Abstract]:The rotating silver plating method was used to electroplate the conductive block at the static end. The effects of rotating speed, setting of reversal or not, current density of plating, setting of uniform sleeve (plate) of anode power line on the uniformity of coating thickness were studied. The average thickness of coating on different diameters, the maximum difference of coating thickness on the same diameter and the difference of average thickness of coating on different diameters were compared by means of comparative method. The results show that when the working current density of plating is 0.8 A / dm-2, the rotational speed is 10 r / min, the coating uniformity is good when the anode power line is distributed evenly, the average coating thickness difference between d = 70 mm and d = 40 mm is only 0.1 渭 m. The cathodic rotating plating device has been successfully applied in automatic production line.
【作者單位】： 中國電科43所合肥恒力裝備有限公司;
【分類號(hào)】：TQ153.16
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本文編號(hào)：2268268