發(fā)布時(shí)間：2018-06-06 20:55

  本文選題：無(wú)氰 + 四元合金��； 參考：《電鍍與環(huán)�！�2017年01期

【摘要】：研究出一種無(wú)氰四元合金電鍍工藝。通過(guò)對(duì)四元合金鍍層和鍍液性能進(jìn)行測(cè)試,確定了最佳的鍍液組成與工藝條件為:Sn~(2+)3.0~4.0g/L,Co~(2+)0.8~1.2g/L,Cu~(2+)12.0~13.0g/L,V5+0.2~0.4g/L,DS6008A300~500mL/L,DS6008B150~250mL/L,30~40℃,pH值6.0~8.0,0.6~1.2A/dm2。
[Abstract]:A non-cyanide-free quaternary alloy electroplating process was developed. By testing the properties of quaternion alloy coating and bath, the optimum bath composition and process conditions are determined as follows: 1: SnN 2 / L = 3.0g / L / L = 0.80.0.2g / L / L / L / L = 12.0g / L V5 0.20.4g / L DS6008A300,500mLLDS6008B150mL / L / L 3040 鈩，

本文編號(hào)：1988076