本文選題：單晶硅曲面 + 精密磨削　； 參考：《國(guó)防科學(xué)技術(shù)大學(xué)》2015年碩士論文

【摘要】：單晶硅曲面光學(xué)元件在高能激光系統(tǒng)中具有重要作用,其加工的面形精度和損傷性能對(duì)系統(tǒng)的性能有較大影響。單晶硅曲面工件成形加工過(guò)程存在許多問(wèn)題有待解決,而成熟的單晶硅平面鏡的加工工藝并不適用于曲面成形。單晶硅又是典型的硬脆材料,普通磨削加工不能有效控制工件的亞表面損傷,使得后續(xù)的拋光工藝難以權(quán)衡加工效率、成本與最終加工精度之間的關(guān)系,因此需要將精密磨削作為普通磨削與拋光工藝之間的銜接。本文圍繞誤差源對(duì)曲面面形精度的影響和工藝參數(shù)對(duì)工件亞表面損傷的影響兩個(gè)方面進(jìn)行研究,以期解決單晶硅曲面工件加工過(guò)程中損傷抑制與面形精度提升的問(wèn)題。研究主要內(nèi)容包括:(1)基于精密延性域磨削機(jī)理,分析單晶硅材料脆塑轉(zhuǎn)變磨削特性,得到臨界磨削力、臨界切深和砂輪的最小轉(zhuǎn)速等參數(shù)值,為后續(xù)工藝參數(shù)優(yōu)選提供依據(jù)。(2)研究影響單晶硅曲面工件成形精度的因素。通過(guò)建立對(duì)刀誤差、砂輪磨損對(duì)加工精度的影響模型,得到對(duì)刀誤差的誤差形式和砂輪磨損規(guī)律,提出具體的中心對(duì)準(zhǔn)原則和磨損補(bǔ)償?shù)牡ハ鞯墓に嚶肪�(xiàn)。(3)研究曲面磨削過(guò)程亞表面缺陷的分布規(guī)律。通過(guò)工藝實(shí)驗(yàn),建立磨削力、亞表面缺陷深度與加工工藝參數(shù)之間的關(guān)系,得到抑制缺陷的最優(yōu)加工參數(shù)。(4)以直徑195mm單晶硅凸拋物面為對(duì)象,進(jìn)行加工實(shí)驗(yàn)。搭建在位測(cè)量平臺(tái)并對(duì)其測(cè)量性能進(jìn)行評(píng)價(jià)。根據(jù)在位測(cè)量結(jié)果,提出合理的補(bǔ)償加工方案,最終加工工件表面粗糙度Ra值為0.081μm,面形精度PV值為3.77μm,亞表面缺陷深度約為3~5μm。
[Abstract]:Single crystal silicon curved surface optical element plays an important role in high energy laser system. The surface shape accuracy and damage performance of the single crystal silicon surface optical element have great influence on the performance of the system. There are many problems to be solved in the forming process of monocrystalline silicon surface workpiece, but the mature machining process of single crystal silicon plane mirror is not suitable for surface forming. Monocrystalline silicon is a typical hard and brittle material. Common grinding can not effectively control the sub-surface damage of workpiece, which makes it difficult for the subsequent polishing process to weigh the relationship between machining efficiency, cost and final machining precision. Therefore, it is necessary to use precision grinding as the link between common grinding and polishing technology. In this paper, the effect of error source on surface shape accuracy and the effect of process parameters on subsurface damage of workpiece are studied in order to solve the problems of damage suppression and improvement of surface precision during machining of monocrystalline silicon surface workpiece. The main research contents include: (1) based on the precision ductility domain grinding mechanism, the characteristics of brittle plastic transition grinding of monocrystalline silicon materials are analyzed, and the critical grinding force, critical cutting depth and the minimum rotational speed of grinding wheel are obtained. The factors that affect the forming accuracy of monocrystalline silicon curved workpiece are studied. By establishing the model of tool alignment error and grinding wheel wear on machining accuracy, the error form of tool alignment error and grinding wheel wear rule are obtained. The principle of center alignment and the process route of iterative grinding for wear compensation are put forward to study the distribution of subsurface defects in the surface grinding process. The relationship between grinding force, depth of subsurface defects and machining process parameters was established through technological experiments. The optimum machining parameters for restraining defects were obtained. The processing experiments were carried out with diameter 195mm monocrystalline silicon convex paraboloid as the object. The measurement platform is built and its measurement performance is evaluated. According to the in-situ measurement results, a reasonable compensation processing scheme is proposed. The final workpiece surface roughness Ra value is 0.081 渭 m, the surface shape precision PV value is 3.77 渭 m, and the subsurface defect depth is about 3 渭 m.
【學(xué)位授予單位】：國(guó)防科學(xué)技術(shù)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類(lèi)號(hào)】：TQ127.2

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本文編號(hào)：1979048