本文選題：單晶硅曲面 + 精密磨削　； 參考：《國防科學技術大學》2015年碩士論文

【摘要】：單晶硅曲面光學元件在高能激光系統(tǒng)中具有重要作用,其加工的面形精度和損傷性能對系統(tǒng)的性能有較大影響。單晶硅曲面工件成形加工過程存在許多問題有待解決,而成熟的單晶硅平面鏡的加工工藝并不適用于曲面成形。單晶硅又是典型的硬脆材料,普通磨削加工不能有效控制工件的亞表面損傷,使得后續(xù)的拋光工藝難以權衡加工效率、成本與最終加工精度之間的關系,因此需要將精密磨削作為普通磨削與拋光工藝之間的銜接。本文圍繞誤差源對曲面面形精度的影響和工藝參數(shù)對工件亞表面損傷的影響兩個方面進行研究,以期解決單晶硅曲面工件加工過程中損傷抑制與面形精度提升的問題。研究主要內容包括:(1)基于精密延性域磨削機理,分析單晶硅材料脆塑轉變磨削特性,得到臨界磨削力、臨界切深和砂輪的最小轉速等參數(shù)值,為后續(xù)工藝參數(shù)優(yōu)選提供依據(jù)。(2)研究影響單晶硅曲面工件成形精度的因素。通過建立對刀誤差、砂輪磨損對加工精度的影響模型,得到對刀誤差的誤差形式和砂輪磨損規(guī)律,提出具體的中心對準原則和磨損補償?shù)牡ハ鞯墓に嚶肪�。(3)研究曲面磨削過程亞表面缺陷的分布規(guī)律。通過工藝實驗,建立磨削力、亞表面缺陷深度與加工工藝參數(shù)之間的關系,得到抑制缺陷的最優(yōu)加工參數(shù)。(4)以直徑195mm單晶硅凸拋物面為對象,進行加工實驗。搭建在位測量平臺并對其測量性能進行評價。根據(jù)在位測量結果,提出合理的補償加工方案,最終加工工件表面粗糙度Ra值為0.081μm,面形精度PV值為3.77μm,亞表面缺陷深度約為3~5μm。
[Abstract]:Single crystal silicon curved surface optical element plays an important role in high energy laser system. The surface shape accuracy and damage performance of the single crystal silicon surface optical element have great influence on the performance of the system. There are many problems to be solved in the forming process of monocrystalline silicon surface workpiece, but the mature machining process of single crystal silicon plane mirror is not suitable for surface forming. Monocrystalline silicon is a typical hard and brittle material. Common grinding can not effectively control the sub-surface damage of workpiece, which makes it difficult for the subsequent polishing process to weigh the relationship between machining efficiency, cost and final machining precision. Therefore, it is necessary to use precision grinding as the link between common grinding and polishing technology. In this paper, the effect of error source on surface shape accuracy and the effect of process parameters on subsurface damage of workpiece are studied in order to solve the problems of damage suppression and improvement of surface precision during machining of monocrystalline silicon surface workpiece. The main research contents include: (1) based on the precision ductility domain grinding mechanism, the characteristics of brittle plastic transition grinding of monocrystalline silicon materials are analyzed, and the critical grinding force, critical cutting depth and the minimum rotational speed of grinding wheel are obtained. The factors that affect the forming accuracy of monocrystalline silicon curved workpiece are studied. By establishing the model of tool alignment error and grinding wheel wear on machining accuracy, the error form of tool alignment error and grinding wheel wear rule are obtained. The principle of center alignment and the process route of iterative grinding for wear compensation are put forward to study the distribution of subsurface defects in the surface grinding process. The relationship between grinding force, depth of subsurface defects and machining process parameters was established through technological experiments. The optimum machining parameters for restraining defects were obtained. The processing experiments were carried out with diameter 195mm monocrystalline silicon convex paraboloid as the object. The measurement platform is built and its measurement performance is evaluated. According to the in-situ measurement results, a reasonable compensation processing scheme is proposed. The final workpiece surface roughness Ra value is 0.081 渭 m, the surface shape precision PV value is 3.77 渭 m, and the subsurface defect depth is about 3 渭 m.
【學位授予單位】：國防科學技術大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TQ127.2

【參考文獻】

相關期刊論文 前10條

1 艾小忱;董志剛;周平;康仁科;陳曉;郭東明;;金剛石砂輪緩進給磨削單晶硅溝槽研究[J];金剛石與磨料磨具工程;2015年02期

2 趙爽;付秀華;賈宗合;;單晶硅柱面反射鏡的加工與檢測[J];長春理工大學學報(自然科學版);2013年Z2期

3 張坤領;;光學玻璃非球面延性域磨削研究[J];組合機床與自動化加工技術;2011年09期

4 袁巨龍;張飛虎;戴一帆;康仁科;楊輝;呂冰海;;超精密加工領域科學技術發(fā)展研究[J];機械工程學報;2010年15期

5 簡金輝;焦鋒;;超精密加工技術研究現(xiàn)狀及發(fā)展趨勢[J];機械研究與應用;2009年01期

6 張銀霞;郜偉;康仁科;郭東明;;單晶硅片磨削損傷的透射電子顯微分析[J];半導體學報;2008年08期

7 張銀霞;郜偉;康仁科;郭東明;;單晶硅片磨削的表面相變[J];光學精密工程;2008年08期

8 郭曉光;郭東明;康仁科;金洙吉;;原子量級條件下單晶硅磨削過程中的亞表面損傷(英文)[J];半導體學報;2007年09期

9 尹韶輝;陳逢軍;張導成;大森整;林偉民;上原嘉宏;;結合ELID磨削與磁流變光整加工的單晶硅反射鏡超精密制造技術[J];納米技術與精密工程;2007年03期

10 盧澤生,王明海;硬脆光學晶體材料超精密切削理論研究綜述[J];機械工程學報;2003年08期

相關博士學位論文 前2條

1 高尚;硅片超精密磨削減薄工藝基礎研究[D];大連理工大學;2013年

2 霍鳳偉;硅片延性域磨削機理研究[D];大連理工大學;2006年

相關碩士學位論文 前2條

1 龔智群;基于國產器件的高功率脈沖光纖激光器研究[D];國防科學技術大學;2012年

2 王樊;大尺寸單晶硅反射鏡超精密連續(xù)拋光和檢測的研究[D];長春理工大學;2010年

，

本文編號：1979048