精密金剛石環(huán)線切割關鍵技術研究
發(fā)布時間:2018-03-15 06:16
本文選題:硬脆材料 切入點:脆塑轉(zhuǎn)變 出處:《中原工學院》2017年碩士論文 論文類型:學位論文
【摘要】:硬脆材料加工的高精度零部件在設備上起著重要作用,硬脆材料屬于難加工材料,而切割作為材料加工制作第一道工序,其質(zhì)量好壞影響后續(xù)的工序進程,甚至影響產(chǎn)品最終使用壽命。針對硬脆材料高質(zhì)量、高效率及低損耗切割要求,開展了硬脆材料精密切割加工技術研究。論文的硬脆材料切割機理研究依據(jù)脆性斷裂力學為基礎,通過壓痕試驗裂紋生長過程,證明了硬脆性材料在一定條件下可實現(xiàn)塑性去除,并討論脆塑轉(zhuǎn)變臨界條件。根據(jù)金剛石線顆粒形狀、大小及分布特點,建立了硬脆材料金剛石線切割幾何模型,計算了金剛石線截面不同位置單顆粒平均切削深度及單顆粒實際切削深度,并對金剛石線切割效率進行理論分析,為硬脆材料高質(zhì)量、高效率切割提供理論依據(jù)。針對硬脆材料中小口徑精密平面切割工藝要求,機床研發(fā)過程采用TOP-DOWN關聯(lián)設計方法,提出了高精度環(huán)形金剛石線切割機HGJ-200總體設計方案,包括環(huán)形金剛石線制造工藝、切割機床的進給系統(tǒng)、環(huán)線切割框架、恒張力控制裝置;赟olidworks Simulation有限元分析方法,對機床關鍵零部件進行了靜、動態(tài)特性分析,優(yōu)化了機床結構,提高了機床的精度、剛度及穩(wěn)定性。為了保證更高的切割精度,對機床的制造、裝配及測量工藝開展較為系統(tǒng)的研究,整機裝配過程嚴格執(zhí)行精密超精密機床裝配流程,根據(jù)機床誤差分配原則,分析了環(huán)形金剛石線切割機存在的13項幾何誤差,采用RENISHAW XL-80激光干涉儀等測量方法,對機床各移動副及切割框架精度進行測量和調(diào)試。切割裝備研制完成后,對硬脆材料切割開展一系列切割工藝試驗,通過正交試驗設計及灰色關聯(lián)理論分析方法,得出切割不同工藝參數(shù)對KDP晶體切割后的表面粗糙度、平面度及崩邊大小影響規(guī)律,選擇最優(yōu)工藝參數(shù)進行試驗后,KDP晶體切割質(zhì)量Ra為0.94μm和平面度為11μm;崩邊大小受環(huán)線線速度影響顯著,在線速度50m/s以內(nèi),機床切割穩(wěn)定性好。工件平臺增加了旋轉(zhuǎn)裝置,在對于硬脆材料圓棒料切割上,切割質(zhì)量及切割效率明顯得到改觀。在工件不同切割模式下,研究了不同粒度金剛石線的切割特性與使用壽命,并得出0.7mm電鍍金剛石線切割Nd:YAG晶體總厚度偏差TTV30μm。
[Abstract]:The high precision parts of hard and brittle materials play an important role in the equipment. Hard and brittle materials are difficult to be machined. As the first process of material processing, the quality of cutting affects the process of subsequent processes. Even affect the final service life of the product. For hard and brittle materials of high quality, high efficiency and low loss cutting requirements, The cutting mechanism of hard brittle material is studied based on brittle fracture mechanics, and the crack growth process is tested by indentation test. The plastic removal of hard brittle materials can be realized under certain conditions, and the critical condition of brittle plastic transition is discussed. According to the shape, size and distribution of diamond grain, a geometric model of diamond wire cutting for hard brittle materials is established. The average cutting depth of single particle and the actual cutting depth of single particle in different positions of diamond line section are calculated, and the theoretical analysis of diamond wire cutting efficiency is carried out, which is a hard and brittle material with high quality. High efficiency cutting provides theoretical basis. According to the technological requirements of medium and small diameter precision plane cutting of hard and brittle materials, the TOP-DOWN correlation design method is adopted in the research and development of machine tools, and the overall design scheme of HGJ-200 for high precision ring diamond wire cutting machine is put forward. It includes ring diamond wire manufacturing technology, feed system of cutting machine tool, ring wire cutting frame, constant tension control device. Based on Solidworks Simulation finite element analysis method, the static and dynamic characteristics of key parts of machine tool are analyzed. The structure of the machine is optimized, and the precision, stiffness and stability of the machine are improved. In order to ensure higher cutting accuracy, the manufacture, assembly and measuring technology of the machine tool are studied systematically. The assembly process of precision ultra-precision machine tool is strictly carried out in the whole assembly process. According to the principle of error distribution of the machine tool, the 13 geometric errors of ring diamond wire cutting machine are analyzed, and the measuring methods such as RENISHAW XL-80 laser interferometer are used. The precision of each moving pair and cutting frame of machine tool was measured and debugged. After the development of cutting equipment, a series of cutting process tests were carried out on hard and brittle materials, and the orthogonal test design and grey correlation theory analysis method were adopted. The effects of different cutting parameters on the surface roughness, planeness and flanging size of KDP crystal are obtained. The cutting quality of KDP crystal is 0.94 渭 m and the planeness is 11 渭 m after the optimum technological parameters are selected for the experiment, the size of the caving edge is significantly affected by the loop velocity, the on-line speed is less than 50 m / s, and the cutting stability of the machine tool is good. The cutting quality and cutting efficiency of hard and brittle round bar material are improved obviously. The cutting characteristics and service life of diamond wire with different grain size are studied under different cutting modes of workpiece. The total thickness deviation of 0.7 mm electroplated diamond wire cut Nd:YAG crystal is obtained by TTV30 渭 m.
【學位授予單位】:中原工學院
【學位級別】:碩士
【學位授予年份】:2017
【分類號】:TQ163
【參考文獻】
相關期刊論文 前10條
1 邵建達;戴亞平;許喬;;慣性約束聚變激光驅(qū)動裝置用光學元器件的研究進展[J];光學精密工程;2016年12期
2 何健;徐中民;宋麗;王R,
本文編號:1614788
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