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MSA電鍍錫液連續(xù)除鉛方法的研究

發(fā)布時間:2018-03-04 05:11

  本文選題:鍍錫板 切入點(diǎn):除鉛 出處:《華東理工大學(xué)》2017年碩士論文 論文類型:學(xué)位論文


【摘要】:鍍錫板被廣泛應(yīng)用在食品飲料包裝,而鍍錫板鍍層中鉛含量超標(biāo)的問題威脅著人們的健康。由于電鍍生產(chǎn)所用的原料錫錠中有鉛的存在,鉛與錫的電極電位十分接近,所以在電鍍過程中,鉛十分容易與錫一起沉積在帶鋼表面,造成鍍錫層中的鉛含量超標(biāo)。目前國內(nèi)外的鍍錫板生產(chǎn)商還缺乏有效降低鍍錫板鍍層中鉛含量的方法及研究,僅是采用低鉛錫粒來生產(chǎn)電鍍產(chǎn)品,該方法大幅增加生產(chǎn)成本,所以研究出其他有效、經(jīng)濟(jì)、易操作并且環(huán)保的降鉛方法迫在眉睫。電鍍錫工藝十分復(fù)雜,若想有效地降低鍍層中的鉛含量,必須找到鉛的來源,并依次進(jìn)行后續(xù)的除鉛研究。因此,論文首先進(jìn)行了鍍層中的鉛來源分析,通過分析確定了錫原料是鉛的最主要來源,考慮到錫鉛共生礦的原因,使用低鉛錫原料進(jìn)行電鍍錫的方法既不經(jīng)濟(jì)也不現(xiàn)實(shí)。在此基礎(chǔ)上確定了鍍錫液為除鉛對象,基于化學(xué)沉淀法處理含鉛廢水的成熟工藝,利用硫酸鋇共沉淀法來降低鍍液中的鉛含量,并對其除鉛性能進(jìn)行驗(yàn)證。另外結(jié)合電鍍實(shí)際生產(chǎn)工藝,考慮到鍍液的循環(huán)利用,設(shè)計(jì)了鍍錫液連續(xù)除鉛工藝,結(jié)合化學(xué)沉淀法及沉降過程,設(shè)計(jì)并裝配了鍍錫液連續(xù)除鉛實(shí)驗(yàn)裝置,該裝置主要包含化學(xué)反應(yīng)及沉降兩個主要過程,并通過此裝置進(jìn)行鍍液除鉛實(shí)驗(yàn),得到了比較適合的除鉛工藝參數(shù),為生產(chǎn)提供數(shù)據(jù)支持。另外,利用數(shù)值模擬的方法對現(xiàn)場沉降罐的沉降性能進(jìn)行了研究,分析了運(yùn)行參數(shù)對沉降效果的影響。
[Abstract]:Tin plating plate is widely used in food and beverage packaging, and the problem of excessive lead content in tin plate coating threatens people's health. Due to the presence of lead in tin ingots used in electroplating production, the electrode potential of lead and tin is very close to that of tin. Therefore, in the electroplating process, lead is easily deposited on the steel strip surface together with tin, which results in the lead content in the tin coating exceeding the standard. At present, domestic and foreign tinplate manufacturers lack effective methods and research to reduce the lead content in the tin plating coating. Only low lead tin particles are used to produce electroplating products. This method greatly increases the production cost, so it is urgent to develop other effective, economical, easy to operate and environmentally friendly lead reduction methods. If we want to effectively reduce the lead content in the coating, we must find the source of lead, and carry on the subsequent lead removal research in turn. Therefore, the paper first carries on the lead source analysis in the coating, through the analysis has determined that the tin raw material is the most important source of lead. Considering the reason of the cogeneration of tin and lead, the method of electroplating tin with low lead tin raw material is neither economical nor practical. On the basis of this, the mature process of treating lead-containing wastewater with tin plating solution as lead removal object is determined. The barium sulfate coprecipitation method was used to reduce the lead content in the plating bath, and its lead removal performance was verified. In addition, considering the recycling of the plating bath, the continuous lead removal process of the tin plating bath was designed, combined with the actual production process of electroplating. Combined with chemical precipitation method and sedimentation process, a continuous lead removal experiment device for tin plating bath is designed and assembled. The device mainly includes two main processes of chemical reaction and sedimentation, and carries out the experiment of bath lead removal by this device. The suitable technological parameters of lead removal are obtained to provide data support for the production. In addition, the settlement performance of the on-site settling tank is studied by numerical simulation, and the influence of operation parameters on the settlement effect is analyzed.
【學(xué)位授予單位】:華東理工大學(xué)
【學(xué)位級別】:碩士
【學(xué)位授予年份】:2017
【分類號】:TQ153.13

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