本文關(guān)鍵詞： 藍(lán)寶石 飛秒激光 超聲刻蝕 表面形貌　出處：《吉林大學(xué)》2017年碩士論文　論文類型：學(xué)位論文

【摘要】：藍(lán)寶石硬度高,化學(xué)穩(wěn)定性好且熔點(diǎn)高,同時(shí)具有很好的透光性,是光學(xué)元件、光罩和飛行器窗口的重要材料。藍(lán)寶石的脆性大、化學(xué)性質(zhì)穩(wěn)定,很難利用傳統(tǒng)方法加工。選擇性激光刻蝕技術(shù)是包括飛秒激光掃描和化學(xué)腐蝕的復(fù)合加工方法,本文通過優(yōu)化飛秒激光加工參數(shù)以獲得較好的表面形貌,利用二維超聲振動(dòng)輔助化學(xué)腐蝕提高加工效率和表面質(zhì)量。并研究射流技術(shù)結(jié)合化學(xué)腐蝕對(duì)提高藍(lán)寶石加工區(qū)域表面質(zhì)量的改善作用。本文主要工作如下:優(yōu)化激光加工參數(shù):準(zhǔn)確計(jì)算藍(lán)寶石的激光燒灼閾值,為2.0296J/cm2。根據(jù)焦點(diǎn)的投影面積,推導(dǎo)出在藍(lán)寶石表面激光掃描速度與脈沖數(shù)的關(guān)系通式;提出交叉式逐行的掃描路徑,并仿真表面形貌,得出當(dāng)掃描行間距一定,焦點(diǎn)長軸平行于被加工表面時(shí),焦點(diǎn)縱橫比越大,殘留高度越大,長軸垂直被加工表面時(shí)結(jié)論相反;焦點(diǎn)尺寸越小,殘留高度越大。當(dāng)焦點(diǎn)尺寸確定,掃描行間距越大,殘留高度越大,且二者關(guān)系曲線形狀與焦點(diǎn)弧形輪廓一致。激光加工試驗(yàn)表明,超過閾值情況下,激光功率越小激光熱影響區(qū)越小(燒蝕孔的直徑越小);脈沖數(shù)多少對(duì)燒蝕孔直徑大小影響很小。研制二維超聲振動(dòng)裝置輔助化學(xué)刻蝕,分別選用HF以及濃H2SO4對(duì)激光加工后的藍(lán)寶石試件進(jìn)行超聲刻蝕實(shí)驗(yàn)。HF刻蝕藍(lán)寶石正交實(shí)驗(yàn)表明40%濃度、刻蝕1h的條件下藍(lán)寶石表面質(zhì)量較好,能夠降低0.5382μm,相比非超聲振動(dòng)刻蝕去除率提高約81%,并能夠減少約69%的腐蝕層生成。此外,濃H2SO4溶液刻蝕實(shí)驗(yàn)證實(shí)溫度越高刻蝕效果越好,但遠(yuǎn)不如HF溶液的刻蝕效果。結(jié)合射流技術(shù)與化學(xué)腐蝕技術(shù),分別進(jìn)行了酸射流刻蝕實(shí)驗(yàn)和磨料刻蝕實(shí)驗(yàn),分析了流速對(duì)刻蝕效果的影響,同時(shí)驗(yàn)證了磨料與刻蝕液混合進(jìn)行拋光的可行性。結(jié)果表明,表面材料去除量隨酸射流流速的增加而增大,趨勢(shì)逐漸變大。磨料酸射流實(shí)驗(yàn)中,發(fā)現(xiàn)拋光液與刻蝕液混合后立即加工的材料去除效果比酸射流好,效果與磨料水射流拋光相差不多,說明磨料刻蝕射流中拋光起主要作用,拋光液與腐蝕液混合時(shí)間越長,效果越差。
[Abstract]:Sapphire has high hardness, good chemical stability and high melting point. It is an important material for optical elements, light masks and aircraft windows. Selective laser etching is a compound processing method including femtosecond laser scanning and chemical etching. In this paper, the parameters of femtosecond laser processing are optimized to obtain better surface morphology. Two dimensional ultrasonic vibration assisted chemical etching is used to improve machining efficiency and surface quality. The effect of jet technique combined with chemical corrosion on the improvement of surface quality in sapphire processing area is studied. The main work of this paper is as follows:. Laser processing parameters: accurate calculation of laser cauterization threshold of sapphire, The relationship between laser scanning speed and pulse number on the sapphire surface is derived according to the projected area of focus, and the cross scanning path is proposed, and the surface morphology is simulated, which shows that the scanning line spacing is constant. When the focus axis is parallel to the machined surface, the larger the focus aspect ratio is, the greater the residual height is, and the opposite conclusion is obtained when the long axis is processed vertically; the smaller the focal point size, the greater the residual height. The higher the residual height is, and the shape of the relationship curve is the same as the focus arc profile. The laser processing test shows that when the threshold is exceeded, the shape of the curve is the same as that of the focus arc. The smaller the laser power is, the smaller the heat affected zone is (the smaller the diameter of the ablation hole is; the smaller the number of pulses is, the smaller the diameter of the ablation hole is.) the development of a two-dimensional ultrasonic vibration device to assist chemical etching, The ultrasonic etching experiments of laser processed sapphire samples with HF and concentrated H _ 2SO _ 4 showed that the surface quality of sapphire was better when the concentration of 40% was 40% and the etching time was 1 h. It can reduce 0.5382 渭 m, increase the removal rate of non-ultrasonic vibration etching by about 81%, and reduce the formation of corrosion layer by about 69%. In addition, the etching experiment of concentrated H _ 2SO _ 4 solution proves that the higher the temperature, the better the etching effect is. However, the etching effect of HF solution is not as good as that of HF solution. Combined with jet technique and chemical etching technique, the experiments of acid jet etching and abrasive etching are carried out, and the effect of flow rate on etching effect is analyzed. At the same time, the feasibility of polishing with abrasive and etching solution is verified. The results show that the removal amount of surface material increases with the increase of the velocity of acid jet, and the trend becomes larger. It is found that the material removal effect of polishing liquid and etching liquid immediately after mixing is better than that of acid jet, and the effect is not much different from that of abrasive water jet polishing, which indicates that polishing plays a major role in abrasive etching jet, and the longer the mixing time of polishing liquid and corrosion liquid is, The worse the effect.
【學(xué)位授予單位】：吉林大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TQ164

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