本文關(guān)鍵詞： (Ca_(18/19)Sr_(1/19))_(0.2)(Li_(0.5)Sm_(0.5))_(0.8)TiO_3 微波介質(zhì)陶瓷 低溫共燒 流延成型　出處：《景德鎮(zhèn)陶瓷學(xué)院》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：隨著信息通訊技術(shù)的快速發(fā)展,將微波介質(zhì)陶瓷材料應(yīng)用于低溫共燒陶瓷(Low Temperature Co-fired Ceramics,簡稱LTCC)已成為當今的發(fā)展重點和方向。本文以添加了燒結(jié)助劑B2O3-CuO-Li2CO3(BCL)玻璃粉料的(Ca18/i9Sri/i9)o.2(Li0.5Sm0.5)0.8TiO3 (CSLST)高介電常數(shù)微波介質(zhì)陶瓷粉體為基體粉料,研究其水基流延成型工藝與有機流延成型工藝,獲得了可實用化的CSLST系低溫共燒微波介質(zhì)陶瓷材料。(1)以苯丙乳液為粘結(jié)劑,聚乙烯吡咯烷酮(PVP)為分散劑,丙三醇為增塑劑,去離子水為分散介質(zhì),對添加燒結(jié)助劑BCL玻璃的CSLST微波介質(zhì)陶瓷粉體(CSLST+BCL)進行水基流延成型工藝的研究。通過研究漿料的pH值、固含量以及各種添加劑含量對漿料分散性以及流變性能的影響,獲得了適合流延的漿料配方：漿料pH=10,陶瓷粉體固含量60.5-65.6wt%,分散劑0.8wt%,粘結(jié)劑10-14wt%,增塑劑與粘結(jié)劑比例R為0.25時,該漿料適合于流延成型。通過采用除泡劑正丁醇和真空攪拌脫泡機共用的方法有效排除流延漿料中的氣泡,在流延機上流延后在40-60℃下干燥可制備表面光滑、平整、均勻、無裂紋的流延膜片。(2)以二甲苯、正丁醇混合溶液作為分散溶劑,自制的BM-2為粘結(jié)劑,聚乙二醇PEG為增塑劑對CSLST+BCL陶瓷粉體進行有機流延成型工藝的研究。通過分散溶劑的比例、固相含量對料漿流變性能的影響,優(yōu)化流延漿料配方,獲得了可低溫?zé)Y(jié)且致密度高的CSLST微波介質(zhì)陶瓷基片。研究表明：當陶瓷粉體固含量55wt%,分散溶劑二甲苯、正丁醇的比例為1：1,粘結(jié)劑為8-11%,增塑劑為3-4%。該漿料具有適合于流延成型的典型剪切變稀行為的流體特征。經(jīng)流延成型干燥后可制備光滑平整無裂紋的流延膜片。(3)通過流延成型工藝制備CSLST+BCL微波介質(zhì)陶瓷的流延膜片,通過熱重-差熱分析,確定流延膜片合理的排膠和燒結(jié)制度,通過測量燒結(jié)后膜片的密度判斷其燒結(jié)特性。實驗結(jié)果表明：水基流延膜片疊層后在900℃下燒結(jié)具有良好的微波介電性能：介電常數(shù)εr=59.2,品質(zhì)因數(shù)Q×f=1044GHz,諧振頻率溫度系數(shù)τf=18.39×10-6/℃。有機流延膜片疊層后在900℃下燒結(jié)也具有較佳的微波介電性能：εr= 54.2, Q×f=1249 GHz, τf= 18.42×10-6/℃。(4)通過研究兩種流延膜片與添加不同含量CSLST+BCL陶瓷粉體的銀漿的共燒行為結(jié)果發(fā)現(xiàn)：膜片與含5%CSLST+BCL基體粉料的銀電極在900℃共燒后具有較好的結(jié)合性。對CSLST微波介質(zhì)陶瓷的兩種流延成型工藝的研究,得出了合適的流延配方,微波介電性能優(yōu)良,且能與銀電極有良好的結(jié)合性,可滿足LTCC技術(shù)要求。
[Abstract]:With the rapid development of information and communication technology, The application of microwave dielectric ceramic materials to low Temperature Co-fired ceramics (LTCCs) has become the focus and direction of development. In this paper, the high dielectric constant microwave dielectric ceramic powders with sintering additive B _ 2O _ 3-CuO-Li _ 2CO _ 3O _ 3BCLs are used as the matrix powders, and the ceramic powders with high dielectric constant are added to the glass powder of B _ 2O _ 3-CuO-Li _ 2CO _ 3O _ 3B _ (CLC), and the ceramic powders with high dielectric constant are added to the glass powder of B _ 2O _ 3-CuO-Li _ 2CO _ (3). The water-based casting process and organic casting process were studied. The practical CSLST low temperature co-fired microwave dielectric ceramic material. 1) was obtained by using styrene acrylic emulsion as binder, polyvinylpyrrolidone as dispersant, glycerol as plasticizer, and polyvinyl pyrrolidone (PVP) as dispersant, polyvinyl pyrrolidone as plasticizer, polyvinylpyrrolidone as plasticizer. The water based casting process of CSLST microwave dielectric ceramic powder (CSLST BCLs) was studied by using deionized water as the dispersing medium. The pH value of the slurry was studied. The effects of solid content and various additives on the dispersity and rheological properties of the slurry were obtained. The suitable slurry formula was obtained: the slurry pH 10, the solid content of ceramic powder 60.5-65.6 wts, the dispersant 0.8wtt, the binder 10-14wtand the plasticizer / binder R 0.25, the ratio of plasticizer to binder R is 0.25, the ratio of plasticizer to binder R is 0.25, and the ratio of plasticizer to binder is 0.25. The slurry is suitable for casting forming. By using the common method of defoaming agent n-butanol and vacuum agitation degumming machine, the bubble in the casting slurry can be effectively removed, and the surface of the slurry can be made smooth, smooth and uniform when the flow is delayed and dried at 40-60 鈩，

本文編號：1523076