Simulation study of InAlN/GaN high-electron mobility transis
發(fā)布時間:2021-10-08 03:51
In this work, we use a 3-nm-thick Al0.64In0.36N back-barrier layer in In0.17Al0.83 N/Ga N high-electron mobility transistor(HEMT) to enhance electron confinement. Based on two-dimensional device simulations, the influences of Al0.64In0.36 N back-barrier on the direct-current(DC) and radio-frequency(RF) characteristics of In AlN/GaN HEMT are investigated, theoretically. It is shown that an effective conduction band discontinuity of...
【文章來源】:Chinese Physics B. 2017,26(10)EISCI
【文章頁數(shù)】:5 頁
【參考文獻】:
期刊論文
[1]晶格匹配InAlN/GaN HEMT溝道溫度評估方法研究[J]. 金寧,陳雷雷,曹艷榮,梁海蓮,閆大為,顧曉峰. 微電子學(xué). 2020(06)
碩士論文
[1]毫米波AlGaN/GaN/AlGaN雙異質(zhì)結(jié)HEMT研究[D]. 程志宏.西安電子科技大學(xué) 2020
本文編號:3423378
【文章來源】:Chinese Physics B. 2017,26(10)EISCI
【文章頁數(shù)】:5 頁
【參考文獻】:
期刊論文
[1]晶格匹配InAlN/GaN HEMT溝道溫度評估方法研究[J]. 金寧,陳雷雷,曹艷榮,梁海蓮,閆大為,顧曉峰. 微電子學(xué). 2020(06)
碩士論文
[1]毫米波AlGaN/GaN/AlGaN雙異質(zhì)結(jié)HEMT研究[D]. 程志宏.西安電子科技大學(xué) 2020
本文編號:3423378
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