【摘要】：進(jìn)入21世紀(jì)以來(lái),中國(guó)已成為全球最大、最重要的SMT(Surface Mount Technology,表面貼裝技術(shù))市場(chǎng)。SMT產(chǎn)品與裝備是半導(dǎo)體封裝產(chǎn)業(yè)的關(guān)鍵環(huán)節(jié),對(duì)應(yīng)要求SMD(Surface Mounted Devices,表面安裝器件)元件高效、穩(wěn)定、準(zhǔn)確的拾取、轉(zhuǎn)移和放置。拾取頭的作用便是拾取和放置SMD元器件。由于SMD元件種類(lèi)繁多、尺寸多樣,工藝中迫切需要具有良好適應(yīng)性的拾取頭。本文主要對(duì)SMD拾取頭進(jìn)行設(shè)計(jì)與優(yōu)化,開(kāi)發(fā)出了適用于SMD檢測(cè)、轉(zhuǎn)移系統(tǒng)的多適應(yīng)性拾取頭。通過(guò)結(jié)構(gòu)設(shè)計(jì)、數(shù)值仿真計(jì)算和實(shí)驗(yàn)測(cè)試等研究,取得了以下成果:1)設(shè)計(jì)了創(chuàng)新的吸嘴組件,更大范圍地適應(yīng)多種尺寸的SMD元器件,避免了因SMD類(lèi)型變化導(dǎo)致的頻繁更換吸嘴的工作,提高了生產(chǎn)效率。2)仿真分析了吸嘴特征參數(shù)對(duì)拾取流場(chǎng)的影響,基于Fluent軟件的仿真結(jié)果表明:在直徑突變的地方添加倒角并不能對(duì)吸嘴外流場(chǎng)產(chǎn)生明顯的影響;接通的通氣孔數(shù)越多,壓力分布越均勻,真空度越高,越有利于拾取SMD元器件;吸嘴通氣孔的直徑越大,吸嘴口部的壓力分布越不均勻,但是吸嘴口部的真空度越高;吸嘴口部的凹槽越深,它的壓力分布越均勻。3)實(shí)測(cè)驗(yàn)證了所設(shè)計(jì)方案和仿真結(jié)論,通過(guò)在安裝新拾取頭的SMD檢測(cè)設(shè)備上進(jìn)行實(shí)驗(yàn),獲得如下結(jié)論:拾取頭的多適應(yīng)性實(shí)驗(yàn)驗(yàn)證了拾取頭設(shè)計(jì)的合理性;獲得了進(jìn)氣壓力和真空度的關(guān)系對(duì)應(yīng)表,為以后檢測(cè)設(shè)備是否漏氣提供了數(shù)據(jù)支持;分析了拾取頭拾取芯片的不同錯(cuò)誤產(chǎn)生的原因,為以后設(shè)備故障的分析提供了相應(yīng)地參數(shù)依據(jù)和技術(shù)支持�？傊�,本課題所設(shè)計(jì)適應(yīng)性拾取頭結(jié)構(gòu)和分析結(jié)論能夠滿(mǎn)足SMD轉(zhuǎn)移工藝的廣泛需求,并已在實(shí)際檢測(cè)設(shè)備上得到驗(yàn)證。
[Abstract]:Since the beginning of the 21st century, China has become the largest and most important SMT (Surface Mount Technology, surface mount technology in the world. SMT products and equipment are the key links in the semiconductor packaging industry, corresponding to the requirements of SMD (Surface Mounted Devices, surface installation devices) components are picked up, transferred and placed efficiently, stably and accurately. The function of pickup head is to pick up and place SMD components. Because of the variety and size of SMD components, it is urgent to have a good adaptability pick-up head in the process. In this paper, the SMD pickup head is designed and optimized, and a multi-adaptive pickup head suitable for SMS detection and transfer system is developed. Through the research of structure design, numerical simulation calculation and experimental test, the following results have been obtained: 1) the innovative suction nozzle assembly is designed to adapt to SMD components of various sizes, which avoids the frequent replacement of suction nozzle caused by the change of SMD type, and improves the production efficiency. 2) the influence of characteristic parameters of suction nozzle on picking up flow field is simulated and analyzed. The simulation results based on Fluent software show that the addition of chamfer in the place of sudden change of diameter can not have an obvious effect on the outflow field of suction nozzle. The more the number of ventilation holes connected, the more uniform the pressure distribution and the higher the vacuum degree, the more favorable it is to pick up SMD components. The larger the diameter of the suction hole is, the more uneven the pressure distribution is, but the higher the vacuum degree of the suction mouth is, the more uniform the pressure distribution is, the higher the vacuum degree of the suction mouth is. The deeper the groove at the suction port is, the more uniform the pressure distribution is. 3) the designed scheme and simulation results are verified by the actual measurement and verification. Through the experiment on the SMD detection equipment with the new pickup head, the following conclusions are obtained: the multi-adaptability experiment of the pickup head verifies the rationality of the pickup head design, and obtains the corresponding table of the relationship between intake pressure and vacuum degree, which provides data support for the future detection of whether the equipment is leaking or not. The causes of different errors in picking up chips by pickup head are analyzed, which provides the corresponding parameter basis and technical support for the analysis of equipment faults in the future. In a word, the adaptive pickup head structure and analysis conclusion designed in this paper can meet the extensive needs of SMD transfer process, and have been verified on the actual testing equipment.
【學(xué)位授予單位】：華中科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類(lèi)號(hào)】：TN305

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