【摘要】：運(yùn)用單純形優(yōu)化法對銅箔棕化處理的配方和工藝條件進(jìn)行動態(tài)尋優(yōu),得到最優(yōu)組合為:內(nèi)層鍵合劑25~40 mL/L,濃硫酸55~60 mL/L,雙氧水35~50 mL/L,溫度30~45℃,時(shí)間50~60s。在最優(yōu)條件下棕化處理的銅箔與樹脂的剝離強(qiáng)度達(dá)0.74 kg/cm,經(jīng)100個(gè)冷熱沖擊循環(huán)、6次高溫浸錫和6次無鉛回流焊后均無分層、爆板現(xiàn)象。棕化后的銅箔表面形成了微觀均勻的蜂窩狀孔隙結(jié)構(gòu),剝離時(shí)分層發(fā)生于有機(jī)銅氧化膜與銅基板的界面處。
[Abstract]:By using simplex optimization method, the formula and technological conditions of brown treatment of copper foil were optimized dynamically. The optimum combination was obtained as follows: inner bonding agent 25 渭 40 mL/L, concentrated sulfuric acid 55? 60 mL/L, hydrogen peroxide 35? 50 mL/L, temperature 30? 45 鈩，

本文編號：2436894