【摘要】：LIGA和準LIGA加工工藝因其具有高深寬比、加工精度高等特點而被廣泛應用于非硅MEMS器件加工中。SU-8膠是準LIGA工藝中常用膠，其表面的平整度直接影響其光刻精度。大尺寸（4T）SU-8厚膠（簡稱：厚膠）因其流動性較差，導致涂膠后表面平整度差，很難滿足準LIGA光刻要求，并且目前關于厚膠整平設備及整平工藝的研究尚處于初級階段。因此，研究厚膠整平工藝技術及裝備具有重要意義和應用前景。本文以SU-8膠作為研究對象，重點開展高精度厚膠整平設備總體技術研究和厚膠整平工藝模擬實驗研究，具體內容如下： （1）首先，對SU-8膠的特性、涂膠后表面問題、厚膠整平需求等進行了分析，并預測了厚膠的切削性能；其次，基于厚膠的平面度要求，提出采用飛刀銑削加工方法實現厚膠表面整平，并分別對加工中可能出現的加工誤差和難點進行預測；最后，綜合考慮整平精度和整平成本，分別對厚膠整平技術和厚膠整平設備性能提出了指標要求，為后續(xù)厚膠整平設備的總體方案研究奠定基礎。 （2）開展了厚膠整平設備的總體技術研究。首先，闡述了飛刀對稱銑削加工原理、飛刀銑削刀具以及加工工藝流程安排；其次，提出了厚膠基片無損夾持方法、厚膠整平設備精度保證方案、設備控制方案、冷卻和潤滑方案；最后對厚膠整平設備的整體結構進行了設計及對關鍵外購件進行選型。 （3）開展了厚膠整平設備關鍵結構設計與優(yōu)化。開展了均布微細吸附力與吸附板優(yōu)化設計，通過有限元建模與計算分析，，獲得無損夾持吸附板的關鍵設計參數，為真空吸附夾具的設計奠定基礎；同時，對整平設備刀盤結構進行優(yōu)化設計和模態(tài)分析。 （4）開展了厚膠整平設備動靜態(tài)特性分析。對兩種方案的設備結構進行模態(tài)分析，給出各階模態(tài)振型和頻率，并對比方案的優(yōu)缺點；對最優(yōu)設備方案進行靜力學分析，研究結構在重力和負荷作用下的靜變形，為設備結構細化設計提供參考和指導。 （5）開展了厚膠整平機加工機理分析并完成厚膠整平模擬實驗。首先，構建飛刀銑削加工切削力模型并對其切削力進行理論計算；其次，建立刀尖相對運動軌跡方程，對飛刀切削加工表面形貌進行了初步探討；最后在現有的高精度車銑復合加工中心上開展厚膠切削模擬實驗，探索刀具、背吃刀量、切削進給速度、主軸轉速對厚膠的表面質量的影響情況，獲得了厚膠的切削優(yōu)化參數。
[Abstract]:LIGA and quasi LIGA processing processes are widely used in non-silicon MEMS devices because of their high aspect ratio and high machining accuracy. SU-8 adhesives are commonly used in quasi-LIGA process, and their surface smoothness directly affects their lithography accuracy. Due to the poor fluidity of large size (4T) SU-8 thick adhesive, it is difficult to meet the requirements of quasi LIGA lithography due to its poor surface smoothness. Therefore, it is of great significance and application prospect to study the technology and equipment of thick glue leveling. In this paper, SU-8 adhesive is taken as the research object, and the overall technology of high precision thick glue leveling equipment and the simulation experiment research of thick glue leveling process are carried out. The specific contents are as follows: (1) first, the characteristics of SU-8 glue are discussed. The surface problems after coating and the requirement of leveling of thick glue were analyzed, and the cutting performance of thick adhesive was predicted. Secondly, based on the flatness requirement of thick rubber, the flying cutter milling method is put forward to realize the surface leveling of thick glue, and the possible machining errors and difficulties in machining are forecasted. Finally, considering the leveling precision and the leveling cost synthetically, the paper puts forward the index requirements for the thick glue leveling technology and the performance of the thick glue leveling equipment respectively, which lays the foundation for the following research of the overall scheme of the thick glue leveling equipment. (2) the overall technology research of thick glue leveling equipment is carried out. Firstly, the principle of symmetrical flying cutter milling, the cutting tool of flying cutter and the arrangement of machining process are described. Secondly, the non-destructive clamping method of thick rubber substrate, the precision assurance scheme of thick glue leveling equipment, the equipment control scheme, cooling and lubrication scheme are put forward. Finally, the overall structure of thick glue leveling equipment is designed and the key parts purchased out are selected. (3) the key structure design and optimization of thick glue leveling equipment are carried out. Through finite element modeling and calculation analysis, the key design parameters of non-destructive clamping adsorption plate were obtained, which laid a foundation for the design of vacuum adsorption fixture. At the same time, the optimization design and modal analysis of the cutter head structure of leveling equipment are carried out. (4) the dynamic and static characteristic analysis of thick glue leveling equipment is carried out. The modal analysis of the equipment structure of the two schemes is carried out, the modes and frequencies of each order are given, and the advantages and disadvantages of the schemes are compared. The static analysis of the optimal equipment scheme is carried out, and the static deformation of the structure under the action of gravity and load is studied, which provides a reference and guidance for the fine design of the equipment structure. (5) the machining mechanism of thick glue leveling machine was analyzed and the simulation experiment of thick glue leveling was completed. Firstly, the cutting force model of flying cutter milling is constructed and its cutting force is calculated theoretically. Secondly, the relative motion trajectory equation of cutter tip is established, and the surface morphology of flying cutter cutting is preliminarily discussed. Finally, the simulation experiment of thick glue cutting is carried out on the existing high precision turn-milling compound machining center, and the influence of cutting tool, back feed rate, cutting speed and spindle speed on the surface quality of thick adhesive is explored. The cutting optimization parameters of thick adhesive are obtained.
【學位授予單位】：北京理工大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TN305.7

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