【摘要】：隨著電子信息產(chǎn)業(yè)的高速發(fā)展,高性能電子封裝裝備成為眾多半導(dǎo)體器件制造企業(yè)的重大需求。我國自主精密電子封裝裝備的研發(fā)有待于在設(shè)計(jì)理論與方法上取得突破。針對高性能封裝裝備在大行程、高速、高加速度運(yùn)動(dòng)與高精度定位的綜合性能指標(biāo)方面的苛刻要求,深入開展其核心關(guān)鍵技術(shù)的創(chuàng)新設(shè)計(jì)與理論研究,提出一種解耦式高速XY并聯(lián)運(yùn)動(dòng)平臺,分析平臺的工作空間及黎曼度量評價(jià)方法;針對高速輕載執(zhí)行機(jī)構(gòu)在其運(yùn)動(dòng)及定位過程中振動(dòng)慣性能快速衰減難題,提出基于慣性能時(shí)空分布最優(yōu)的結(jié)構(gòu)優(yōu)化和運(yùn)動(dòng)規(guī)劃新方法,可有效減少執(zhí)行機(jī)構(gòu)末端和運(yùn)動(dòng)末段的能量聚積,實(shí)現(xiàn)高速運(yùn)動(dòng)條件下的快速精密定位;面向高性能封裝裝備對控制系統(tǒng)的高響應(yīng)速度和精密定位精度需求,提出一種多核多任務(wù)控制器設(shè)計(jì)與驅(qū)控一體化的控制系統(tǒng)方案,可有效提高控制系統(tǒng)的實(shí)時(shí)性、可靠性和協(xié)調(diào)性;同時(shí),開發(fā)高速精密封裝裝備閉環(huán)控制所需的宏微復(fù)合絕對光柵檢測裝置,實(shí)現(xiàn)高速運(yùn)動(dòng)過程執(zhí)行機(jī)構(gòu)位置信息的采集與反饋,保證高速運(yùn)動(dòng)過程的精密定位;同時(shí)研究鍵合工藝過程的劈刀運(yùn)動(dòng)軌跡及鍵合界面的沖擊力影響因素。綜合各項(xiàng)技術(shù)研究成果,成功開發(fā)出高性能引線鍵合機(jī)裝備。
[Abstract]:With the rapid development of electronic information industry, high-performance electronic packaging equipment has become a major demand of many semiconductor device manufacturers. The research and development of autonomous precision electronic packaging equipment in China needs to make a breakthrough in design theory and method. Aiming at the harsh requirements of high performance packaging equipment in the aspects of long stroke, high speed, high acceleration motion and high precision positioning, the innovation design and theoretical research of its core key technology are carried out. A decoupled high-speed XY parallel motion platform is proposed. The workspace of the platform and the Riemann metric evaluation method are analyzed. Aiming at the problem of fast attenuation of inertial energy of high speed light load actuator during its motion and positioning, a new method of structure optimization and motion planning based on the optimal spatial and temporal distribution of inertial energy is proposed. It can effectively reduce the energy accumulation at the end of the actuator and the end of the movement, and realize the fast and precise positioning under the condition of high speed motion. In order to meet the requirement of high response speed and precision positioning precision for high performance packaging equipment, a control system scheme integrating multi-core and multi-task controller design and drive control is proposed, which can effectively improve the real-time performance of the control system. Reliability and coordination; At the same time, the macro and micro composite absolute grating detection device for closed loop control of high speed precision packaging equipment is developed to collect and feedback the position information of the executing mechanism during the high speed motion process, and to ensure the precise positioning of the high speed motion process. At the same time, the moving path of the splitter and the factors affecting the impact force of the bonding interface are studied. Comprehensive technical research results, the successful development of high-performance lead bonding machine equipment.
【作者單位】： 廣東工業(yè)大學(xué)機(jī)械裝備制造與控制技術(shù)教育部重點(diǎn)實(shí)驗(yàn)室;香港科技大學(xué)電子與計(jì)算機(jī)工程系;
【基金】：國家自然科學(xué)基金(51675106,91648108) 廣東省科技計(jì)劃(2015B010104008,2015B010104006) 廣東省自然科學(xué)基金(2015A030312008,2016A03030801)資助項(xiàng)目
【分類號】：TN05

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