【摘要】：TSV(Through-Silicon Vias,硅穿孔)技術(shù)能夠顯著縮小芯片層之間導(dǎo)線的長度,因此其成為了三維集成電路技術(shù)的核心技術(shù)。光TSV兼有光波導(dǎo)和電TSV的優(yōu)點,與電TSV相比,光TSV有著更大的帶寬、更小的寄生效應(yīng)及更強的抗干擾能力。因此,光TSV已經(jīng)成為三維集成技術(shù)的另一個新領(lǐng)域。光TSV中諸如芯層直徑、縱向高度以及光源波長等因素會對光TSV的損耗特性產(chǎn)生顯著影響。另外,光TSV又是基于TSV工藝的,所以TSV工藝會引起的缺陷同樣會影響著光TSV的性能。為了盡可能提高光TSV的集成度,光TSV之間的間距應(yīng)該盡可能的小。但是當光TSV之間的間距縮小的時候,光TSV之間的耦合效應(yīng)也會隨之增大。本文使用RSOFT軟件對光TSV的損耗以及耦合特性開展了研究。在光TSV的損耗特性方面,本文首先開展了光TSV結(jié)構(gòu)參數(shù)及光源波長對損耗特性的影響研究。仿真結(jié)果顯示,光TSV的傳輸損耗隨著芯層直徑的增大而減小,隨著光源波長以及縱向高度的增大而增大。其次,本文開展了不同側(cè)壁條件下光TSV的損耗特性研究。結(jié)果表明,側(cè)壁傾斜程度越高,光TSV傳輸損耗越大,而且損耗程度與入射端面的選擇有關(guān);側(cè)壁粗糙的光TSV的傳輸損耗比側(cè)壁光滑的光TSV的大;對于側(cè)壁是粗糙且傾斜的光TSV來說,側(cè)壁粗糙度相對于側(cè)壁傾斜度來說對光TSV的傳輸損耗的影響更小。在光TSV的耦合特性方面,本文首先開展了相鄰光TSV之間的間距對耦合特性的影響研究。仿真結(jié)果顯示,兩個相鄰光TSV的耦合效應(yīng)隨著它們的空間距離的增大而減小。其次,本文開展了不同側(cè)壁條件下光TSV的耦合特性研究。結(jié)果表明,光滑的光TSV的耦合效應(yīng)比粗糙類型全為凸起和全為凹陷的光TSV都要小;在間距較小時,光滑的光TSV的耦合效應(yīng)比粗糙類型全為凸起和全為凹陷的光TSV要小得多;反向入射的側(cè)壁傾斜的光TSV對相鄰光TSV的耦合效應(yīng)的影響比正向入射的側(cè)壁傾斜的光TSV的大;粗糙類型全為凹陷的光TSV比粗糙類型全為凸起的光TSV對相鄰光TSV具有更大的耦合效應(yīng);正向入射的側(cè)壁粗糙傾斜的光TSV對相鄰光TSV的耦合效應(yīng)比反向入射的側(cè)壁粗糙傾斜的光TSV的大;粗糙的側(cè)壁與正向入射方式的綜合效應(yīng)加大了正向入射的側(cè)壁粗糙傾斜的光TSV對相鄰光TSV的耦合效應(yīng)。
[Abstract]:TSV (Through-Silicon Vias, silicon perforation) technology can significantly reduce the length of wires between chip layers, so it has become the core technology of 3D integrated circuit technology. Optical TSV has the advantages of both optical waveguide and electric TSV. Compared with electric TSV, optical TSV has more bandwidth, less parasitic effect and stronger anti-jamming ability. Therefore, optical TSV has become another new area of 3D integration technology. The loss characteristics of optical TSV are significantly affected by such factors as core diameter, longitudinal height and light source wavelength. In addition, the optical TSV is based on the TSV process, so the defects caused by the TSV process will also affect the performance of the optical TSV. In order to improve the integration of optical TSV as much as possible, the distance between optical TSV should be as small as possible. However, when the spacing between TSV decreases, the coupling effect between optical TSV will increase. In this paper, RSOFT software is used to study the loss and coupling characteristics of optical TSV. In the aspect of loss characteristics of optical TSV, the influence of optical TSV structure parameters and light source wavelength on the loss characteristics is studied in this paper. The simulation results show that the transmission loss of optical TSV decreases with the increase of core diameter and increases with the increase of light source wavelength and longitudinal height. Secondly, the loss characteristics of optical TSV under different side-wall conditions are studied. The results show that the higher the side wall is, the greater the transmission loss of TSV is, and the loss degree is related to the selection of the incident end face, the transmission loss of light TSV with rough side wall is higher than that with smooth side wall light TSV. For the light TSV whose sidewall is rough and inclined, the effect of sidewall roughness on the transmission loss of optical TSV is less than that of sidewall inclination. In terms of the coupling characteristics of optical TSV, the influence of the spacing between adjacent optical TSV on the coupling characteristics is studied in this paper. The simulation results show that the coupling effect of two adjacent TSV decreases with the increase of their spatial distance. Secondly, the coupling characteristics of optical TSV under different side-wall conditions are studied. The results show that the coupling effect of smooth light TSV is smaller than that of rough type light TSV, and the coupling effect of smooth light TSV is much smaller than that of rough type light TSV. The coupling effect of the side-wall tilted TSV on the adjacent light TSV is greater than that of the positive incident side-wall tilted light TSV. The light TSV with the rough type is all concave and has more coupling effect on the adjacent light TSV than the light TSV with the rough type all protruding. The coupling effect of the TSV on the adjacent optical TSV is larger than that of the TSV with the rough oblique side wall on the positive incident side wall, and the coupling effect of the optical TSV on the adjacent optical TSV is larger than that on the side wall with the opposite incidence. The combined effect of the rough side wall and the positive incident mode increases the coupling effect of the coarse oblique optical TSV on the adjacent optical TSV.
【學(xué)位授予單位】：西安電子科技大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN40;TP319

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