混合集成電路氣密性封裝隨機(jī)振動(dòng)仿真及可靠性?xún)?yōu)化設(shè)計(jì)
發(fā)布時(shí)間：2018-11-27 10:43
【摘要】：混合集成電路(Hybrid integrated circuit,HIC)以小體積、高密度、高功率、高可靠性等特點(diǎn)而在宇航和軍用設(shè)備、汽車(chē)電子、家用電器等領(lǐng)域獲得了廣泛應(yīng)用;其中金屬氣密性封裝結(jié)構(gòu)可起到隔絕空氣中的氧氣、水汽及其它腐蝕介質(zhì)的作用;但在HIC金屬氣密性封裝結(jié)構(gòu)服役過(guò)程中,經(jīng)常發(fā)生由于振動(dòng)載荷導(dǎo)致的蓋板開(kāi)裂而引起HIC失效的情況。對(duì)HIC金屬氣密性封裝結(jié)構(gòu)在隨機(jī)振動(dòng)載荷下的失效問(wèn)題,目前國(guó)內(nèi)尚少見(jiàn)相關(guān)研究工作。本文針對(duì)HIC金屬氣密性封裝結(jié)構(gòu)進(jìn)行模態(tài)分析和隨機(jī)振動(dòng)分析,通過(guò)數(shù)值計(jì)算的方法獲得封裝蓋板在給定載荷下的振動(dòng)疲勞壽命,并對(duì)金屬封裝結(jié)構(gòu)進(jìn)行了可靠性?xún)?yōu)化設(shè)計(jì)。本文研究中首先通過(guò)系統(tǒng)查閱相關(guān)資料和測(cè)量樣品尺寸,建立了HIC金屬封裝組件的三維有限元模型,并利用數(shù)值計(jì)算方法完成了對(duì)封裝組件的模態(tài)分析和隨機(jī)振動(dòng)分析;隨后通過(guò)模態(tài)試驗(yàn)和隨機(jī)振動(dòng)試驗(yàn)對(duì)已獲得的模態(tài)數(shù)據(jù)和隨機(jī)振動(dòng)響應(yīng)數(shù)據(jù)進(jìn)行驗(yàn)證;然后在模擬計(jì)算和試驗(yàn)研究獲得數(shù)據(jù)結(jié)果一致的前提下,獲取封裝結(jié)構(gòu)危險(xiǎn)點(diǎn)處的應(yīng)力響應(yīng)功率譜密度(Power spectral density,PSD),利用反傅里葉變換將其轉(zhuǎn)化為時(shí)域的載荷-時(shí)間數(shù)據(jù);最后結(jié)合雨流計(jì)數(shù)法、可伐合金的疲勞曲線(S-N曲線)、Miner線性損傷累積理論完成封裝結(jié)構(gòu)的振動(dòng)疲勞壽命計(jì)算,其中通過(guò)數(shù)值計(jì)算得到的封裝結(jié)構(gòu)在給定振動(dòng)載荷下的疲勞壽命為496小時(shí)。在完成封裝結(jié)構(gòu)的疲勞壽命計(jì)算之后,對(duì)影響其疲勞失效的因素進(jìn)行研究,分別從應(yīng)力集中、構(gòu)件表面狀態(tài)、幾何尺寸、構(gòu)件測(cè)試及服役環(huán)境等方面進(jìn)行分析,并對(duì)蓋板振動(dòng)開(kāi)裂的機(jī)理進(jìn)行探討。封裝結(jié)構(gòu)的抗振可靠性?xún)?yōu)化設(shè)計(jì)主要從兩個(gè)方面進(jìn)行。一是基于平行縫焊的焊縫寬度確定其對(duì)封裝結(jié)構(gòu)第一階模態(tài)固有頻率的影響,計(jì)算結(jié)果表明當(dāng)焊縫寬度超過(guò)臨界值時(shí)可以避免封裝結(jié)構(gòu)在20~2000Hz范圍的振動(dòng)載荷下出現(xiàn)共振;在確定了焊縫臨界寬度值后,可以通過(guò)優(yōu)化平行縫焊工藝來(lái)實(shí)現(xiàn)避免結(jié)構(gòu)共振這一目標(biāo)。優(yōu)化設(shè)計(jì)的另一方面是基于蓋板厚度分布對(duì)封裝結(jié)構(gòu)在振動(dòng)載荷下應(yīng)力響應(yīng)的影響,通過(guò)模擬方法獲得了蓋板厚度分布對(duì)蓋板應(yīng)力響應(yīng)的作用規(guī)律;模擬結(jié)果表明,在滿(mǎn)足工藝條件的前提下應(yīng)盡可能加厚蓋板的邊緣厚度,減薄蓋板的下部厚度,這樣可以有效降低蓋板的應(yīng)力響應(yīng)值,從而減小振動(dòng)應(yīng)力造成的損傷,提高封裝結(jié)構(gòu)在隨機(jī)振動(dòng)載荷下的可靠性。
[Abstract]:Hybrid integrated circuit (Hybrid integrated circuit,HIC) has been widely used in aerospace, military equipment, automotive electronics, home appliances and other fields because of its small volume, high density, high power and high reliability. The metal airtight packaging structure can insulate the oxygen, water vapor and other corrosive media in the air. However, during the service of HIC metal airtight packaging structure, the failure of HIC often occurs due to the crack of the cover plate caused by vibration load. At present, there are few researches on the failure of HIC metal airtight packaging under random vibration load. In this paper, modal analysis and random vibration analysis are carried out for HIC metal airtight packaging structure. The vibration fatigue life of the seal plate under a given load is obtained by numerical calculation, and the reliability optimization design of the metal seal structure is carried out. In this paper, the three-dimensional finite element model of HIC metal packaging assembly is established by consulting the relevant data and measuring the sample size systematically, and the modal analysis and random vibration analysis of the package assembly are completed by using the numerical calculation method. Then the obtained modal data and random vibration response data are verified by modal test and random vibration test. Then the stress response power spectral density (Power spectral density,PSD) at the dangerous point of the package structure is obtained on the premise that the simulation results are consistent with the experimental results, and the time-domain load-time data are transformed by inverse Fourier transform. Finally, the fatigue life of package structure is calculated by), Miner linear damage accumulation theory of S-N curve and rain-flow counting method. The fatigue life of the encapsulated structure under the given vibration load is 496 hours. After the fatigue life calculation of the package structure is finished, the factors that affect the fatigue failure of the package structure are studied, and the stress concentration, the surface state of the component, the geometric dimension, the testing of the component and the service environment are analyzed respectively. The mechanism of vibration cracking of cover plate is discussed. The optimum design of the anti-vibration reliability of the package structure is mainly carried out from two aspects. First, the influence of weld width of parallel seam welding on the first mode natural frequency of packaging structure is determined. The results show that the resonance of package structure under the vibration load of 20~2000Hz range can be avoided when the weld width exceeds the critical value. After determining the critical width of weld, the goal of avoiding structural resonance can be achieved by optimizing the parallel seam welding process. On the other hand, the optimum design is based on the influence of the thickness distribution of the cover plate on the stress response of the package structure under the vibration load. The effect of the thickness distribution of the cover plate on the stress response of the cover plate is obtained by the simulation method. The simulation results show that the edge thickness of the cover plate should be thickened as much as possible and the thickness of the lower part of the cover plate should be thinned under the premise of satisfying the technological conditions, which can effectively reduce the stress response value of the cover plate and reduce the damage caused by vibration stress. The reliability of packaging structure under random vibration load is improved.
【學(xué)位授予單位】：華南理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類(lèi)號(hào)】：TN45
本文編號(hào)：2360469
[Abstract]:Hybrid integrated circuit (Hybrid integrated circuit,HIC) has been widely used in aerospace, military equipment, automotive electronics, home appliances and other fields because of its small volume, high density, high power and high reliability. The metal airtight packaging structure can insulate the oxygen, water vapor and other corrosive media in the air. However, during the service of HIC metal airtight packaging structure, the failure of HIC often occurs due to the crack of the cover plate caused by vibration load. At present, there are few researches on the failure of HIC metal airtight packaging under random vibration load. In this paper, modal analysis and random vibration analysis are carried out for HIC metal airtight packaging structure. The vibration fatigue life of the seal plate under a given load is obtained by numerical calculation, and the reliability optimization design of the metal seal structure is carried out. In this paper, the three-dimensional finite element model of HIC metal packaging assembly is established by consulting the relevant data and measuring the sample size systematically, and the modal analysis and random vibration analysis of the package assembly are completed by using the numerical calculation method. Then the obtained modal data and random vibration response data are verified by modal test and random vibration test. Then the stress response power spectral density (Power spectral density,PSD) at the dangerous point of the package structure is obtained on the premise that the simulation results are consistent with the experimental results, and the time-domain load-time data are transformed by inverse Fourier transform. Finally, the fatigue life of package structure is calculated by), Miner linear damage accumulation theory of S-N curve and rain-flow counting method. The fatigue life of the encapsulated structure under the given vibration load is 496 hours. After the fatigue life calculation of the package structure is finished, the factors that affect the fatigue failure of the package structure are studied, and the stress concentration, the surface state of the component, the geometric dimension, the testing of the component and the service environment are analyzed respectively. The mechanism of vibration cracking of cover plate is discussed. The optimum design of the anti-vibration reliability of the package structure is mainly carried out from two aspects. First, the influence of weld width of parallel seam welding on the first mode natural frequency of packaging structure is determined. The results show that the resonance of package structure under the vibration load of 20~2000Hz range can be avoided when the weld width exceeds the critical value. After determining the critical width of weld, the goal of avoiding structural resonance can be achieved by optimizing the parallel seam welding process. On the other hand, the optimum design is based on the influence of the thickness distribution of the cover plate on the stress response of the package structure under the vibration load. The effect of the thickness distribution of the cover plate on the stress response of the cover plate is obtained by the simulation method. The simulation results show that the edge thickness of the cover plate should be thickened as much as possible and the thickness of the lower part of the cover plate should be thinned under the premise of satisfying the technological conditions, which can effectively reduce the stress response value of the cover plate and reduce the damage caused by vibration stress. The reliability of packaging structure under random vibration load is improved.
【學(xué)位授予單位】：華南理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類(lèi)號(hào)】：TN45
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