基于多層PCB的三維頻率選擇表面研究
發(fā)布時(shí)間：2018-11-21 17:19
【摘要】：頻率選擇表面(Frequency selective surface,FSS)作為一種空間濾波器,對(duì)不同工作頻率、入射角度和極化狀態(tài)的電磁波具有選擇濾波特性,因而廣泛應(yīng)用于天線與微波系統(tǒng)。由于傳統(tǒng)二維FSS諧振方式有限,只能展現(xiàn)較差的選擇濾波性能,越來(lái)越難滿足現(xiàn)代微波與通信系統(tǒng)對(duì)FSS的性能需求。近年來(lái),基于腔體單元結(jié)構(gòu)的三維FSS可產(chǎn)生多模諧振,實(shí)現(xiàn)較好的濾波性能,而受到廣泛關(guān)注。然而,大部分三維FSS結(jié)構(gòu)復(fù)雜、加工難度大,不利于其在高頻段的應(yīng)用。本論文深入研究了一類(lèi)高性能三維FSS的諧振模式和等效電路,并基于傳統(tǒng)多層印刷電路工藝進(jìn)行改進(jìn)設(shè)計(jì)和加工,較大程度上降低了三維FSS設(shè)計(jì)和加工難度,拓寬了三維FSS的應(yīng)用范圍。具體研究?jī)?nèi)容如下:(1)簡(jiǎn)要分析了傳統(tǒng)二維FSS的工作機(jī)理以及等效電路。并以方環(huán)陣列為例,介紹了二維FSS等效電路參數(shù)經(jīng)典提取方法。以此為基礎(chǔ),介紹了三維FSS的廣義等效電路模型。進(jìn)一步以一種層疊微帶線陣列(三維結(jié)構(gòu))為例,詳細(xì)分析了其工作機(jī)理,建立了等效電路模型,研究了一種提取該類(lèi)型三維FSS等效電路參數(shù)的新方法。(2)基于層疊微帶線陣列,設(shè)計(jì)了一個(gè)高選擇性帶通三維FSS。分析了產(chǎn)生高選擇性的工作機(jī)理,建立了等效電路模型,提取了等效電路參數(shù)。進(jìn)一步,基于多層PCB工藝和金屬化過(guò)孔技術(shù),對(duì)該FSS進(jìn)行改進(jìn),使之可工作于K-Ka波段。最后,設(shè)計(jì)加工了一個(gè)工作于25.3GHz的高頻率選擇性FSS,測(cè)試與仿真結(jié)果吻合良好。(3)基于階躍阻抗諧振器(Stepped impedance resonator,SIR),改進(jìn)了層疊微帶線陣列,設(shè)計(jì)了一個(gè)寬阻帶三維FSS。該FSS在低頻(f0=3.9GHz)擁有一個(gè)通帶,S21低于-20d B的帶寬為[2f0-8f0(7.7GHz-32.7GHz)]。建立了該FSS的等效電路模型,提取了等效電路參數(shù)。最后,基于多層PCB工藝對(duì)該FSS改進(jìn)設(shè)計(jì),對(duì)比分析了多層化改進(jìn)前后結(jié)構(gòu)的工作性能。(4)以SIR與均勻阻抗諧振器(Uniform impedance resonator,UIR)為基礎(chǔ),設(shè)計(jì)了一種具有三條傳輸通道的三頻三維FSS。該FSS的每個(gè)工作頻帶都由不同的傳輸通道產(chǎn)生,通帶內(nèi)的傳輸極點(diǎn)也分別由不同的諧振器產(chǎn)生,因此該FSS的工作頻率具有獨(dú)立可控的優(yōu)點(diǎn)。進(jìn)一步,利用多層PCB工藝將三維結(jié)構(gòu)多層化,實(shí)現(xiàn)了基于多層PCB的三頻帶通FSS,大大降低了加工難度。為了實(shí)驗(yàn)驗(yàn)證,設(shè)計(jì)了一個(gè)工作于4、6.8、11.3GHz的三頻FSS,并進(jìn)行了加工測(cè)試,測(cè)試與仿真結(jié)果吻合良好。
[Abstract]:As a spatial filter, FSS (Frequency selective Surface) (Frequency selective surface,FSS) is widely used in antenna and microwave systems because of its selective filtering properties for electromagnetic waves with different operating frequencies, incident angles and polarization states. Due to the limited resonance mode of traditional two-dimensional FSS, it can only exhibit poor selective filtering performance, and it is becoming more and more difficult to meet the performance requirements of FSS in modern microwave and communication systems. In recent years, 3D FSS based on cavity unit structure can generate multi-mode resonance and achieve better filtering performance. However, the structure of most 3D FSS is complex and difficult to process, which is not conducive to its application in high frequency band. In this paper, the resonant mode and equivalent circuit of a kind of high performance 3D FSS are deeply studied, and the design and processing of 3D FSS are improved based on the traditional multi-layer printing circuit technology, which greatly reduces the difficulty of designing and machining 3D FSS. The application range of 3D FSS is widened. The main contents are as follows: (1) the working mechanism and equivalent circuit of traditional two-dimensional FSS are briefly analyzed. Taking square ring array as an example, the classical extraction method of two-dimensional FSS equivalent circuit parameters is introduced. Based on this, the generalized equivalent circuit model of 3D FSS is introduced. Taking a laminated microstrip array (3D structure) as an example, the working mechanism is analyzed in detail, and the equivalent circuit model is established. A new method for extracting the equivalent circuit parameters of this type of 3D FSS is studied. (2) based on the stacked microstrip line array, a highly selective band-pass 3D FSS. is designed. The working mechanism of high selectivity is analyzed, the equivalent circuit model is established and the equivalent circuit parameters are extracted. Furthermore, based on the multilayer PCB process and metallized perforation technology, the FSS is improved to work in the K-Ka band. Finally, a high frequency selective FSS, test based on 25.3GHz is designed and fabricated. (3) based on step impedance resonator (Stepped impedance resonator,SIR), the stacked microstrip array is improved. A wide stopband 3D FSS. is designed. The FSS has a passband at low frequency (f0=3.9GHz), and the bandwidth of S21 below -20dB is [2f0-8f0 (7.7GHz-32.7GHz)]. The equivalent circuit model of the FSS is established and the equivalent circuit parameters are extracted. Finally, the improved design of the FSS based on multilayer PCB process is compared and analyzed. (4) based on SIR and uniform impedance resonator (Uniform impedance resonator,UIR), the performance of the structure before and after the multilayer improvement is compared and analyzed. A three-frequency three-dimensional FSS. with three transmission channels is designed. Each frequency band of the FSS is generated by different transmission channels, and the transmission poles in the passband are generated by different resonators respectively. Therefore, the operating frequency of the FSS has the advantage of independent and controllable. Furthermore, the multi-layer PCB process is used to multilayer the 3D structure, and the three-band pass-through FSS, based on multi-layer PCB is realized, which greatly reduces the processing difficulty. For the purpose of experimental verification, a tri-frequency FSS, working at 46.8GHz and 11.3GHz has been designed and tested. The test results are in good agreement with the simulation results.
【學(xué)位授予單位】：南京郵電大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類(lèi)號(hào)】：TN713
本文編號(hào)：2347678
[Abstract]:As a spatial filter, FSS (Frequency selective Surface) (Frequency selective surface,FSS) is widely used in antenna and microwave systems because of its selective filtering properties for electromagnetic waves with different operating frequencies, incident angles and polarization states. Due to the limited resonance mode of traditional two-dimensional FSS, it can only exhibit poor selective filtering performance, and it is becoming more and more difficult to meet the performance requirements of FSS in modern microwave and communication systems. In recent years, 3D FSS based on cavity unit structure can generate multi-mode resonance and achieve better filtering performance. However, the structure of most 3D FSS is complex and difficult to process, which is not conducive to its application in high frequency band. In this paper, the resonant mode and equivalent circuit of a kind of high performance 3D FSS are deeply studied, and the design and processing of 3D FSS are improved based on the traditional multi-layer printing circuit technology, which greatly reduces the difficulty of designing and machining 3D FSS. The application range of 3D FSS is widened. The main contents are as follows: (1) the working mechanism and equivalent circuit of traditional two-dimensional FSS are briefly analyzed. Taking square ring array as an example, the classical extraction method of two-dimensional FSS equivalent circuit parameters is introduced. Based on this, the generalized equivalent circuit model of 3D FSS is introduced. Taking a laminated microstrip array (3D structure) as an example, the working mechanism is analyzed in detail, and the equivalent circuit model is established. A new method for extracting the equivalent circuit parameters of this type of 3D FSS is studied. (2) based on the stacked microstrip line array, a highly selective band-pass 3D FSS. is designed. The working mechanism of high selectivity is analyzed, the equivalent circuit model is established and the equivalent circuit parameters are extracted. Furthermore, based on the multilayer PCB process and metallized perforation technology, the FSS is improved to work in the K-Ka band. Finally, a high frequency selective FSS, test based on 25.3GHz is designed and fabricated. (3) based on step impedance resonator (Stepped impedance resonator,SIR), the stacked microstrip array is improved. A wide stopband 3D FSS. is designed. The FSS has a passband at low frequency (f0=3.9GHz), and the bandwidth of S21 below -20dB is [2f0-8f0 (7.7GHz-32.7GHz)]. The equivalent circuit model of the FSS is established and the equivalent circuit parameters are extracted. Finally, the improved design of the FSS based on multilayer PCB process is compared and analyzed. (4) based on SIR and uniform impedance resonator (Uniform impedance resonator,UIR), the performance of the structure before and after the multilayer improvement is compared and analyzed. A three-frequency three-dimensional FSS. with three transmission channels is designed. Each frequency band of the FSS is generated by different transmission channels, and the transmission poles in the passband are generated by different resonators respectively. Therefore, the operating frequency of the FSS has the advantage of independent and controllable. Furthermore, the multi-layer PCB process is used to multilayer the 3D structure, and the three-band pass-through FSS, based on multi-layer PCB is realized, which greatly reduces the processing difficulty. For the purpose of experimental verification, a tri-frequency FSS, working at 46.8GHz and 11.3GHz has been designed and tested. The test results are in good agreement with the simulation results.
【學(xué)位授予單位】：南京郵電大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類(lèi)號(hào)】：TN713
【參考文獻(xiàn)】
相關(guān)博士學(xué)位論文 前2條
1 王秀芝;小型化頻率選擇表面研究[D];中國(guó)科學(xué)院研究生院(長(zhǎng)春光學(xué)精密機(jī)械與物理研究所);2014年
2 左鈺;新型三維頻率選擇結(jié)構(gòu)的研究[D];南京大學(xué);2013年
相關(guān)碩士學(xué)位論文 前1條
1 何顯宗;毫米波帶通頻率選擇表面研究[D];長(zhǎng)春理工大學(xué);2008年
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